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RCO-6000-RPL-4N-1E AI Edge Inference Computer w/ LGA 1700 for Intel 12/13th Gen CPU & R680E PCH, 4 Bay U.2 7mm NVMe, 1x PCIe Expansion, Hardware RAID Option

RCO-6000-RPL-4NS AI Edge Inference Computer w/ LGA 1700 for Intel 12/13th Gen CPU & R680E PCH, 4x U.2 15mm NVMe, Software RAID

  • LGA 1700 socket for 12/13th Gen. Intel® ADL & RPL Processor (35W TDP)
  • Intel® R680E Chipset
  • 2x DDR5 4800/5600MHz SODIMM. Max. up to 64GB
  • Triple Independent Display: 2x DisplayPort, 1x DVI-I
  • 2x Intel® 2.5 GbE supporting Wake-on-LAN and PXE
  • 1x Full-size Mini PCIe for communication or expansion modules, 2x SIM socket
  • 4x 15mm Hot-swappable U.2 NVMe SSD Module with RAID 0, 1, 5, 10
  • 1x 9mm 2.5" SATA SSD (Internal), 1x 7mm 2.5" SATA SSD (Hot-swap)
  • 1x M.2 (E Key, PCIe x1, USB 2.0, 2230)
  • 1x M.2 (B Key, 2242/3042/3052, PCIe x2, Support AI Module/NVMe Storage, PCIe x1 & USB 3.2 Gen1, Support 4G/5G)
  • 6x RS-232/422/485 (4x internal), 8x USB 3.2 Gen 2, 1x USB 3.2 Gen 1 (internal)
  • 9 to 48VDC Wide Range Power Input Supporting AT/ATX Mode
  • Wide Operating Temperature -25°C to 60°C (35W CPU)
  • TPM 2.0 Supported
See Datasheet

Certifications:

Intel Partner
 

12th/13th Gen Intel® Core™ Processor

NVMe/SATA SSDs

DDR5 RAM

PCIe 4.0 Expansion

AI Acceleration

MIL-STD-810G Shock and Vibration

Edge Workload Ready:
Intel® 13th Gen Hybrid P & E Cores

  • Intel® Core™ i3/i5/i7/i9 Core TE Processors (35W TDP)
  • Up to 24 Cores (8 P-Cores, 16 E-Cores)
  • Up to 32 Threads
  • Additional L2 & L3 Cache

DDR5 Speed for Volatile Workloads

  • 2x DDR5 4800/5600MHz SODIMM
  • ECC & Non-ECC Supported

EDGEBoost I/O: Flexible IoT Connectivity

  • PoE Support
  • M12 Connection
  • M.2 Performance Acceleration (5G/NVMe/AI)

EDGEBoost Nodes: Optimized Performance Acceleration

  • PCIe Expansion
  • Dedicated GPU Acceleration
  • Hot-swappable NVMe/SATA Storage

Edge AI Computer Vision Powerhouse

  • PCIe Gen 4.0
  • Tested & Validated GPU List
  • Scalable up to x3 Hailo-8 AI Modules

Hot-swappable High-Capacity SATA

  • Removable 2.5” SATA SSD Bay

Automation Ready with Isolated DIO

  • On-board DIO (8 in/8 out, Isolated)

Certified by UL Solutions

For additional re-assurance in product quality and safety, this edge computer has earned the UL Certified Mark for ultimate reliability when operating in extreme industrial deployments.
• UL Listed (I.T.E E357184)

 

Built Rugged. Built Ready.

  • Wide Operating Temp. (-25°C to 70°C)
  • Shock & Vibration Resistant (MIL-STD-810G Compliant)
  • Wide Power Input (9~48VDC)
* Barebone Pricing Only; Sales team to review component configuration and price
*Starting At: $2,867.00

Specification

System
Processor Support 12/13th Gen Intel® ADL & RPL Processor (LGA 1700, 35W TDP)
- Intel® Core™ i9-13900TE/i9-12900TE, up to 24 Cores, 36MB Cache, up to 5 GHz, 35W
- Intel® Core™ i7-13700TE/i7-12700TE, up to 16 Cores, 30MB cache, up to 4.8 GHz, 35W
- Intel® Core™ i5-13500TE/i5-12500TE, up to 14 Core, 24MB Cache, up to 4.5 GHz, 35W
- Intel® Core™ i3-13100TE/i3-12100TE, up to 4 Cores, 12MB Cache, up to 4.1 GHz, 35W
System Chipset Intel® R680E Express Chipset
LAN Chipset 2.5 GbE1: Intel I226, 2.5 GbE2: Intel I226
Support Wake-on-LAN and PXE, Support TSN
Audio Codec Realtek ALC888S
System Memory 2x 262-Pin DDR5 4800/5600MHz SODIMM.

Max. up to 64GB (ECC and Non-ECC)
Graphics Intel® UHD Graphics 770/710
BIOS AMI 256Mbit SPI BIOS
Watchdog Software Programmable Supports 1~255 sec. System Reset
AI Accelerator Supports 3x Hailo-8™ modules
TPM TPM 2.0
Display
Display Port 2x DisplayPort, Support resolution 5120 x 3200,
Up to 7680 x 4320
DVI 1x DVI-I, support resolution 1920 x 1200
VGA Yes (by optional split cable)
Multiple Display Triple Display
Storage
M.2 1x M.2 B Key, 2242/3042/3052
(PCIe x2, Support AI Module/NVMe Storage)
(PCIe x1 & USB 3.2 Gen1, Support 4G/5G)
mSATA 1x mSATA (Shared by 1x Mini PCI Express)
NVMe 2x Removable Cannister Bricks with 2.5" 4 Bay U.2 NVMe SSD
(Support H=15mm) with Software RAID 0, 1, 5, 10
SIM Socket 2x External SIM socket (Mini PCIE/M.2 B Key attached)
SSD/HDD 1x 9mm 2.5" SATA HDD Bay (Internal)
1x 7mm 2.5" SATA HDD Bay (Hot-swappable)
4x 15mm 2.5" NVMe SSD Bay (Hot-swappable)
Support RAID 0, 1, 5, 10
Expansion
M.2 1x M.2 (E Key, PCIe x1, USB 2.0, 2230)
Mini PCIe 1x Full-size Mini PCIe (1x shared by 1x mSATA)
Expansion Modules 2x EDGEBoost I/O Brackets:
• 4-port GbE module with Intel® I350 Chipset, RJ-45/M12 connector (PoE optional)
• 2-Port RJ45 10GbE with Intel X710 Chipset
• 4-Port USB 3.0 (share PCIe Gen2 x1 bandwidth)
• 1x M.2 B-Key, 2242 for AI/NVMe, 1x M.2 B-Key, 3042/3052 for 5G/AI/NVMe
• 1x M.2 M-Key, PCIe x4 Lane, 2242/2260 for AI Module/NVMe
• 1x M.2 for 5G (B Key, PCIe x1, USB 3.0, 3042/3052), 2x SIM socket, 1x SIM switch
I/O
Audio 1x Mic-in, 1x Line-out
CAN 2x CAN 2.0 A/B 2-pin Internal header
COM 2x RS-232/422/485 ; 4x RS-232/422/485 (Internal)
DIO 8 in / 8 out (Isolated)
EDGEBoost I/O Bracket 2x EDGEBoost I/O Bracket (By mini PCIe interface)
LAN 2x RJ45
USB 8x USB 3.2 Gen 2 (10 Gbps)
1x USB 3.2 Gen 1 (5 Gbps, 1x Internal), 2x USB 2.0 (Internal)
Others 5x WiFi Antenna Holes
1x Power Switch, 1x AT/ATX Switch, 1x Remote Power On/Off
1x PC/Car Mode Switch, 1x Delay Time Switch
1x Removable CMOS Battery
Operating System
Windows Windows 10/11
Linux Linux kernel
Power
Power Adapter Optional AC/DC 24V/9.2A, 220W
Optional AC/DC 24V/11.67A, 280W (GPU/Card Expansion)
Optional AC/DC 24V/15A, 360W (i7/i9 CPU/GPU/Card Expansion)
Power Mode AT, ATX
Power Ignition Sensing Power Ignition Management
Power Supply Voltage 9~48VDC
12~48VDC for NVMe EDGEboost Node
Power Connector 5-pin Terminal Block
4-pin Terminal Block for NVMe EDGEBoost Node
(12V requires 4-pin terminal block)
Power Protection OVP (Over Voltage Protection)
OCP (Over Current Protection)
Reverse Protection
Environment
Operating Temperature -25°C to 60°C
Storage Temperature -30°C to 85°C
Relative Humidity 10% to 95% (non-condensing)
Certification UL 62368 Ed. 3, CE, FCC Class A
Vibration IEC60068-2-64:2008
With HDD: 1 Grms (5 - 500 Hz, 0.5 hr/axis)
With SSD: 3 Grms (5 - 500 Hz, 0.5 hr/axis)
Designed to comply with MIL-STD-810G Method 514.7 Procedure I
Shock IEC60068-2-27:2008
With SSD: 50G half-sin 11ms
Designed to comply with MIL-STD-810G Method 516.7 Procedure I
Physical
Dimension 240 (W) x 261 (D) x 166.9 (H) mm
Weights 10 ~ 11 kg
Construction Extruded Aluminum with Heavy Duty Metal
Mounting Options Wall Mounting

Mechanical Layout

Product Dimension

Unit:mm

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