BCO-500-ADL Semi-Rugged Fanless Mini Computer with Intel® Alder lake N97/i3-N305 Processor, 1x DP, 1x HDMI, 4x USB, 2x LAN

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BCO-500-ADL Semi-Rugged Fanless Mini Computer with Intel® Alder lake N97/i3-N305 Processor, 1x DP, 1x HDMI, 4x USB, 2x LAN

  • Support Intel® Alder Lake N97/N305 Processor
  • 1x 262-Pin DDR5 4800MT/s SO-DIMM. Max. up to 16GB
  • Dual Independent Display by 1x Display Port, 1x HDMI
  • 2x Intel® I225-V 2.5GbE LAN
  • 1x M.2 B-Key, 1x M.2 E-Key
  • 2x COM, 4x USB 3.2, 1x Line-out
  • 12 to 36VDC Wide Range Power Input Supporting AT/ATX Mode
  • Wide Operating Temperature -10°C up to 50°C
  • TPM 2.0 Supported
  • CE, FCC Class A, UL, VCCI, RCM
See Datasheet

Model:

BCO-500-ADL

BCO-500-ADL

Certifications:

Intel Partner

Fanless Design

Rich I/O

Wide Temperature

Shock And Vibration
Resistance

TPM 2.0 Security

Intel® NUC Alternative

Leveraging Intel Alder Lake Processors

Leverage the latest x86 silicon from Intel to deliver powerful processing power with low power consumption and efficiency.

Processor Intel Processor N97 Intel i3-N305
Cores 4 8
Max TDP 12W 15W
CPU Max Turbo Frequency 3.60 Ghz 3.80 Ghz
Graphics Max Dynamix Frequency 1.20 Ghz 1.25 Ghz
Intel UHD Graphics 24 EUs 32 EUs

High-speed DDR5 Memory

  • DDR5 4800 MT/s SODIMM
  • Up to 16GB
  • 1.1V Power Voltage Efficiency

Rich IIoT Centric Connectivity

The BCO-500-ADL features comprehensive I/O connectivity on-board within its form factor. The I/O provides seamless integration, compatibility, and performance with various IoT devices and sensors.

Flexible Mounting Capabilities

The BCO-500-ADL supports two standardized industrial mounting configurations: Wall Mount and an optional DIN-Rail mount. This provides enhanced flexibility in many applications where space may be extremely limited.

Wall Mount

DIN-Rail Mount

Industrial Grade Design

  • Fanless, Semi-Rugged Design
  • Wide Operating Temperature: -10°C–50°C
  • MIL-STD-810G Shock & Vibration
  • Wide Power Input: 12-36VDC
* Barebone Pricing Only; Sales team to review component configuration and price

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BCO-500-ADL?

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Specification

System
Processor • 12th Gen Intel® IoTG Alder Lake-N Processor N97, QC, 12W
• 12th Gen Intel® IoTG Alder Lake-N Processor i3-N305, QC, 15W
System Chipset SoC integrated
LAN Chipset 2 x Intel® I225-V 2.5GbE LAN
Audio Codec Realtek ALC897
System Memory 1x 262-Pin DDR5, 4800MHz SO-DIMM, Max. up to 16GB (Non-ECC)
BIOS AMI uEFI BIOS
Watchdog Software Programmable Supports 1~255 sec. System Reset
TPM TPM 2.0
Display
Display Port 1 x DisplayPort 1.4a, Max Resolution 4096 x 2304 @60Hz
HDMI 1 x HDMI 1.4b, Max Resolution 3840 x 2160 @30Hz
Multiple Display 2x Independent Displays
Storage
M.2 B-Key 1 x M.2 B Key (2242/2280/3042, SATA/PCIe x1 support SATA)
Expansion
M.2 1 x M.2 E Key (2230, PCIe x1, USB 2.0 for Wifi/Bluetooth)
I/O
DisplayPort 1x DisplayPort
HDMI 1 x HDMI
COM 2x DB9
COM1: RS232/422/485
COM2: RS232
USB 4x USB 3.2 Gen 2 (10 Gbps)
LAN 2x RJ45 2.5GbE LAN Ports Connectors
Audio 1x Line-out
Others 6x Antenna Holes
1x Power button
1x DC in Power Jack with Lock
Operating System
Windows Windows 10 / Windows 11
Linux Linux kernel
Power
Power Adapter Adapter 60W (optional)
Power Mode AT, ATX (Default ATX)
Power Supply Voltage 12~36VDC
Power Connector DC in Power Jack with Lock
Environment
Operating Temperature N97 CPU: -10°C to 50°C (12W)
i3-N305 CPU: -10°C to 45°C (15W)
Storage Temperature -30°C to 85°C
Relative Humidity 10% to 95% (non-condensing)
Certification CE, FCC Class A, UL, VCCI, RCM
Vibration IEC60068-2-64:2008
With SSD: 5 Grms (5 - 500 Hz, 0.5 hr/axis)
Designed to comply with MIL-STD-810G Method 514.7
Procedure I
Shock IEC60068-2-27:2008
With SSD: 50G half-sin 11ms
Designed to comply with MIL-STD-810G Method 516.7
Procedure I
Physical
Dimensions 225 (W) x 130 (D) x 41 (H) mm
Weights 3KG
Construction Extruded Aluminum with Heavy Duty Metal
Mounting Options Wall Mounting
Din-Rail Mounting (Optional)

Mechanical Layout

Product Dimension

Unit:mm

Resources

Data Sheet DS_BCO-500-ADL_Premio.pdf
User's Manual UM_BCO-500-ADL.pdf