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CT-DAS01 3.5" SBC Industrial Motherboard With Intel® Atom® x7835RE/x7433RE Processors, 2x 2.5GbE LAN, LTE/5G Nano SIM Socket

  • Supports Intel® Atom® x7835RE/x7433RE Processors
  • 1x 262-pin DDR5 4800 SO-DIMM. Max. up to 32GB (Non-ECC)
  • 2x Intel® i226IT 2.5 GbE
  • Triple independent displays supported: DP, HDMI, LVDS or eDP
  • 1x M.2 M key 2280 NVMe, 1x M.2 E key 2230
  • 1x M.2 B key 2242 NVMe/5G, 1x Dual Nano SIM Socket
  • 2x USB 3.2 Gen 2 Type A, 1x USB 3.2 Gen 1 Type A, 1x USB 3.2 Gen 1 Type C, 2x USB 2.0 (Internal)
  • 2x RS-232/422/485, 1x DIO, 2x CAN FD
  • 1x SATA 3.0 (6Gb/s, AHCI), shared with M.2 B-Key (either SATA or M.2 B-key)
  • Watchdog timer 1~255 sec. System reset
  • TPM 2.0 Supported
  • Wide Operating Temperature -40°C to 85°C
  • Wide Voltage DC IN 9~36V
See datasheet

Certifications:

Intel Partner

Intel® Atom® Processor

Wide-Temp Reliability

High-Capacity DDR5

Native CAN FD

Always-Connected I/O

Flexible Expansion

High-Core Intel® Atom® x7000RE Performance

The CT-DAS01 is a rugged 3.5” industrial SBC powered by Intel® Atom® x7835RE / x7433RE (Amston Lake, 2024), delivering up to 8 cores at 3.6 GHz within a low- TDP architecture. Designed for industrial automation, transportation, and edge AI, it enables scalable multi- threaded processing in compact embedded deployments.

DDR5 Memory Support

Supports containerized applications, AI-light inference, and long-term software scalability in modern industrial edge computing environments

  • Up to 32GB DDR5 4800 SO-DIMM
  • High bandwidth memory architecture
  • Optimized for multi-service edge workloads

Native Dual CAN FD Industrial Communication

This industrial motherboard provides deterministic communication for automotive systems, PLC integration, robotics control, and machine connectivity without external adapters.

  • 2x integrated CAN FD
  • 2x RS-232/422/485
  • 4 in / 4 out DIO

5G-Ready Remote Connectivity

Designed for distributed industrial deployments, the CT-DAS01 ensures secure, redundant wired and cellular networking for remote edge systems.

  • 2x 2.5GbE (Intel® i226IT)
  • Dual Nano SIM socket
  • M.2 B-Key support for 4G/5G modules

Wide Temperature Industrial Reliability

This wide-temperature embedded board is engineered for harsh environments including factory automation, transportation systems, and outdoor infrastructure.

  • Operating range: -40°C to 85°C
  • 9–36V DC wide voltage input
  • OVP, OCP, and surge protection
*Barebone Pricing Only; Sales team to review component configuration and price
*Starting At: $400.00

Specifications

System
Processor Standard
• Intel® Atom® x7433RE Processor 6M Cache, up to 3.40 GHz 4 core
Project Based
• Intel® Atom® x7835RE Processor 6M Cache, up to 3.60 GHz 8 core
System Chipset SoC
LAN Chipset GbE1: Intel i226IT 2.5GbE LAN
GbE2: Intel i226IT 2.5GbE LAN
Audio Codec Realtek® ALC888S with Amp 5W
System Memory 1x 262-Pin DDR5 4800 MT/s SO-DIMM. Max. up to 32GB (Non-ECC)
Graphics Intel® UHD Graphics
BIOS AMI uEFI 256MB SPI flash
TPM TPM 2.0
Display
Display Port 1x DP 1.4 up to 4096×2304 @60Hz
HDMI 1x HDMI 2.0b up to 4096 x 2160@60Hz
Multiple Display 1x eDP / 1x LVDS (via shared connector)
Storage
M.2 1x M.2 M Key (2280, PCIe x2) support for NVMe
SSD/HDD 1× SATA 3.0 (6Gb/s, AHCI), shared with M.2 B-Key (either SATA or M.2 B-key)
Expansion
M.2 1x M.2 B Key (2242/3042/3052, PCIe x1, USB 3.0) support for NVMe, 4G/5G Module
1x M.2 E Key (2230, PCIe x1, USB 2.0) support for Wifi/Bluetooth
I/O
LAN 2x 2.5GbE RJ45
SIM 1x Dual Nano SIM Socket
USB 2x USB 3.2 Gen 2 Type A
1x USB 3.2 Gen 1 Type A
1x USB 3.2 Gen 1 Type C
2x USB 2.0 Pin header 3port
Internal I/O
CAN Bus 2x CAN FD
COM 2x RS-232/422/485 Internal
DIO 4 in / 4 out (None Isolated)
OOB Internal header
Others 1x Front Panel con
1x Audio con
Operating System
Windows Windows 10/11
Linux Linux Ubuntu 22.04 / 24.04 LTS
Power
Power Adapter Optional AC/DC 12V/5A, 60W
Power Mode AT, ATX
Power Supply Voltage DC IN 9~36V
Power Connector Micro fit pitch 3.0 2x2 pin
Power Protection OVP (Over Voltage Protection)
OCP (Over Current Protection)
Reverse Protection
Mechanical Environment
Form Factor 3.5" Embedded SBC
Operating Temperature -40°C to 85°C
Storage Temperature -40°C to 85°C
Relative Humidity 10% to 95% (non-condensing)
Certification CE, FCC Class B, UKCA
Physical
Dimensions 146 x 102mm
Weights 0.58kg

Mechanical Layout

Dimensions

Unit:mm

Resources

Datasheet DS_CT-DAS01_Premio.pdf
Product Brief PB_CT-DAS.pdf
User's Manual UM_CT-DAS01.pdf