JCO-6000-ORN-A_2EBIO High Performance AI Edge Computer with NVIDIA Jetson AGX Orin™, 2x EDGEBoost I/O Support
JCO-6000-ORN-B_4EBIO High Performance AI Edge Computer with NVIDIA Jetson AGX Orin™, 4x EDGEBoost I/O Support

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JCO-6000-ORN-B_4EBIO High Performance AI Edge Computer with NVIDIA Jetson AGX Orin™, 4x EDGEBoost I/O Support

SKU Alias: JCO-6000-ORN-B

  • 8-core/12-core Arm® Cortex®-A78AE v8.2 64-bit CPU
  • LPDDR5 3200MHz on SOM. 32GB/64GB
  • 1x HDMI, 3840 x 2160 @ 60Hz
  • 1x GbE, 1x 10 GbE (Wake-on-LAN and PXE)
  • 2x External SIM Socket, 1x Micro SD Socket
  • 1x eMMC 5.1 Storage, 64 GB
  • 1x M.2 (M Key, 2242/2260/2280, PCIe x4, Support NVMe)
  • 1x USB 3.2 Gen 2, 1x USB Type C, 1x USB 2.0
  • 8x DI + 8x DO with isolation
  • 9 to 48VDC Wide Range Power Input Supporting AT/ATX Mode
  • Wide Operating Temperature -20°C to 60°C (60W CPU)
  • Support GMSL 2 QUAD Port Mini Fakra, 8x Ports | 1280x720 @30FPS (optional)
  • Up to 4x EDGEBoost I/O Support



NVIDIA Jetson Orin AGX Module

AGX Orin is the flagship model within the Jetson Orin lineup, designed for demanding AI applications such as autonomous vehicles, robotics, industrial automation, and video surveillance. Provides powerful processing capabilities suitable for applications that require real-time AI inference, sensor fusion, and high-performance computing.

Jetson AGX Orin Series
Jetson AGX Orin 64GB Jetson AGX Orin 32GB
AI Performance 275 TOPS 200 TOPS
GPU 2048-core NVIDIA Ampere architecture GPU with 64 Tensor Cores 1792-core NVIDIA Ampere architecture GPU with 56 Tensor Cores
CPU 12-core Arm® Cortex®-A78AE v8.2 64-bit CPU 3MB L2 + 6MB L3 8-core Arm® Cortex®-A78AE v8.2 64-bit CPU 2MB L2 + 4MB L3
Power 15W - 60W 15W - 40W

Built Rugged, Built Ready

  • Wide Operating Temp. (-20°C to 60°C)
  • Shock & Vibration Resistant (MIL-STD-810G Compliant)
  • Wide Power Input (9~48VDC, optional 48~110VDC)
  • TPM 2.0

EDGEBoost I/O: Mix and Match Modularity

  • 4x EDGEBoost I/O modules
  • Blazing-fast USB3 Locking module with 5 Gbps
  • Dual 10 GbE Connectivity
  • Hassle-free RJ45/M12 PoE Support
  • Modular M.2 NVMe Storage

4x USB 3.0 with Locking

4x USB 3.0

4x 1GbE RJ45 LAN

4x 1GbE M12 LAN with PoE Support

1x M.2 M-Key

2x 10GbE LAN

Connect High-Speed Vision Cameras : USB3, PoE, and GMSL

  • 8 x GMSL cameras support through mini-Fakra connectors
  • USB3 Vision and PoE for various camera types and system versability

Gain Remote Access through Out-of-Band (OOB) Management

Gain remote management and wireless connectivity on JCO-6000-ORN through Out-of-Band (OOB) module, SIM card, M.2 B Key and E Key.

  • Out-Of-Band (OOB) device management module accessed through 1x RJ45
  • Allows 24/7 remote monitoring and management of Edge AI devices

Automation-Ready with CAN, DIO, and Power Ignition

  • CAN FD
  • Power Ignition Management
  • Isolated 16-bit DIO (8 in/8 out)

Why Premio? Built Rugged. Built Ready.

  • 30+ years of extensive design expertise for industrial-grade compute, storage, rich I/O, and high-speed connectivity
  • Global turnkey manufacturing and support infrastructure in the USA
  • Regulatory testing and compliance for rugged industrial computers
  • Long Product Life Cycles to ensure reliability
* Barebone Pricing Only; Sales team to review component configuration and price

Interested In

Contact Us


Processor • 64 GB, 12-core Arm® Cortex®-A78AE v8.2 64-bit CPU (60W/275 TOPS)
• 32 GB, 8-core Arm® Cortex®-A78AE v8.2 64-bit CPU (40W/200 TOPS)
LAN Chipset GbE1: Marvell 88e1512 (right)
10 GbE2: Marvell AQC113(left)
System Memory AGX Orin 32 GB/64 GB LPDDR5 @ 3200 MHz on SOM
HDMI 1x HDMI, 3840 x 2160 @ 60Hz
eMMC 1x eMMC 5.1, 64 GB
M.2 1x M.2 (M Key, 2242/2260/2280, PCIe x4, Support NVMe) (Default 128GB)
SD 1x Micro SD Socket
SIM Socket 2x Micro SIM Socket (M.2 B Key attached)
M.2 1x M.2 (B Key, 3042/3052, USB 3.2 Gen 2, Support 4G/5G Module)
1x M.2 (E Key, 2230, PCIe x1, USB 2.0, Support Wi-Fi/Bluetooth)
Expansion Modules Support EDGEBoost I/O Modules:
• 4x GbE module with Intel® I350 Chipset, RJ45/M12 connector (PoE optional)
• 2x RJ45 10GbE with Intel X710 Chipset
• 4x USB 3.0 Locking Type with 2x screw hole/USB port
• 4x USB 3.0 (share PCIe Gen2 x1 bandwidth)
• 1x M.2 M Key, PCIe x4 Lane, 2242/2260 for NVMe Storage
*The left EBIO Bracket on the front panel don't support PoE Module
CAN 2x CAN (Optional, internal)
COM 2x RS-232/422/485 (Optional, internal)
DIO 8 in / 8 out (Isolated)
EDGEBoost I/O Bracket 4x EDGEBoost I/O Bracket (3x Front Panel, 1x Back Panel)
GMSL Camera GMSL 2 Camera Support by 2x Quad Port Mini Fakra, supporting 8x 1280x720 @ 30 FPS (Optional)
LAN 2x RJ45
OOB 1x RJ45 (OOB Management Module, Optional, Occupied 1x EBIO Bracket and 1x COM)
PoE By Optional PoE Power Module, Support up to three 4x RJ45/M12 LAN Module
USB 1x USB 3.2 Gen 2
1x USB 2.0 ( Flash)
1x USB Type C (Console)
LED LED 1 : Systen Status (Blue)
LED 2 : Programmable LED (Blue)
LED 3 : Programmable LED (Blue)
LED 4 : Programmable LED (Blue)
LED 5 : Programmable LED (Blue)
LED 6 : Programmable LED (Red)
Others 6x Antenna Holes
1x Power Switch, 1x Reset Switch, 1x Force Recovery Switch
1x AT/ATX Switch, 1x Remote Power On/Off
1x PC/CAR Mode Switch
Operating System
Linux Linux Ubuntu 20.04 with JetPack
Power Adapter Optional AC/DC 24V/5A, 120W
Optional AC/DC 24V/9.2A, 220W
Optional AC/DC 24V/11.67V, 280W
Power Mode AT, ATX
Power Ignition Sensing Adjustable Power Ignition Management
Power Supply Voltage DC IN 9~48V
DC IN 48~110V, Optional (occupied 1x EBIO Bracket)
Power Connector 3-pin Terminal Block
Power Protection OVP (Over Voltage Protection);

OCP (Over Current Protection)

Reverse Protection
Operating Temperature -20°C to 60°C with 0.6 m/s airflow
(MaxN 60W TDP mode, non-throttling)
Tested according to:
IEC60068-2-1:2007 (Cold test procedure)
IEC60068-2-2:2007 (Dry heat test procedure)
IEC60068-2-3:2007 (Damp heat, steady state, test procedure)
IEC60068-2-14:2009 (Wide temperature range thermal shock)
Storage Temperature -40°C to 85°C
Relative Humidity 10% to 95% (non-condensing)
Certification EMI:
   • CE
   • FCC Class A (47 CFR part 15.109 and part 15.107)
   • ICES-003
   • UKCA
EMC Compliance:
   • Railway EMC: EN 50155: 2017, EN 50121-1: 2017,
      EN 50121-3-2: 2016
   • Industrial EMC: EN 61000-4-2: 2009, EN IEC 61000-4-3:
      2020, EN 61000-4-4: 2012, EN 61000-4-5: 2014 +A1: 2017,
      EN 61000-4-6: 2014
   • E-Mark (E13)
   • UL Safety Pending: UL62368-1, 3rd Ed., (cULus)
   • Test prcedure: CB Scheme
   • Standard: IEC 62368-1:2018
Green Product:
   • RoHS 3.0 (Directive 2015/863/EU)
   • REACH
Vibration IEC60068-2-64:2008
With SSD: 5 Grms (5 - 500 Hz, 0.5 hr/axis)
Designed to comply with MIL-STD-810G Method 514.7 Procedure I
Shock IEC60068-2-27:2008
With SSD: 50G half-sin 11ms
Designed to comply with MIL-STD-810G Method 516.7 Procedure I
Package Drop Test: ISTA 2A
Dimensions (W x H x D) 270 (W) x 190 (D) x 95 (H) mm
Weights 5.02 kg
Construction Extruded Aluminum with Heavy Duty Metal
Mounting Options Wall Mounting/DIN rail (Optional)

Mechanical Layout

Product Dimension