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  • Translation missing: en.localization.language_label

    Industrial Touch Panel PCs and Monitors

    IP Rated Touchscreen Computers For HMI Integration

    See products

    Supercapacitor Technology

    For Mission-Critical Edge Computing

    Learn more
    JCO-6000-ORN-A_2EBIO High Performance AI Edge Computer with NVIDIA Jetson AGX Orin™, 2x EDGEBoost I/O Support

    JCO-6000-ORN-A_2EBIO High Performance AI Edge Computer with NVIDIA Jetson AGX Orin™, 2x EDGEBoost I/O Support

    SKU Alias: JCO-6000-ORN-A

    • 8-core/12-core Arm® Cortex®-A78AE v8.2 64-bit CPU
    • LPDDR5 3200MHz on SOM. 32 GB/64 GB
    • 1x HDMI, 3840 x 2160 @ 60Hz
    • 1x GbE, 1x 10 GbE (Wake-on-LAN and PXE)
    • 2x External SIM Socket, 1x Micro SD Socket
    • 1x eMMC 5.1 Storage, 64 GB
    • 1x M.2 (M Key, 2280, PCIe x4, Support NVMe)
    • 1x USB 3.2 Gen 2, 1x USB Type C, 1x USB 2.0
    • 8x DI + 8x DO with isolation
    • 9 to 48VDC Wide Range Power Input Supporting AT/ATX Mode
    • Wide Operating Temperature -20°C to 55°C (60W CPU)
    • Support GMSL 2 QUAD Port Mini Fakra, 8x Ports | 1280x720 @30FPS (optional)
    • Up to 2x EDGEBoost I/O Support
    See datasheet

    Model:

    JCO-6000-ORN-A_2EBIO

    JCO-6000-ORN-A_2EBIO

    Certifications:

    NVIDIA Jetson
    AWS Greengrass IoT
    Menu
    • Features
    • Specifications
    • Mechanical Layout
    • Dimensions
    • Resources

    Rugged Fanless

    Maximized Expandability

    Wide Temperature

    Shock And Vibration Resistance

    World Class Certifications

    NVIDIA Jetson Orin AGX Module

    AGX Orin is the flagship model within the Jetson Orin lineup, designed for demanding AI applications such as autonomous vehicles, robotics, industrial automation, and video surveillance. Provides powerful processing capabilities suitable for applications that require real-time AI inference, sensor fusion, and high-performance computing.

    Jetson AGX Orin Series
    Jetson AGX Orin 64GB Jetson AGX Orin 32GB
    AI Performance 275 TOPS 200 TOPS
    GPU 2048-core NVIDIA Ampere architecture GPU with 64 Tensor Cores 1792-core NVIDIA Ampere architecture GPU with 56 Tensor Cores
    CPU 12-core Arm® Cortex®-A78AE v8.2 64-bit CPU 3MB L2 + 6MB L3 8-core Arm® Cortex®-A78AE v8.2 64-bit CPU 2MB L2 + 4MB L3
    Power 15W - 60W 15W - 40W

    Built Rugged, Built Ready

    • Wide Operating Temp. (-20°C to 55°C)
    • Shock & Vibration Resistant (MIL-STD-810H Compliant)
    • Wide Power Input (9~48VDC, optional 48~110VDC)
    • TPM 2.0

    EDGEBoost I/O: Mix and Match Modularity

    • 2x EDGEBoost I/O modules
    • Blazing-fast USB3 Locking module with 5 Gbps
    • Dual 10 GbE Connectivity
    • Hassle-free RJ45/M12 PoE Support
    • Modular M.2 NVMe Storage
    • OOB module for remote management

    EBIO-4U3L-J
    4x USB 3.0 with Locking

    EBIO-4U3-J
    4x USB 3.0

    EBIO-4ETH-J
    4x 1GbE RJ45 LAN

    EBIO-4ETH-POE-J
    4x 1GbE RJ45 LAN with PoE Support

    EBIO-4ETH-M12-J
    4x 1GbE M12 LAN

    EBIO-4ETH-POE-M12-J
    4x 1GbE M12 LAN with PoE Support

    EBIO-M2MK-J
    1x M.2 M-Key

    EBIO-D10G-J
    2x 10GbE LAN

    EBIO-OOB-J
    1x RJ45 OOB

    Connect High-Speed Vision Cameras : USB3, PoE, and GMSL

    • 8 x GMSL cameras support through mini-Fakra connectors
    • USB3 Vision and PoE for various camera types and system versability

    Automation-Ready with CAN, DIO, and Power Ignition

    • CAN FD
    • Power Ignition Management
    • Isolated 16-bit DIO (8 in/8 out)

    Jetpack 6.2 SDK Support

    JCO Series now fully supports NVIDIA Jetpack 6.2 SDK, introducing critical upgrades such as the groundbreaking "Super" performance mode, latest Linux OS, and enhanced libraries, APIs & developer tools, delivering cutting-edge performance for mission-critical applications.

    Beyond the Network: Out-Of-Band Management

    Gain easy and reliable 24/7 remote management for your edge deployments even when the OS is unresponsive. Utilizing the Allxon Portal (a secure cloud-based management platform from Allxon), IT teams are able to tap into:

    • Dedicated RJ45 port for secure, hardware-level access,
    • Control hardware at the BIOS level for power cycling and troubleshooting
    • Recover systems remotely even when the OS or main network is down
    • Manage devices centrally across distributed edge mesh network deployments

    Why Premio? Built Rugged. Built Ready.

    • 30+ years of extensive design expertise for industrial-grade compute, storage, rich I/O, and high-speed connectivity
    • Global turnkey manufacturing and support infrastructure in the USA
    • Regulatory testing and compliance for rugged industrial computers
    • Long Product Life Cycles to ensure reliability
    *Barebone Pricing Only; Sales team to review component configuration and price
    Regular price $1,350.00
    *Starting At: $1,350.00
    • Configure Product
    • See Product Features

    Specifications

    System
    Processor • 64 GB, 12-core Arm® Cortex®-A78AE v8.2 64-bit CPU (60W/275 TOPS)
    • 32 GB, 8-core Arm® Cortex®-A78AE v8.2 64-bit CPU (40W/200 TOPS)
    LAN Chipset GbE1: Marvell 88e1512 (right)
    10 GbE2: Marvell AQC113(left)
    System Memory AGX Orin 32 GB/64 GB LPDDR5 @ 3200 MHz on SOM
    TPM TPM 2.0
    Display
    HDMI 1x HDMI, 3840 x 2160 @ 60Hz
    Storage
    eMMC 1x eMMC 5.1, 64 GB
    M.2 1x M.2 (M Key, 2280, PCIe x4, Support NVMe) (Default 128GB)
    SD 1x Micro SD Socket
    SIM Socket 2x Micro SIM Socket (M.2 B Key attached)
    Expansion
    M.2 1x M.2 (B Key, 3042/3052, USB 3.2 Gen 2, Support 4G/5G Module)
    1x M.2 (E Key, 2230, PCIe x1, USB 2.0, Support Wi-Fi/Bluetooth)
    Expansion Modules Support EDGEBoost I/O Modules:
    • 4x GbE module with Intel® I350 Chipset, RJ45/M12 connector (PoE optional)
    • 2x RJ45 10GbE with Intel X710 Chipset
    • 4x USB 3.0 Locking Type with 2x screw hole
    • 4x USB 3.0 (share PCIe Gen2 x1 bandwidth)
    • 1x M.2 M Key, PCIe x4 Lane, 2242/2260 for NVMe Storage
    *The left EBIO Bracket on the front panel don't support PoE Module
    I/O
    CAN 2x CAN 2.0 B
    COM 2x RS-232/422/485 (Switch by MCU)
    DIO 8 in / 8 out (Isolated)
    EDGEBoost I/O Bracket 2x EDGEBoost I/O Bracket
    GMSL Camera GMSL 2 Camera Support by 2x Quad Port Mini Fakra, supporting 8x 1280x720 @ 30 FPS (Optional)
    LAN 2x RJ45
    OOB 1x RJ45 (OOB Management Module, Optional, Occupied 1x EBIO Bracket and 1x COM & 1x USB Type-C Console Port)
    PoE By Optional PoE Power Module, Support up to 4x RJ45/M12 LAN Module
    USB 1x USB 3.2 Gen 2 (10 Gbps)
    1x USB Type C (Console)
    1x USB 2.0 (OS Flash)
    LED LED 1 : System Status (Blue)
    LED 2 : Programmable LED (Blue)
    LED 3 : Programmable LED (Blue)
    LED 4 : Programmable LED (Blue)
    LED 5 : Programmable LED (Blue)
    LED 6 : Programmable LED (Red)
    Others 6x Antenna Holes
    1x Power Switch, 1x Reset Switch, 1x Force Recovery Switch
    1x AT/ATX Switch, 1x Remote Power On/Off
    1x PC/CAR Mode Switch
    Operating System
    Linux Linux Ubuntu 22.04 with JetPack 6.2
    Power
    Power Adapter Optional AC/DC 24V/5A, 120W
    Optional AC/DC 24V/9.2A, 220W
    Optional AC/DC 24V/11.67V, 280W
    Power Mode AT, ATX
    Power Ignition Sensing Adjustable Power Ignition Management
    Power Supply Voltage DC IN 9~48V
    DC IN 48~110V, Optional (occupied 1x EBIO Bracket)
    12V: PoE Power Budget Supports Up to 40~60W
    24V: PoE Power Budget Supports Up to 120W
    Power Connector 3-pin Terminal Block
    Power Protection OVP (Over Voltage Protection);

    OCP (Over Current Protection)

    Reverse Protection
    Environment
    Operating Temperature -20°C to 55°C (AGX 64G, MaxN Mode at 68 Watt, Non-Throttling)
    -20°C to 50°C (AGX 64G, MaxN Mode at 68 Watt, Non-Throttling, With PoE/10G/4U3V Module, full CPU+GPU stressing)
    with 0.6 m/s airflow
    Storage Temperature -40°C to 85°C
    Relative Humidity 10% to 95% (non-condensing)
    Certification CE, FCC Class A, UL 62368-1 , E-Mark, EMC Conformity with EN50155 & EN50121-3-2
    Vibration IEC60068-2-64:2008
    With SSD: 5 Grms (5 - 500 Hz, 0.5 hr/axis)
    Designed to comply with MIL-STD-810H Method 514.8 Procedure I
    Shock IEC60068-2-27:2008
    With SSD: 50G half-sin 11ms
    Designed to comply with MIL-STD-810H Method 516.8 Procedure I
    Package Drop Test: ISTA 2A
    Physical
    Dimensions 270 (W) x 190 (D) x 95 (H) mm
    Weights 6~7 kg
    Construction Extruded Aluminum with Heavy Duty Metal
    Mounting Options Wall Mounting

    Mechanical Layout

    EDGEBoost I/O Expansion

    Dimensions

    Unit:mm

    Resources

    Datasheet DS_JCO-6000-ORN-A_2EBIO_Premio.pdf
    Product Brief PB_JCO-6000-ORN.pdf
    Quick Start Guide Out-Of-Band Quick Start Guide.pdf
    User's Manual UM_JCO-6000-ORN-A_Premio.pdf
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