Ruggedized Edge AI and Embedded Computing
Powered By NVIDIA Jetson™ Modules
Premio Inc. and NVIDIA
Accelerated Embedded Computing
As a NVIDIA Partner for the embedded compute competency, Premio Inc leverages cutting-edge technology for AI Inference at the edge. This collaboration empowers Premio to push the boundaries of innovation and productization for its portfolio of ruggedized computing hardware in a new age of AI and edge computing.
Key Benefits
Enhanced AI Capabilities: Access to NVIDIA’s cutting-edge Jetson platform and GPU technology, enabling rapid development of AI applications.
Industry-Leading Solutions: Ruggedized Edge AI Computers (JCO Series), EDGEBoost Technology for AI performance acceleration and Rich I/O expansions, and Scalable NVIDIA Jetson Modules
Comprehensive Support: Leveraging NVIDIA’s extensive resources and expertise to ensure customer success and satisfaction.
Faster Time to Market: Capabilities in ODM customization, engineering and turnkey manufacturing for rapid deployment in the USA.
JCO Series: AI Edge Fanless Industrial Computers
Jetson AGX Orin
- Best Edge AI (TOPS) Performance
- Unmatched I/O Configurations
- EDGEBoost I/O Technology
- Certification Ready: UL, FCC, CE
Jetson Orin NX
- Mid-Level Edge AI (TOPS) Performance
- Small Form Factor I/O configuration
- Certification Ready: UL, FCC, CE
Jetson Orin Nano
- Entry-Level Edge AI (TOPS) Performance
- Ultra-Mini fixed I/O configuration
- Certification Ready: UL, FCC, CE
NVIDIA Jetson System on Modules
Jetson AGX Orin Series
High Performance
- Jeton AGX Orin System on Module (32GB/64GB)
- Up to 275 TOPS AI Performance
- Low-Power Configurations (15W and 60W)
Jetson Orin NX Series
Mid Performance
- Jeton NX Orin System on Module (16GB/8GB)
- Up to 100 TOPS AI Performance
- Low-Power Configurations (10W and 25W)
Jetson Orin Nano Series
Entry Performance
- Jeton Nano Orin System on Module (8GB/4GB)
- Up to 40 TOPS AI Performance
- Low-Power Configurations (7W and 15W)
Rugged Fanless
Maximized Expandability
Wide Temperature
Shock And Vibration Resistance
World Class Certifications
3 Scalable Models to Meet Edge AI Workloads
Designed for Edge AI: JCO Series Comparison
 JCO-6000-ORN |
 JCO-3000-ORN |
 JCO-1000-ORN |
||
|---|---|---|---|---|
| System | AI Accelerator | Jetson AGX Orin 64 GB/32GB | Jetson Orin NX 8G/16G or Nano 8G/4G |
Jetson Orin Nano 8G/4G |
| CPU | 8-core/12-core Arm® Cortex®-A78AE v8.2 64-bit CPU | 8-core/6-core Arm® Cortex A78AE v8.2 64-bit CPU | 6-core Arm® Cortex®-A78AE v8.2 64-bit CPU | |
| GPU |
• Jetson AGX Orin 64GB: 2048-core NVIDIA Ampere architecture GPU with 64 Tensor Cores • Jetson AGX Orin 32GB: 1792-core NVIDIA Ampere architecture GPU with 56 Tensor Cores |
• Jetson NX 16GB/8GB: 1024-core NVIDIA Ampere architecture GPU with 32 Tensor Cores • Jetson Orin Nano 8GB/4GB: 512-core NVIDIA Ampere architecture GPU with 16 Tensor Cores |
• Jetson Orin Nano 8GB: 1024-core NVIDIA Ampere architecture GPU with 32 Tensor Cores • Nano 4G: 512-core NVIDIA Ampere architecture GPU with 16 Tensor Cores |
|
| Memory & Storage | System Memory | 32 GB/64 GB LPDDR5 | 16GB/8GB LPDDR5 8GB/4GB LPDDR5 |
8GB/4GB LPDDR5 |
| NVMe | 1x M.2 (M Key, 2242/2260/2280, PCIe x4, Support NVMe | 1x M.2 (M Key, 2242/2260/2280, PCIe x4, Support NVMe | 1x M.2 (M Key, 2242/2260/2280, PCIe x4, Support NVMe | |
| eMMC | 1x eMMC (64 GB) | (-) | (-) | |
| SIM Sockets | 2x Micro SIM Socket (Attached to M.2 B Key ) | 1x External Micro SIM socket (Attached to M.2 B Key) | 1x External Dual Nano SIM socket (Attached to M.2 B Key) |
|
| I/O | Ethernet | Onboard: 2 x RJ45 (1 Gbe, 1x10 GbE) with EBIO: Up to 5 x 10 GbE (RJ45) OR Up to 9 x 1 GbE (RJ45 or M12) |
Onboard: 2 x RJ45 OR 4 x RJ45 |
Onboard: 1x RJ45 |
| PoE | EBIO: can support 4 x RJ45 with optional PoE JCO-6000-ORN-A: up to 4 PoE JCO-6000-ORN-B: up to 12 PoE |
JCO-3000-ORN-B: Up to 4 PoE |
(-) | |
| USB 2.0 | 1 | (-) | 2 | |
| USB 3.0 | On-board: 1x USB 3.2 Gen 2 (10 Gbps, USB 3 Vision Locking Compliant) With EBIO: can support 8 x USB 3 (5 Gbps, 8 dedicate port) |
4 x USB 3.0 (5Gbps) | 2x USB 3.2 Gen 2 (10 Gbps) | |
| Serial | 2x RS-232/422/485 |
2x RS-232/485 (Internal, switch by Jumper) | 2x RS-232/422/485 | |
| CAN | Up to 2 x CAN FD (isolated) | CAN 2.0 A | CAN 2.0 A |
|
| Power Ignition Sensing | Adjustable Power Ignition Management | (-) | (-) | |
| Digital I/O | 8 in / 8 out (Isolated) | 4 in / 4 out (Isolated) | 4 in / 4 out (Isolated) | |
| Video Out | 1 x HDMI 4k (3840 x 2160) 60Hz | 1x HDMI 2K (2560*1440) 60Hz | 1x HDMI 4k (3840 x 2160) 60Hz | |
| GMSL Camera | 2x Quad Port Mini Fakra (8 GMSL) | (-) | (-) | |
| Out-of-Band Managment | Optional 1x RJ45 | Optional 1x RJ45 | (-) | |
| EDGEBoost I/O Expansion | up to 4 EBIO • 4-port GbE module with Intel® I350 Chipset, RJ-45/M12 connector (PoE optional) • 2-Port RJ45 10GbE with Intel X710 Chipset • 4-Port USB 3.0 • 4-Port USB 3.0 (Locking Ports) • 1x M.2 M-Key |
(-) | (-) | |
| Connectivity | Cellular 4G LTE / 5G | 1x M.2 (B Key, 3042/3052, USB 3.2 Gen2, Support 4G/5G Module) |
1x M.2 (B Key, 3042/3052, USB 3.2 Gen1, Support 4G/5G) | 1x M.2 (B Key, 2242/3042/3052, PCIe x1, USB 3.2 Gen1, Support 4G/5G Module) |
| Wi-Fi/BT | 1x M.2 (E Key, 2230, PCIe x1, USB 2.0, Support Wi-Fi/BT) | 1x M.2 (E Key, 2230, PCIe x1, USB 2.0, Support Wi-Fi/Bluetooth) | 1x M.2 (E Key, 2230, PCIe x1, USB 2.0, Support Wi-Fi/Bluetooth) | |
| Antenna | 6x WiFi Antenna Holes | 6x WiFi Antenna Holes | 6x WiFi Antenna Holes | |
| Environmental | Operating Temperature | • -20°C to 55°C (AGX 64G, MaxN Mode at 68 Watt, Non-Throttling) • -20°C to 50°C (AGX 64G, MaxN Mode at 68 Watt, Non-Throttling, With PoE/10G/4U3V Module, full CPU+GPU stressing) |
• -20°C to 55°C (25W, NX Module) • -20°C to 60°C (15W, Nano Module) |
• -25°C to 60°C (15W, Nano Module) |
| Shock & Vibration | Vibration: With SSD: 5 Grms, 5 - 500 Hz, 0.5 hr/axis Shock: With SSD: 50G, half sine, 11ms |
Vibration: With SSD: 5 Grms, 5 - 500 Hz, 0.5 hr/axis Shock: With SSD: 50G, half sine, 11ms |
Vibration: With SSD: 5 Grms, 5 - 500 Hz, 0.5 hr/axis Shock: With SSD: 50G, half sine, 11ms |
|
| Safety | CE, FCC, UL-Listed | CE, FCC, UL-Listed | CE, FCC, UL-Listed | |
| System Cooling | Fanless Cooling | Fanless Cooling | Fanless Cooling | |
| Size | Mechanical Dimensions | 270 (W) x 190 (D) x 95 (H) mm | 192 (W) x 227(D) x 57.6(H) mm | 150 (W) x 105 (D) x 65 (H) mm |
Rugged Edge Webinar:
Defining the Rugged Edge Continuum & Key Features of The JCO Series
Explore how Premio’s JCO Series utilizes NVIDIA Jetson modules and meets the unique challenges of Industry 4.0 at the rugged edge! In this episode, we’ll define the edge continuum and dive deep into the enhanced features of JCO Series, and how it can be widely used in mission-critical deployments.
Markets
Behind NVIDIA Jetson: Understand the Adoption of ARM Architecture
- NVIDIA Jetson Orin modules adopt ARM SoM (System-on-the-Module) Architecture, incorporating CPU, GPU, memory on the same module.
- ARM adopts a RISC (Reduced Instruction Set Computing) philosophy, simplifies hardware design for optimized speed and energy efficiency.
- Allows for low power consumption and less heat generation, aligning with the rugged edge computing demands
- Enhances AI and ML, well suited for AI platforms such as NVIDIA Jetson
Elevated Autonomous Systems Powered by NVIDIA Jetson
By leveraging NVIDIA Jetson, Premio offers cutting-edge solutions for AGV and AMR robotics, ensuring unparalleled performance in the most demanding environments.
- Versatile Edge Computing for AI and machine learning
- Perception with Precision for advanced IoT sensors and cameras
- Streamlined Software Development with NVIDIA Jetpack SDK
Why Premio? Built Rugged. Built Ready.
- 30+ years of extensive design expertise for industrial-grade compute, storage, rich I/O, and high-speed connectivity
- Global turnkey manufacturing and support infrastructure in the USA
- Regulatory testing and compliance for rugged industrial computers
- Long Product Life Cycles to ensure reliability
Frequently Asked Questions (FAQ)
The NVIDIA Jetson platform is a scalable system-on-module (SoM) architecture designed for AI and machine learning at the edge, integrating CPU, GPU, and memory for high-performance AI computing.
- Jetson AGX Orin: Up to 275 TOPS AI performance.
- Jetson Orin NX: Up to 100 TOPS AI performance.
- Jetson Orin Nano: Up to 40 TOPS AI performance.
EDGEBoost I/O Technology enhances data throughput by optimizing I/O configurations in a modular plug and play solution for flexible I/O connectivity to a variety of IoT sensors and peripherals
ARM architecture, with its RISC-based design, simplifies hardware, optimizes processing speed, and reduces power consumption, making it well-suited for edge AI applications.
- Jetson AGX Orin: 15W to 60W.
- Jetson Orin NX: 10W to 25W.
- Jetson Orin Nano: 7W to 15W.
AI applications include autonomous robotics, machine vision, intelligent video analytics, and advanced IoT sensor integration for real-time edge decision-making.
JCO Series NVIDIA Jetson AI Edge Fanless Computers are built to operate in extreme temperatures and resist shock and vibration, ensuring reliable performance in industrial environments.
The NVIDIA Jetpack SDK provides software libraries, tools, and frameworks to facilitate AI and deep learning development on Jetson-powered edge computing systems.
JCO Series edge AI computers are certified for UL, FCC, and CE compliance, ensuring adherence to regulatory standards in various global markets. JCO-6000-ORN is tested and validated for E-Mark and EMC Conformity with EN50155 & EN50121-3-2 as well.
JCO Series NVIDIA Jetson AI Edge Fanless Computers provide real-time AI processing for advanced perception, navigation, and decision-making, enabling AGVs and AMRs to operate autonomously with precision in dynamic environments.