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RCO-6000-RPL-2N-1E AI Edge Inference Computer w/ LGA 1700 for Intel 12/13th Gen CPU & R680E PCH, 2 Bay U.2 15mm NVMe, 1x PCIe Expansion

  • LGA 1700 socket for 12/13th Gen. Intel® ADL & RPL Processor (35W TDP)
  • Intel® R680E Chipset
  • 2x DDR5 4800/5600MHz SODIMM. Max. up to 64GB
  • 3x Indepentend Displays: 1x DVI-I, 2x DisplayPort
  • 2x Intel® 2.5 GbE supporting Wake-on-LAN and PXE
  • 1x PCIe x16 (8-lane) to support dedicated GPU
  • 1x Full-size Mini PCIe for communication or expansion modules, 2x SIM socket
  • 2x 15mm Hot-swappable NVMe SSD, Support RAID 0, 1
  • 1x 9mm 2.5" SATA SSD (Internal), 1x 7mm 2.5" SATA SSD (Hot-swap)
  • 1x M.2 (E Key, PCIe x1, USB 2.0, 2230)
  • 1x M.2 (B Key, 2242/3042/3052, PCIe x2, Support AI Module/NVMe Storage, PCIe x1 & USB 3.2 Gen1, Support 4G/5G)
  • 6x RS-232/422/485 (4x internal), 8x USB 3.2 Gen 2, 1x USB 3.2 Gen 1 (internal)
  • 9 to 48VDC Wide Range Power Input Supporting AT/ATX Mode
  • Wide Operating Temperature -25°C to 45°C (35W CPU, with GPU)
  • TPM 2.0 Supported
See Datasheet

Certifications:

Intel Partner
 

12th/13th Gen Intel® Core™ Processor

NVMe/SATA SSDs

DDR5 RAM

PCIe 4.0 Expansion

AI Acceleration

MIL-STD-810G Shock and Vibration

Edge Workload Ready:
Intel® 13th Gen Hybrid P & E Cores

  • Intel® Core™ i3/i5/i7/i9 Core TE Processors (35W TDP)
  • Up to 24 Cores (8 P-Cores, 16 E-Cores)
  • Up to 32 Threads
  • Additional L2 & L3 Cache

DDR5 Speed for Volatile Workloads

  • 2x DDR5 4800/5600MHz SODIMM
  • ECC & Non-ECC Supported

EDGEBoost I/O: Flexible IoT Connectivity

  • PoE Support
  • M12 Connection
  • M.2 Performance Acceleration (5G/NVMe/AI)

EDGEBoost Nodes: Optimized Performance Acceleration

  • PCIe Expansion
  • Dedicated GPU Acceleration
  • Hot-swappable NVMe/SATA Storage

Edge AI Computer Vision Powerhouse

  • PCIe Gen 4.0
  • Tested & Validated GPU List
  • Scalable up to x3 Hailo-8 AI Modules

Hot-swappable High-Capacity SATA

  • Removable 2.5” SATA SSD Bay

Automation Ready with Isolated DIO

  • On-board DIO (8 in/8 out, Isolated)

Beyond the Network: Out-Of-Band Management

Gain easy and reliable 24/7 remote management for your edge deployments even when the OS is unresponsive. Utilizing the Allxon Portal (a secure cloud-based management platform from Allxon), IT teams are able to tap into:

  • Dedicated RJ45 port for secure, hardware-level access,
  • Control hardware at the BIOS level for power cycling and troubleshooting
  • Recover systems remotely even when the OS or main network is down
  • Manage devices centrally across distributed edge mesh network deployments
 

Certified by UL Solutions

For additional re-assurance in product quality and safety, this edge computer has earned the UL Certified Mark for ultimate reliability when operating in extreme industrial deployments.
• UL Listed (I.T.E E357184)

 

Built Rugged. Built Ready.

  • Wide Operating Temp. (-25°C to 70°C)
  • Shock & Vibration Resistant (MIL-STD-810G Compliant)
  • Wide Power Input (9~48VDC)
* Barebone Pricing Only; Sales team to review component configuration and price
*Starting At: $2,542.00

Specification

System
Processor Support 12/13th Gen Intel® ADL & RPL Processor (LGA 1700, 35W TDP)
- Intel® Core™ i9-13900TE/i9-12900TE, up to 24 Cores, 36MB Cache, up to 5 GHz, 35W
- Intel® Core™ i7-13700TE/i7-12700TE, up to 16 Cores, 30MB cache, up to 4.8 GHz, 35W
- Intel® Core™ i5-13500TE/i5-12500TE, up to 14 Core, 24MB Cache, up to 4.5 GHz, 35W
- Intel® Core™ i3-13100TE/i3-12100TE, up to 4 Cores, 12MB Cache, up to 4.1 GHz, 35W
System Chipset Intel® R680E Express Chipset
LAN Chipset 2.5 GbE1: Intel I226, 2.5 GbE2: Intel I226
Support Wake-on-LAN and PXE, Support TSN
Audio Codec Realtek ALC888S
System Memory 2x 262-Pin DDR5 4800/5600MHz SODIMM.

Max. up to 64GB (ECC and Non-ECC)
Graphics Intel® UHD Graphics 770/710
BIOS AMI 256Mbit SPI BIOS
Watchdog Software Programmable Supports 1~255 sec. System Reset
AI Accelerator Supports 3x Hailo-8™ modules
TPM TPM 2.0
Display
Display Port 2x DisplayPort 1.4a, Support resolution 5120 x 3200,
Up to 7680 x 4320
DVI 1x DVI-I, support resolution 1920 x 1200
Multiple Display Triple Display
Storage
M.2 1x M.2 B Key, 2242/3042/3052
(PCIe x2, Support AI Module/NVMe Storage)
(PCIe x1 & USB 3.2 Gen1, Support 4G/5G)
mSATA 1x mSATA (Shared by 1x Mini PCI Express)
NVMe 1x Removable Cannister Brick with 2.5" 2 Bay U.2 NVMe SSD
(Support H=15mm)
SIM Socket 2x External SIM socket (Mini PCIE/M.2 B Key attached)
SSD/HDD 1x 9mm 2.5" SATA HDD Bay (Internal)
1x 7mm 2.5" SATA HDD Bay (Hot-swappable)
2x 15mm 2.5" NVMe SSD Bay (Hot-swappable)
Support RAID 0, 1
Expansion
M.2 1x M.2 (E Key, PCIe x1, USB 2.0, 2230)
Mini PCIe 1x Full-size Mini PCIe (1x shared by 1x mSATA)
PCIe 1x PCIe x16 (8-lane, Gen 3)
1x PCIe x4 (1-lane, Gen 3)
Expansion Modules 2x EDGEBoost I/O Brackets:
• 4-port GbE module with Intel® I350 Chipset, RJ-45/M12 connector (PoE optional)
• 2-Port RJ45 10GbE with Intel X710 Chipset
• 4-Port USB 3.0 (share PCIe Gen2 x1 bandwidth)
• 1x M.2 B-Key, 2242 for AI/NVMe, 1x M.2 B-Key, 3042/3052 for 5G/AI/NVMe
• 1x M.2 M-Key, PCIe x4 Lane, 2242/2260 for AI Module/NVMe
• 1x M.2 for 5G (B Key, PCIe x1, USB 3.0, 3042/3052), 2x SIM socket, 1x SIM switch
I/O
Audio 1x Mic-in, 1x Line-out
CAN 2x CAN 2.0 A/B 2-pin Internal header
COM 2x RS-232/422/485 ; 4x RS-232/422/485 (Internal)
DIO 8 in / 8 out (Isolated)
EDGEBoost I/O Bracket 2x EDGEBoost I/O Bracket (By mini PCIe interface)
LAN 2x RJ45
USB 8x USB 3.2 Gen 2 (10 Gbps)
1x USB 3.2 Gen 1 (5 Gbps, 1x Internal), 2x USB 2.0 (Internal)
Others 5x WiFi Antenna Holes
1x Power Switch, 1x AT/ATX Switch, 1x Remote Power On/Off
1x PC/Car Mode Switch, 1x Delay Time Switch
1x Removable CMOS Battery
Operating System
Windows Windows 10/11
Linux Linux kernel
Power
Power Adapter Optional AC/DC 24V/9.2A, 220W
Optional AC/DC 24V/11.67A, 280W
Optional AC/DC 24V/15A, 360W (i7/i9 CPU/GPU/Card
Expansion)
Power Mode AT, ATX
Power Ignition Sensing Power Ignition Management
Power Supply Voltage 9~48VDC
12~48VDC for NVMe/GPU EDGEboost Node
Power Connector 5-pin Terminal Block
4-pin Terminal Block for GPU and NVMe EDGEBoost Node
(12V requires 4-pin terminal block)
Power Protection OVP (Over Voltage Protection)
OCP (Over Current Protection)
Reverse Protection
Environment
Operating Temperature -25°C to 45°C (35W CPU, with GPU)
Storage Temperature -30°C to 85°C
Relative Humidity 10% to 95% (non-condensing)
Certification UL 62368 Ed. 3, CE, FCC Class A
Vibration With HDD: 1 Grms (5 - 500 Hz, 0.5 hr/axis)
With SSD: 3 Grms (5 - 500 Hz, 0.5 hr/axis)
Shock With SSD: 20G half-sin 11ms
Physical
Dimension 240 (W) x 261 (D) x 166.9 (H) mm
Weights 11 ~ 12 kg
Construction Extruded Aluminum with Heavy Duty Metal
Mounting Options Wall Mounting

Mechanical Layout

Product Dimension

Unit:mm

AI Benchmarks

Intel® Edge Software Device Qualification (ESDQ)

Type
Use Case
Link
Metro AI Suite is an application framework with libraries, tools, and reference implement ations to build AI solutions in the Video Safety and Security, Transportation, and Government Edge markets.
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