Comprising of a selection of edge computing building blocks powered by 13th Gen Intel® Core™ processors, the RPL Series delivers remarkable edge-native processing, high-speed I/O connectivity, and industrial-grade reliability at the rugged edge.
12th/13th Gen Intel® Core™ Processor
Dedicated GPU Support
PCIe 4.0/5.0 Expansion
Industrial Grade Ruggedness
IIoT-focused I/O Connectivity
Powering the RPL Series is 13th Gen Intel® Core™ processors utilizing a hybrid P & E core architecture for performance optimization and efficiency. With Intel’s TE models, the RPL Series maintains a low-power efficiency and will be supported under Intel’s embedded roadmap.
24 Cores
Hybrid Architecture
32 Threads
Performance Throughput
15-Years
Support Lifecycle
From an industrial board to fully ruggedized systems, the RPL series caters to a wide range of edge deployment applications. Each RPL Series industrial edge solution is engineered and designed to address specific demand requirements for Industry 4.0 market verticals.
Maximizing performance and durability, the RCO-6000-RPL leverages 13th Gen Intel Core TE processors to streamline high-throughput edge AI workloads. It utilizes EDGEBoost technologies to provide seamless flexibility and configurability for a fully optimized solution.
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Perfectly balancing performance, connectivity, and size. The RCO-3000 Series combines rich IoT connectivity on-board, industrial-grade durability, EBIO scalability, and integrates a powerful socket-type CPU within a small form factor. The RCO-3000 Series is highlighted in intelligent security and surveillance, factory automation, and disaster management deployments.
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Supported by 13th Gen Intel TE Processors, the BCO-6000-RPL brings high performance for real time edge AI and IoT workloads. Leveraging additional Gen 4 PCIe expansion accelerates edge performance with GPU integration.
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Balanced footprint with socket-type performance, rich IoT connectivity, and rugged reliability. The BCO-3000-RPL is a small form factor industrial computer delivering necessary power performance for real-time workloads.
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Ultra compact and low power for streamlined processing power and efficiency. The BCO-1000-ADLN is the industrial alternative to the Intel NUC in a fanless, semi-rugged design for embedded longevity.
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Enable real-time vision AI deployment applications on-premises with the VCO-6000-RPL, powered by a 13th Gen Intel Core TE processor. Enhance in-line assembly and production workflows with ultra-low latency for actionable insights and predictive analytics.
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This industrial GPU computer offers a COTS approach for rapid time-to-market while delivering maximized edge AI performance with dual-GPU support. Unlike the VCO, the KCO-3000-RPL is only compatible with mid-sized GPUs up to 8.5” (215.9mm) or smaller.
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Purpose-built to seamlessly integrate into existing or new OEM/ODM systems for speedier time-to-market. Leveraging its small form factor, this industrial GPU computer can manage edge AI applications with support for a low-profile GPU.
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The latest in industrial building blocks for high-performance systems. With scalable PCIe, M.2 options, and robust connectivity.
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Our latest lineup of Single Board Computers (SBC) is engineered to set a new standard in integrated single-board solutions, by offering blazing-fast performance, robust reliability, and versatile functionality for a variety of demanding applications.
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Real-time AI inferencing and machine vision applications are enabled through the use of performance accelerators, primarily GPUs. The RPL Series leverage PCIe x16 Gen 4/5 slots to integrate enterprise-grade GPU acceleration for an optimized balance of performance, power, and reliability for the rugged deployments.
NVIDIA RTX A2000
NVIDIA RTX A4000
NVIDIA T1000
NVIDIA RTX 4070
NVIDIA RTX 4000SFF
| Processor | System Cooling | Expansion Options | Operating Temp. | Shock & Vibration | Certifications | ||
| Extremely Rugged. EDGEBoost Technology. Scalable Sizes | |||||||
RCO-6000-RPL AI Edge Inference Computer |
12/13th Gen Intel® Core i3/i5/i7/i9 TE Processors (35W TDP) | Passive Cooling (Fanless) | - PCIe Gen 4 Expansion - Low-profile GPU - EDGEBoost Nodes - EDGEBoost I/O - Up to 8x Hot-Swappable SATA/NVMe SSDs |
-25°C to 70°C | With HDD: 1 Grms With SSD: 5 Grms / 20G IEC60068-2-64:2008 Designed to comply with MIL-STD-810H Method 514.8 Procedure I |
UL 62368 Ed. 3, CE, FCC Class A | See RCO-6000-RPL |
RCO-3000-RPL Small Form Factor Computer |
12/13th Gen Intel® Core i3/i5/i7/i9 TE Processors (35W TDP) | Passive Cooling (Fanless) | - Up to 4x HAILO-8 AI Accelerators - EDGEBoost I/O -1x Hot-swappable SATA SSD |
-25°C to 70°C | With HDD: 1 Grms With SSD: 5 Grms / 50G IEC60068-2-64:2008 Designed to comply with MIL-STD-810H Method 514.8 Procedure I |
UL 62368 Ed. 3, CE, FCC Class A | See RCO-3000-RPL |
| Semi-Rugged. Performance Focused. Scalable Sizes | |||||||
BCO-6000-RPL Industrial Computer |
12/13th Gen Intel® Core i3/i5/i7/i9 TE Processors (35W TDP) | Passive Cooling (Fanned w/ GPU) | - PCIe Gen4 Expansion -Low Profile GPU |
0°C to 50°C | - IEC60068-2-64:2008 With SSD: 5 Grms (5 - 500 Hz, 0.5 hr/axis) Designed to comply with MIL-STD-810H Method 514.8 Procedure I - IEC60068-2-27:2008 With SSD: 50G half-sin 11ms Designed to comply with MIL-STD-810H Method 514.8 Procedure I |
UL 62368 Ed. 3, CE, FCC | See BCO-6000-RPL |
BCO-3000-RPL Small Form Factor Computer |
12/13th Gen Intel® Core i3/i5/i7/i9 TE. Pentium, Celeron Processors (35W TDP) | Fanless Cooling | - | 0°C to 50°C | - IEC60068-2-64:2008 With SSD: 5 Grms (5 - 500 Hz, 0.5 hr/axis) Designed to comply with MIL-STD-810H Method 514.8 Procedure I - IEC60068-2-27:2008 With SSD: 50G half-sin 11ms Designed to comply with MIL-STD-810H Method 514.8 Procedure I |
UL 62368 Ed. 3, CE, FCC | See BCO-3000-RPL |
BCO-1000-ADLN Fanless Mini Computer |
12th Gen Intel® IoTG Alder Lake-N Processor N97 (12W TDP) | Fanless Cooling | - | 0°C to 50°C | - IEC60068-2-64:2008 With SSD: 5 Grms (5 - 500 Hz, 0.5 hr/axis) Designed to comply with MIL-STD-810H Method 514.8 Procedure I - IEC60068-2-27:2008 With SSD: 50G half-sin 11ms Designed to comply with MIL-STD-810H Method 514.8 Procedure I |
UL (Pending), CE, FCC | See BCO-1000-ADLN |
| Specialized Computers | |||||||
VCO-6000-RPL Machine Vision Computer |
12th/13th Gen Intel® Core™ i9/i7/i5/i3 TE Processor (35W TDP) | Active Cooling | - PCIe Gen 4 Expansion - Dual-GPU (FHFL) - Up to 4x Hot-Swappable SATA/NVMe SSDs |
-25°C to 70°C | With HDD: 1 Grms With SSD: 3 Grms / 50G IEC60068-2-64:2008 Designed to comply with MIL-STD-810H Method 514.8 Procedure I |
UL 62368 Ed. 3, CE, FCC Class A | See VCO-6000-RPL |
KCO-2000-RPL 2U Industrial Fanned Computer |
12th/13th Gen Intel® Core™ i9/i7/i5/i3 TE Processor (35W TDP) | Active Cooling | - PCIe Gen 5 Expansion - Low-profile GPU - 1x Hot-swappable SATA SSD |
0°C to 60°C | 1 Grms With SSD: 25G |
UL 62368 Ed. 3, CE, FCC | See KCO-2000-RPL |
KCO-3000-RPL 3U Industrial Fanned Computer |
12th/13th Gen Intel® Core™ i9/i7/i5/i3 TE Processor (35W TDP) | Active Cooling | - PCIe Gen 5 Expansion - Dual-GPU |
0°C to 60°C | 1 Grms With SSD: 25G |
UL 62368 Ed. 3, CE, FCC | See KCO-3000-RPL |
| Board-Level Building Blocks | |||||||
CT-MRL01 Industrial mATX Motherboard |
12th/13th Gen Intel® Core™ i9/i7/i5/i3 TE Processor (35W TDP) | - | - PCIe Gen 5 Expansion - Dual-GPU (FHFL) |
0°C to 60°C | - | CE, FCC Class B | See CT-MRL01 |
CT-DAL01 3.5" SBC Industrial Motherboard |
12th Gen Intel® IoTG Alder Lake-N Processor N97 (12W TDP) | - | On-Board Expansion Capability: Serial Communication, GPIO, USB, and M.2 |
-10°C to 60°C | - | CE, FCC Class A | See CT-DAL01 |
The RPL Series offers superior edge-native processing, high-speed I/O connectivity, and industrial-grade ruggedness. Powered by 13th Gen Intel Core processors, these industrial computers enhance performance while maintaining the same size as the 12th Gen Intel processor. It utilizes Intel’s hybrid performance architecture with powerful P-cores for single-threaded AI performance and E-cores ideal for multitasking efficiency. This allows the RPL Series to leverage the latest processor for high performance compute while maintaining the same form factors.
The hybrid P & E core architecture of 13th Gen Intel Core processors balances power and efficiency, making the RPL Series ideal for edge AI tasks. This architecture supports key features such as DDR5 memory and PCIe x16 Gen 5 slots, enabling seamless integration with industrial-focused GPUs for demanding edge AI workloads including machine vision.
Designed for the rugged edge, the RPL Series delivers industrial-grade durability with a fanless and cableless construction. It withstands extreme temperatures, dust, and vibration, ensuring reliable performance in harsh conditions, crucial for IIoT and other industrial applications. By selecting the 13th Gen Intel Core TE processors, it delivers low-power efficiency of 35W TDP and follows Intel’s embedded 10-year product support lifecycle roadmap.
Most of the RPL Series is equipped with PCIe x16 Gen 4/5 slots, with capabilities to support a GPU for edge AI inferencing. This allows real-time AI processing and machine vision tasks to be handled efficiently at the edge, perfect for automated systems and smart manufacturing.
Yes, the RPL Series includes a range of rugged edge computers designed to meet specific deployment needs. From size to support for EDGEBoost technologies, these high-performance systems offer a customizable approach to flexible I/O options, GPU acceleration, and versatile storage for tailored performance requirements.
Some of the rugged edge systems in the RPL Series features EDGEBoost technologies. This allows for a modular approach to performance acceleration in both I/O scalability and performance acceleration. By remaining modular, the system can be easily upgraded and tailored to evolving demands.
The RPL Series is built to last, with up to a 10-year support lifecycle for its 13th Gen Intel Core processors. This extended support guarantees long-term stability and reliability, a crucial factor for industrial projects requiring sustained performance.
The RPL Series is versatile and can handle a range of edge computing applications, including AI inference, machine vision, industrial automation, and smart manufacturing. Its rugged design and high-performance capabilities make it ideal for any demanding Industry 4.0 application.
The RPL Series comes with IIoT-focused I/O connectivity, including multiple high-speed interfaces like LAN and USB while also supporting COM ports for legacy machinery. The systems that support EDGEBoost I/O technology deliver an even greater range of IIoT connectivity with mix-and-match I/O modules to meet high-specification deployments.
Since there is no one-size-fits-all solution for edge computing, each RPL Series model is meticulously engineered for specific deployment applications. For instance, the RCO-6000-RPL is optimized for high-specification edge AI workloads by leveraging EDGEBoost technologies, while the VCO-6000-RPL supports dual-GPU configurations for resource-intensive machine vision.
