LLM-1U-RPL 1U Edge AI Rackmount Server with 12th/13th Gen Intel® Core® Processor and Q670E Chipset

LLM-1U-RPL 1U Edge AI Rackmount Server with 12th/13th Gen Intel® Core® Processor and Q670E Chipset

  • Support 12th/13th Gen Intel® Core™ Processors (LGA 1700, 65W Max TDP)
  • Intel® Q670E Chipset
  • 2x DDR4 3200MT/s SODIMM. Max. up to 64GB
  • 3x 2.5GbE (Support Wake-on-LAN and PXE)
  • Triple 4K Display: 2x DP++, 1x HDMI
  • 1x PCIe x16 (Gen 4) or 2x PCIe x8 (Gen 4) slot
  • 1x M.2 M Key, 1x M.2 B Key, 1x M.2 E Key
  • 2x 2.5" SATA SSD Drive bays (Support RAID 0,1)
  • 2x RS-232/422/485 COM Ports, 2x RS-232 (Internal)
  • 6x USB 3.2 Gen 2 (Rear), Front: 2x USB 3.2 Gen 1 (Front)
  • 600W Redundant Power Supply
  • Support TPM 2.0
  • UL 62368 Ed. 3, FCC, CE

Model:

LLM-1U-RPL

Certifications:

Intel Partner
AWS Greengrass IoT
 

13th Gen Intel® Core™ Processor

GPU Acceleration

PCIe 4.0 Expansion

1U Short-Depth

Operational Redundacy

On-Premises Data Center Edge Ready

  • 1U Short-Depth Form Factor
  • 483 (W) x 480 (D) x 44 (H) mm

Real-Time Performance

  • Intel® Core™ i3/i5/i7/i9 Core TE Processors (65W TDP)
  • Up to 64GB DDR4 3200MT/s SODIMM

Edge AI Inferencing with GPU Acceleration

  • Validated list of workstation-class GPUs for LLM workloads
  • Supporting up to an NVIDIA RTX 5000 ADA (32GB | 1044 TFLOPS)

Versatile Storage Options

  • M.2 M-Key for NVMe SSD
  • 2x Hot-swappable 2.5" SATA Bays

Comprehensive IoT Connectivity

  • 6x USB 3.2 Gen2 (10Gbps)
  • 3x RJ45 (2.5GbE)
  • 2x COM

24/7 Uptime with Redundant Power and Cooling

Hot-swappable 600W PSU (1+1)

Hot-swappable Fans

Robust Physical Security & World-Class Certifications

Security Bezel

Chassis Intrusion Detection Switch

TPM 2.0

IEC 62443-4-1

* Barebone Pricing Only; Sales team to review component configuration and price
Regular price $0.00
*Starting At: $0.00

Specification

System
Processor Support 12/13th Gen Intel® ADL & RPL Processor (LGA 1700, 65W/35W TDP)
- Intel® Core™ i9-13900E/i9-12900E, 65W
- Intel® Core™ i9-13900TE/i9-12900TE, 35W
- Intel® Core™ i7-13700E/i7-12700E, 65W
- Intel® Core™ i7-13700TE/i7-12700TE, 35W
- Intel® Core™ i5-13500E/i5-12500E, 65 W
- Intel® Core™ i5-13500TE/i5-12500TE, 35W
- Intel® Core™ i3-13100E/i3-12100E, 60W
- Intel® Core™ i3-13100TE/i3-12100TE, 35W
- Intel® Core™ 300T, 35W
- Intel® Pentium® G7400E, 46W / G7400TE, 35W
- Intel® Celeron® G6900E, 46W / G6900TE, 35W
System Chipset Intel® Q670E PCH
LAN Chipset Intel® I226LM PCIe 2.5GbE LAN
Intel® I226V PCIe 2.5GbE LAN
Intel® I226V PCIe 2.5GbE LAN
Audio Codec Realtek ALC897
System Memory 2x DDR4 3200MT/s SODIMM. Max. up to 64 GB (Default: 8GB & Non- ECC supported)
BIOS AMI UEFI BIOS
Watchdog Software Programmable Supports 1~255 sec. System Reset
TPM TPM 2.0
Display
Display Port 2x Dual Mode DisplayPort 1.4a
Max Resolution 4096 x 2304 @60Hz
HDMI 1x HDMI 1.4b
Max Resolution 4096 x 2304 @24Hz
Multiple Display 3x Independent Displays
Storage
SSD/HDD 2x 2.5" Hot-swap SATA SSD Drive Bays (7mm/15mm)
Support RAID 0,1
Expansion
M.2 B-Key 1x M.2 B key Type: 3042
• Support PCIe x1 +USB 3.2 Gen 2x1 + USB 2.0
• Support NVMe Storage/AI Module/4G/5G
M.2 E-Key 1x M.2 E-Key Type: 2230
(Support PCIe x1 + USB 2.0; Support CNVi)
Devices Supported:
Intel® AX210 Wi-Fi 6E & BT-5.1 (vPro Supported)
M.2 M-Key 1x M.2 M-Key Type (2242/2280):
• Support PCIe x4 Gen3 NVMe SSD
• PCIe x4 Gen3 signal from PCH
• Support B+M Key
PCIe 1x PCIe x16 Gen 4 or 2x PCIe x8 Gen 4
Card Dimension 267 (L) x 112 (H) mm, dual slot
I/O
Audio Line-out/Mic-in
COM 2x DB9
COM1: RS232/422/485
COM2: RS232
LAN 3x RJ45 (2.5GbE)
USB 6x USB 3.2 Gen2 (Rear)
2x USB 3.2 Gen 1 Type-A (Front)
Others 1x Power button
1x HD LED
1x Power LED
1x Safety Lock
Operating System
Windows Windows 10/11
Linux Linux Kernel
Power
Power Mode AT, ATX
(Default ATX)
Power Ignition Sensing Adjustable Power Ignition Management
Power Supply 2x 600W (1+1) Redundancy Power Supply
AC: 115 to 230 V
DC: -36 to -72 V
Power Connector IEC 60320 C14
System Cooling
Fan 1x CPU Fan Cooler
3x Hot-Swap Dual Smart Fans
Air Filter 1x Dust Fan Filter
Environment
Operating Temperature 0°C to 35°C with 0.6 m/s airflow
Storage Temperature -20°C to 70°C
Relative Humidity 5% to 95% (non-condensing)
Certification UL 62368 Ed. 3, CE, FCC Class A
Vibration With SSD: 1 Grms (5 - 500 Hz, 0.5 hr/axis)
Shock With SSD: NA-G half-sin 11ms
Physical
Form Factor 1U
Dimensions (WxDxH) 483 (W) x 480 (D) x 44 (H) mm
Weights 4 kg
Construction Heavy Duty Metal
Mounting Options Rackmount

Mechanical Layout

Product Dimension

Unit:mm

AI Benchmarks

Intel® Edge Software Device Qualification (ESDQ)

Type
Use Case
Metro AI Suite is an application framework with libraries, tools, and reference implement ations to build AI solutions in the Video Safety and Security, Transportation, and Government Edge markets.