Fanless mini PCs are industrial grade computing solutions designed and built to withstand deployment in challenging environments to manage workloads for processing, storage, and connectivity. Fanless mini computers are great for deployment in challenging environments because they are passively cooled, utilize solid-state drives, and can be configured using wide temperature range components. All of these key features result in a ruggedized, fanless mini computing solution that has no moving parts and is resistant to dust, dirt, shocks, vibrations, and extreme temperatures.
Shock And Vibration
TPM 2.0 Security
Fanless Mini Computers with SoC
Powerful Processing, I/O Flexibility and Data Telemetry in a Small Size
Fanless mini computers with system on a chip (SoC) CPUs offer lightweight processing and data telemetry for embedded IoT workloads. Unlike socket type architectures, the SoC is physically soldered to the printed circuit board and consolidates multi-core processors, integrated graphics processing units, and high-speed I/O connections without a dedicated PCH. The SoC’s small size and reduced power consumption (up to 15W TDP) is an ideal design architecture for enterprise reliability and low-power performance.
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- Eliminates hardware failure caused by fan
- Forgoes vulnerable ventilation openings
- Extends industrial computer MTBF
- Noiseless operation
- Wide voltage range
- Over voltage protection
- Over current protection
- Reverse protection
The industrial computers’ extended temperature threshold accommodates a vast range of challenging thermal conditions.
I/O Expansion with Modular Kits
- Maximize I/O ports specific to IoT requirements
- Additional I/O options from: COM, USB, LAN, and PoE+
IoT Connectivity Ready
TPM 2.0 Hardware Security Encryptions
Fanless Mini Computer is equipped with TPM 2.0 to safeguard the device, data, and transmissions from malicious actors. TPM 2.0 is an advanced crypto-processor that offers hardware-based protection that is tamper-resistant