RPL Series: Building Blocks for the Rugged Edge
Comprising of a selection of edge computing building blocks powered by 13th Gen Intel® Core™ processors, the RPL Series delivers remarkable edge-native processing, high-speed I/O connectivity, and industrial-grade reliability at the rugged edge.
12th/13th Gen Intel® Core™ Processor
Dedicated GPU Support
PCIe 4.0/5.0 Expansion
Industrial Grade Ruggedness
IIoT-focused I/O Connectivity
Enhanced Edge AI Performance with 13th Gen Intel® Core™ Processors
Powering the RPL Series is 13th Gen Intel® Core™ processors utilizing a hybrid P & E core architecture for performance optimization and efficiency. With Intel’s TE models, the RPL Series maintains a low-power efficiency and will be supported under Intel’s embedded roadmap.
24 Cores
Hybrid Architecture
32 Threads
Performance Throughput
15-Years
Support Lifecycle
Specific Edge Computers for Specific Edge Deployments
From an industrial board to fully ruggedized systems, the RPL series caters to a wide range of edge deployment applications. Each RPL Series industrial edge solution is engineered and designed to address specific demand requirements for Industry 4.0 market verticals.
RCO-6000-RPL Series: High-Performance Rugged Edge Computer
Low-Profile GPU Support
Maximizing performance and durability, the RCO-6000-RPL leverages 13th Gen Intel Core TE processors to streamline high-throughput edge AI workloads. It utilizes EDGEBoost technologies to provide seamless flexibility and configurability for a fully optimized solution.
Key Features:
- DDR5 Memory
- PCIe 4.0 (Low-profile GPU Support)
- Modular EDGEBoost Technologies
Key Applications:
- People & Vehicle Counting
- Traffic Flow Analysis
- Middle-Mile Delivery
BCO-6000-RPL Series: High Performance Industrial Computer
Low Profile GPU Support
Supported by 13th Gen Intel TE Processors, the BCO-6000-RPL brings high performance for real time edge AI and IoT workloads. Leveraging additional Gen 4 PCIe expansion accelerates edge performance with GPU integration.
Key Features:
- PCIe 4.0 Expansion (Low-profile GPU Support)
- Rich, High Speed I/O
- Edge AI Ready
Key Applications:
- Industrial Automation & Robotics
- Rugged Edge AI
- IIoT Gateway
BCO-3000-RPL Series: Small Form Factor Industrial Computer
Balanced footprint with socket-type performance, rich IoT connectivity, and rugged reliability. The BCO-3000-RPL is a small form factor industrial computer delivering necessary power performance for real-time workloads.
Key Features:
- Small Form Factor Design
- Rich, High Speed I/O
- Edge AI Ready
Key Applications:
- Industrial Automation & Robotics
- Rugged Edge AI
- IIoT Gateway
BCO-1000-ADLN Series: Fanless Mini Industrial Computer
Ultra compact and low power for streamlined processing power and efficiency. The BCO-1000-ADLN is the industrial alternative to the Intel NUC in a fanless, semi-rugged design for embedded longevity.
Key Features:
- Ultra Compact Form Factor
- Intel NUC Alternative
- DDR5 Memory
Key Applications:
- Industrial Automation & Robotics
- Rugged Edge AI
- IIoT Gateway
VCO-6000-RPL Series: Machine Vision Computer
Dual-GPU Support (Full-Height, Full-Length)
Enable real-time vision AI deployment applications on-premises with the VCO-6000-RPL, powered by a 13th Gen Intel Core TE processor. Enhance in-line assembly and production workflows with ultra-low latency for actionable insights and predictive analytics.
Key Features:
- Dual-GPU (FHFL)
- PCIe Gen 4
- Hot-swappable NVMe Storage Bays
Key Applications:
- Quality & Defect Detection
- Predictive Maintenance
- Digital Twin & Sensor Fusion
KCO-3000-RPL Series: 3U Fanned Industrial Computer
Dual-GPU Support
This industrial GPU computer offers a COTS approach for rapid time-to-market while delivering maximized edge AI performance with dual-GPU support. Unlike the VCO, the KCO-3000-RPL is only compatible with mid-sized GPUs up to 8.5” (215.9mm) or smaller.
Key Features:
- 3U Rackmount Chassis
- On-board NVMe
- Dual GPU Support (PCIe Gen 5)
Key Applications:
- Industrial Automation Robotics
- Anomaly Detection & Monitoring
- Predictive Maintenance
KCO-2000-RPL Series: 2U Fanned Industrial Computer
Low-Profile GPU Support
Purpose-built to seamlessly integrate into existing or new OEM/ODM systems for speedier time-to-market. Leveraging its small form factor, this industrial GPU computer can manage edge AI applications with support for a low-profile GPU.
Key Features:
- 2U Short Depth Chassis
- On-board NVMe
- PCIe Gen 5 (Low-profile GPU Support)
Key Applications:
- Industrial Automation Robotics
- Quality & Defect Detection
- Predictive Maintenance
CT-MRL01: Industrial MicroATX Motherboard
The latest in industrial building blocks for high-performance systems. With scalable PCIe, M.2 options, and robust connectivity.
Key Features:
- 4x 4K Displays
- 20Gbps USB Type-C
- PCIe x16 Gen 5
Key Applications:
- Embedded Systems
- Network and Communication
- Industrial Control and Monitoring
CT-DAL01 3.5" SBC Industrial Motherboard
Our latest lineup of Single Board Computers (SBC) is engineered to set a new standard in integrated single-board solutions, by offering blazing-fast performance, robust reliability, and versatile functionality for a variety of demanding applications.
Key Features:
- DDR5 Memory
- Diverse I/O Modules
- Triple Independent Display
Key Applications:
- Embedded Systems
- Network and Communication
- Industrial Control and Monitoring
Edge AI Ready for Inference
Real-time AI inferencing and machine vision applications are enabled through the use of performance accelerators, primarily GPUs. The RPL Series leverage PCIe x16 Gen 4/5 slots to integrate enterprise-grade GPU acceleration for an optimized balance of performance, power, and reliability for the rugged deployments.
- - PCIe x16 Slots Gen 4/Gen 5
- - Low-Profile & FHFL Enterprise GPU Acceleration
- - Dual-GPU Configurations
NVIDIA RTX A2000
NVIDIA RTX A4000
NVIDIA T1000
NVIDIA RTX 4070
NVIDIA RTX 4000SFF
Comparing The RPL Series
Processor | System Cooling | Expansion Options | Operating Temp. | Shock & Vibration | Certifications | ||
Extremely Rugged. EDGEBoost Technology. Scalable Sizes | |||||||
![]() AI Edge Inference Computer |
12/13th Gen Intel® Core i3/i5/i7/i9 TE Processors (35W TDP) | Passive Cooling (Fanless) | - PCIe Gen 4 Expansion - Low-profile GPU - EDGEBoost Nodes - EDGEBoost I/O - Up to 8x Hot-Swappable SATA/NVMe SSDs |
-25°C to 70°C | With HDD: 1 Grms With SSD: 5 Grms / 20G IEC60068-2-64:2008 Designed to comply with MIL-STD-810G Method 514.7 Procedure I |
UL 62368 Ed. 3, CE, FCC Class A | See RCO-6000-RPL |
Semi-Rugged. Performance Focused. Scalable Sizes | |||||||
![]() Industrial Computer |
12/13th Gen Intel® Core i3/i5/i7/i9 TE Processors (35W TDP) | Passive Cooling (Fanned w/ GPU) |
- PCIe Gen4 Expansion -Low Profile GPU |
0°C to 50°C |
- IEC60068-2-64:2008 With SSD: 5 Grms (5 - 500 Hz, 0.5 hr/axis) Designed to comply with MIL-STD-810G Method 514.7 Procedure I - IEC60068-2-27:2008 With SSD: 50G half-sin 11ms Designed to comply with MIL-STD-810G Method 514.7 Procedure I |
UL (Pending), CE, FCC | See BCO-6000-RPL |
![]() Small Form Factor Computer |
12/13th Gen Intel® Core i3/i5/i7/i9 TE. Pentium, Celeron Processors (35W TDP) | Fanless Cooling | - | 0°C to 50°C |
- IEC60068-2-64:2008 With SSD: 5 Grms (5 - 500 Hz, 0.5 hr/axis) Designed to comply with MIL-STD-810G Method 514.7 Procedure I - IEC60068-2-27:2008 With SSD: 50G half-sin 11ms Designed to comply with MIL-STD-810G Method 514.7 Procedure I |
UL (Pending), CE, FCC | See BCO-3000-RPL |
![]() Fanless Mini Computer |
12th Gen Intel® IoTG Alder Lake-N Processor N97 (12W TDP) | Fanless Cooling | - | 0°C to 50°C |
- IEC60068-2-64:2008 With SSD: 5 Grms (5 - 500 Hz, 0.5 hr/axis) Designed to comply with MIL-STD-810G Method 514.7 Procedure I - IEC60068-2-27:2008 With SSD: 50G half-sin 11ms Designed to comply with MIL-STD-810G Method 514.7 Procedure I |
UL (Pending), CE, FCC | See BCO-1000-ADLN |
Specialized Computers | |||||||
![]() Machine Vision Computer |
12th/13th Gen Intel® Core™ i9/i7/i5/i3 TE Processor (35W TDP) | Active Cooling | - PCIe Gen 4 Expansion - Dual-GPU (FHFL) - Up to 4x Hot-Swappable SATA/NVMe SSDs |
-25°C to 70°C | With HDD: 1 Grms With SSD: 3 Grms / 50G IEC60068-2-64:2008 Designed to comply with MIL-STD-810G Method 514.7 Procedure I |
UL 62368 Ed. 3, CE, FCC Class A | See VCO-6000-RPL |
![]() 2U Industrial Fanned Computer |
12th/13th Gen Intel® Core™ i9/i7/i5/i3 TE Processor (35W TDP) | Active Cooling | - PCIe Gen 5 Expansion - Low-profile GPU - 1x Hot-swappable SATA SSD |
0°C to 60°C | 1 Grms With SSD: 25G |
UL (Pending), CE, FCC | See KCO-2000-RPL |
![]() 3U Industrial Fanned Computer |
12th/13th Gen Intel® Core™ i9/i7/i5/i3 TE Processor (35W TDP) | Active Cooling | - PCIe Gen 5 Expansion - Dual-GPU |
0°C to 60°C | 1 Grms With SSD: 25G |
UL (Pending), CE, FCC | See KCO-3000-RPL |
Board-Level Building Blocks | |||||||
![]() Industrial mATX Motherboard |
12th/13th Gen Intel® Core™ i9/i7/i5/i3 TE Processor (35W TDP) | - | - PCIe Gen 5 Expansion - Dual-GPU (FHFL) |
0°C to 60°C | - | CE, FCC Class B | See CT-MRL01 |
![]() 3.5" SBC Industrial Motherboard |
12th Gen Intel® IoTG Alder Lake-N Processor N97 (12W TDP) | - | On-Board Expansion Capability: Serial Communication, GPIO, USB, and M.2 |
-10°C to 60°C | - | CE, FCC Class A | See CT-DAL01 |
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