DCO-1000-ASL DIN-Rail Fanless Embedded Computer with Intel® Atom® x7433RE CPU, 2x DP, 2x COM, 4x USB, 4x LAN

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DCO-1000-ASL DIN-Rail Fanless Embedded Computer with Intel® Atom® x7433RE CPU, 2x DP, 2x COM, 4x USB, 4x LAN

  • Support Intel® Atom® x7433RE Processor
  • 1x 262-pin DDR5 SODIMM. Max. up to 16GB
  • Dual Independent Display by 2x Display Port
  • 4x 2.5GbE LAN
  • 2x M.2 (B Key, 3042/3052, Support 4G/5G)
  • 2x RS-232/422/485, 2x USB 3.2 Gen2, 2x USB 3.2 Gen1
  • 9 to 36VDC Wide Range Power Input Supporting AT/ATX Mode
  • Wide Operating Temperature -40°C to 55°C
  • TPM 2.0 Supported
  • CE, FCC, UL

Model:

DCO-1000-ASL

Certifications:

Intel Partner
 

Compact & Rugged Design

DIN-rail Mountable

Balanced I/O Configuration

Wide Operating Temperature

TPM 2.0 Security

Small Form Factor Design & Din rail Mounting

  • Ultra-Compact Design (150x105x49mm): Maximizes space efficiency in tight areas.
  • Din-Rail Mounting: Enables quick, secure installations and easy maintenance.

Intel® Atom® x7433RE Processor

Processor

X7433RE

Cores

4

Max TDP

9 W

CPU Max Turbo Frequency

3.4 GHz

Graphics Max Dynamix Frequency

1 GHz

Blazing-Fast DDR5 Integration

  • Increases transfer speeds compared to its predecessor.
  • Offers enhanced performance, lower latency, and improved power efficiency

Balanced I/O Configuration

  • 2x USB 3.2 Gen 2 & 2x USB 2.0
  • 4 x 2.4 GbE Ethernet for highspeed network
  • 2x Serial Port
  • 2x 4K DisplayPort

M.2 Expansions & Wireless Connectivity

  • 1x M.2 B Key (3042/3052, PCIe x2, support NVMe Storage)
  • 1x M.2 B Key (3042/3052, USB 3.2 Gen2 & USB2.0, support 4G/5G Module)
  • 1x M.2 E key (2230, PCIe x1 & USB2.0, support Wifi/Bluetooth)

Gain Remote Access by OOB Management Module

  • Access systems remotely even when the network is down
  • Recover and reboot systems when the operating system is unresponsive.
  • Make critical updates anytime, anywhere, with no physical access required.

Build Rugged, Build Ready

  • Extended Operating Temperature: -40°C to 55°C
  • MIL-STD-810G Shock & Vibration: 20G/5Grms
  • Wide Power Input: 9~36VDC
  • Power Protection: OCP, OVP, RPP
* Barebone Pricing Only; Sales team to review component configuration and price

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Specification

System
Processor Support Intel® Atom® Processor (Up to 9W TDP)
-Intel® Atom® Processor x7433RE, Quad Core, CPU HFM 1.5 GHz/1C Turbo 3.2GHz, GPU 32EU, TDP 9W
System Chipset SoC integrated
LAN Chipset 2.5 GbE1: Intel I226
2.5 GbE2: Intel I226
2.5 GbE3: Intel I226
2.5 GbE4: Intel I226 (Support TSN)
(LAN #1-2 Shared PCIe Gen 2 x1 Lane bandwidth)
System Memory 1x 262-Pin DDR5 4800MHz SODIMM. Max. up to 16GB (In-Band ECC/Non-ECC)
Graphics Intel® UHD Graphics
BIOS AMI SPI BIOS
Watchdog Software Programmable Supports 1~255 sec. System Reset
TPM TPM 2.0
Display
Display Port 2x DisplayPort 1.4, DP (4096 x 2160@60Hz)
Multiple Display Dual Display
Storage
M.2 1x M.2 (B Key, 3042/3052, PCIe x2, support NVMe)
SIM Socket 1x Dual Nano SIM Socket
Expansion
M.2 1x M.2 (B Key, 3042/3052, USB 3.2 Gen2 & USB2.0, support 4G/5G Module)
1x M.2 (E key, 2230, PCIe x1 & USB2.0, support Wifi/Bluetooth)
I/O
CAN 2x 2-pin Internal header (Optional)
COM 2x RS-232/422/485
DIO 4 in / 4 out (Isolated)
LAN 4x RJ45
OOB 1x RJ45 (Optional)
USB 2x USB 3.2 Gen 2 (10 Gbps)
2x USB 2.0
Others 4x WiFi Antenna Holes
1x Power Switch, 1x Reset Switch
1x AT/ATX Internal Switch Jumper
1x 2-PIN Remote Power On/Off
1x Internal CMOS Battery Cable
Operating System
Windows Windows 10/Windows 11
Linux Linux kernel 5.X
Power
Power Adapter Optional AC/DC 12V/5A, 60W
Power Mode AT, ATX
Power Supply Voltage 9~36VDC
Power Connector 3-pin Terminal Block
Power Protection OVP (Over Voltage Protection)
OCP (Over Current Protection)
Reverse Protection
Environment
Operating Temperature -40°C to 55°C
Storage Temperature -40°C to 85°C
Relative Humidity 10% to 95% (non-condensing)
Certification CE, FCC Class A, UL
Vibration • Wall Mounting with NVMe SSD: 5 Grms, 5 - 500 Hz, 0.5 hr/axis
• DIN Rail Mounting with NVMe SSD: 5 Grms, 5 - 500 Hz, 0.5 hr/axis
Designed to comply with MIL-STD-810G Method 514.7 Procedure I
Shock With SSD: 20G, half sine, 11ms
Designed to comply with MIL-STD-810G Method 514.7
Procedure I
Physical
Dimensions (W x D x H) 150 x 105 x 49 mm
Weights 0.85 kg
Construction Extruded Aluminum with Heavy Duty Metal
Mounting Options DIN-Rail Mounting
Wall Mounting (Optional)

Mechanical Layout

Product Dimension

Unit:mm

Resources

Data Sheet DS_DCO-1000-ASL_Premio.pdf
Product Brief PB_DCO-1000-ASL.pdf
User's Manual UM_DCO-1000-ASL.pdf