Premio Inc Packs Incredible Performance, I/O Flexibility, and Low-Power Processing in New 3.5” Industrial Single Board Computer for Embedded IoT

Smaller 3.5” Form Factor Provides Next-Gen Opportunities for Small, Low-power Enhanced Processing and High-Speed I/O Options 

  • 3.5” Single Board Computer with 8th Generation Intel® Core™ U-Series (Codename: Whiskey Lake)
  • Low-Power (15W) embedded processor dedicated for high-performance per watt
  • Industrial-Grade Wide Operating Temp -40°C to 85°C
  • On-board TPM 2.0 for latest hardware security and data encryption
  • Embedded Long-life availability for industry 4.0 deployments

Premio Inc., an innovating global industrial ODM/OEM edge-to-cloud solutions provider, released its newest 3.5" SBC industrial motherboard (CT-DWL01) for embedded IoT processing powered by 8th Generation Intel® Core™ Mobile U-SeriesThis addition to Premio’s existing line of industrial motherboards adds even more performance in a scalable, compact form factorWith its feature-rich system-on-chip (SoC) design that combines Intel’s chipsetand graphics into a single silicon die, this industrial motherboard is tailored for embedded machines in the smallest spaces. System builders who specifically require behind-the-scenes processing and easy next generation motherboard integration, can quickly leverage its features to drive more processing for IoT workloads at the edge. 

“Faster, smaller, and safer are some of the most important hardware demands from industry 4.0 designers who require powerful processing to streamline complex workloads in automation infrastructures,” said Dustin Seetoo, Premio’s director of product marketing. “Our next generation 3.5” SBC answers many of these market demands by providing a small, scalable, and low-power motherboard that balances both, incredible processing and tested industrial-grade reliability; This allows system builders in IoT to deploy edge-level applications with minimal hardware investments.

Premio’s CT-DWL01 3.5" SBC motherboard is a computing powerhouse providing performance boosts in its quad-core processing, faster memory access in DDR-2400MHz, and increased I/O capacity. A key upgrade from the previous generation is access to x4 USB 3.2 Gen 2 (10Gbps) ports that facilitate high-speed data transfer from an array of IoT sensors, all in a low-power (15W TDP) designPremio continues to manufacture embedded offerings from a proven x86 Intel roadmap and incorporates its decades of industrial computer engineering for many enterprise partners. With a roadmap focused on fanless embedded computers, Premio helps partners accelerate hardware engineering while reducing overall time-to-market for embedded IoT deployments in rugged, industrial environments. 

Premio’s value to our partners stems from our three decades of experience in computer engineering and turn-key manufacturing IoT deployments in North America,” Seetoo also said. “Our 150,000 sqft manufacturing facility in Los Angeles provides our partners full transparency and streamlined automation support for computing solutions in real-time.   

The CT-DWL01 3.5" SBC is designed for longevity and follows Intel’s 15-year lifecycle for embedded processors.  In addition, this small form factor motherboard has been tested for wide-operating temperatures ranging from -40°C to 85°Cone of the widest operating temperature range on the market for an industrial-grade SBC. The CT-DWL01 3.5" SBC supports Intel 8th Gen Mobile-U ® Core™ and Celeron processors ranging from 4 to 2 multi-core performance in a power-saving TDP package. A single DIMM slot supports DDR4 2666MHz (up to 32GB) for rapid memory frequency speeds, necessary for multitasking many IoT workloads.   

The CT-DWL01 3.5" motherboard does not skimp on I/O expandability and provides flexible plug and play options for many system builders focusing on industrial applications. The SoC design pulls the latest technologies in visual graphics and can deliver crisp 4K resolutions in HDMI and Display port interfaces. Another distinct feature for connecting panels is an internal dual-channel 24-bit LVDS and optional eDP connector to drive panel HMI displaysThe industrial motherboard also features a variety of connectivity ports: 2 SATA 6Gb/s buses for storage drives, 4 serial COM (RS-232/422/485) connectors for legacy devices, x4 USB 3.2 Gen, x2 USB 2.0 form internal pin-headers. The industrial motherboard also contains two Mini PCIe Gen3 expansion buses for mSATA storage and additional connectivity support for WiFi, and SIM socket support for 4G/LTE coverage.

An installed trusted platform module (TPM) counters cybersecurity threats faced in modern industrial deployments. The module delivers boot security and platform integrity at the hardware level to TPM 2.0 standards, preventing malware from affecting critical systems. The TPM root key enables encryption for device applications and data, while providing password protection authentication to only allow trusted parties access to the system. 

Premio’s 3.5” CT-DWL01 SBC serves a specific need for low-power embedded Industry 4.0 technologies, especially in terms of industrial grade reliability. This SBC’s processing strength and versatility serve as the foundation to robust, future-ready motherboards addressing changing demands of industrial computing. Embedded applications that focus on factory automation, kiosks, security and surveillance, and intelligent transportation can build-off this motherboard for next-generation IoT upgrades.  

Ordering information and stocking processors models can be found on Premio’s product website and datasheet.  

For more information about Premio’s entire portfolio of industrial computers and other embedded IoT solutions please visit premioinc.com or email sales@premioinc.com to learn more. Are you ready for the wave of rugged edge computing?

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About Premio, Inc. 

Premio is a premier global ODM/OEM provider in computing technology from the edge to the cloud. We design and manufacture highly reliable, world-class product solutions for businesses with complex, highly specialized requirements. For over 30 years, our engineering expertise and manufacturing agility have been delivering hardware solutions in enterprise servers/storage, industrial embedded systems and industrial touch panel displays for some of the world’s premier technology companies. 

At Premio, we go to extraordinary lengths to solve the most formidable challenges faced by our customers. We do so by becoming more than their partner: we become their 'Inside Outsource'—an extension of their businesses, work cultures, manufacturing processes and operations, modulating our solutions to answer their special needs with speed, agility and precision. 

With a state-of-the-art facility in Los Angeles, California (ISO9001, ISO2001, ISO13485) and strategic locations in Taiwan, Malaysia and Germany. Premio provides robust product engineering, flexible speed to market and unlimited manufacturing transparency. Learn more by visiting our website at premioinc.com. 

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