BCO-3000-RPL Small Form Factor Computer with 12th/13th Gen Intel® IoTG Processor, 2x DP, 1x HDMI, 2x COM, 3x LAN

BCO-3000-RPL Small Form Factor Computer with 12th/13th Gen Intel® IoTG Processor, 2x DP, 1x HDMI, 2x COM, 3x LAN

  • Support 12th/13th Gen Intel® IoTG Processor Core i9/i7/i5/i3, Pentium, Celeron (35W only)
  • 2x DDR4 SODIMM. Max. up to 64GB (Default: 8GB)
  • 2x Display Port, 1x HDMI, Triple Independent Display
  • 3x 2.5GbE LAN
  • 1x M.2 M-Key (Default: 128GB SSD), 1x M.2 E-key, 1x M.2 B-key
  • 4x COM, 6x USB 3.2 Gen 2, 2x USB 3.2 Gen 1, 2x USB 2.0
  • 9 to 36VDC Wide Range Power Input Supporting AT/ATX Mode
  • Wide Operating Temperature 0°C to 50°C (35W CPU)
  • TPM 2.0 Supported
  • CE, FCC Class A, UL 62368 Ed. 3
See Datasheet

Model:

BCO-3000-RPL

BCO-3000-RPL

Certifications:

Intel Partner
AWS Greengrass IoT
 
 

Fanless Design

IoT-Centric Connectivity

Wide Operating Temperature

Shock And Vibration
Resistance

TPM 2.0 Security

Powerful, Multi-core Processing

Although small, the BCO-3000-RPL pushes edge performance boundaries with support for a socket-type processor. It leverages a hybrid-core architecture with performance and efficiency cores to streamline resource-intensive workloads at the edge.

  • Up to 24 Cores: 8 P-Cores, 16 E-Cores
  • Up to 32 Threads
  • Increased L2 & L3 Cache
  • 35W TE (Power-Optimized Embedded) Processors

Small Form Factor for Balanced Power and Performance

The BCO-3000-RPL measures in at 192mm x 240mm x 69mm (WxDxH), allowing to maintain the smallest form factor for space constrained applications.

Rich IIoT-Centric Connectivity

The BCO-3000-RPL is outfitted with rich connectivity to consolidate and support various types of IoT devices. From legacy COM ports to high-speed USB 3.2, it is specifically tailored to provide IoT-centric connectivity for industrial deployment applications.

Edge AI Ready

Enable real-time AI inferencing capabilities with TPU supported in the BCO-3000-RPL. The Hailo-8 M.2 AI Accelerator delivers lite AI performance to execute on-premises inferencing while maintaining an ultra-compact form factor and minimal power consumption.

Industrial Grade Design

The BCO-3000-RPL is purpose-built to withstand harsh industrial environments and conditions for operational reliability.

  • Fanless, Semi-Rugged Design
  • Wide Operating Temperature: 0°C to 50°C
  • Shock & Vibration Resistant (MIL-STD-810G Compliant)
  • Wide Power Input: 9 to 36VDC

Flexible Mounting Capabilities

The BCO-3000-RPL supports two standardized industrial mounting configurations: Wall Mount and an optional DIN-Rail mount. This provides enhanced flexibility in many applications where space may be extremely limited.

Wall Mount

DIN-Rail Mount

* Barebone Pricing Only; Sales team to review component configuration and price
*Starting At: $862.00

Specification

System
Processor Intel® IOTG:
• 12th/13th Gen Intel® Core™ Processor i9/i7/i5/i3, Pentium, Celeron (35W only)
System Chipset Intel® Q670E Express Chipset
LAN Chipset Intel® I225LM PCIe 2.5GbE LAN
Intel® I225V PCIe 2.5GbE LAN
Intel® I225LV PCIe 2.5GbE LAN
Audio Codec Realtek ALC897
System Memory 2x DDR4 3200MT/s SODIMM. Max. up to 64 GB (Default: 8GB)
Graphics Intel® UHD Graphics
BIOS AMI UEFI BIOS
Watchdog Software Programmable Supports 1~255 sec. System Reset
AI Accelerator Supports 1x Hailo-8™ module through M.2 B-Key
TPM TPM 2.0
Display
Display Port 2x Dual Mode DisplayPort 1.4a
Max Resolution 4096 x 2304 @60Hz
HDMI 1x HDMI 1.4b
Max Resolution 4096 x 2304 @24Hz
Multiple Display 3x Independent Displays
Storage
M.2 M-Key 1x M.2 M-key Type (2242/2280):
• Support 1x PCIe x4 Gen 3 NVMe SSD From PCH (Default 128GB SSD)
• Support B+M Key, AI/Storage Module (Pending)
Expansion
M.2 B-Key 1x M.2 B-key ( 3042)
• Support 1x Nano SIM Holder
• Support 1x PCIe x1, 1x USB 3.2 Gen 2, 1x USB 2.0, 5G/4G/LTE Module
M.2 E-Key 1x M.2 E-key (2230)
• Support 1x PCIe x1, 1x USB 2.0; Support CNVi
• Devices Supported: Intel® AX210 Wi-Fi 6E & BT-5.1 (vPro Supported)
Network Modules Optional Through M.2 B-Key:
• 5G/4G/LTE Module
I/O
Audio Line-out/Mic-in
COM 4x DB9
COM1: RS232/422/485
COM2: RS232/422/485
COM3: RS485
COM4: RS485
DIO 8 in / 8 out (Isolated)
LAN 3x RJ45 (2.5GbE)
USB 6x USB 3.2 Gen2
2x USB 3.2 Gen1
2x USB 2.0 Type-A
Others • 5x Antenna Holes
• 1x Power button
• 1x HD LED
• 1x Power LED
Operating System
Windows Windows 10/11
Linux Linux Kernel
Power
Power Adapter Optional AC/DC 24V/5A, 120W
Power Mode AT, ATX
(Default ATX)
Power Supply Voltage 9~36VDC
Power Connector 4-pin Terminal Block
Environment
Operating Temperature 0°C to 50°C (35W CPU)
Tested according to:
IEC60068-2-1:2007 (Cold test procedure)
IEC60068-2-2:2007 (Dry heat test procedure)
IEC60068-2-3:2007 (Damp heat, steady state, test procedure)
IEC60068-2-14:2009 (Wide temperature range thermal shock)
Storage Temperature -30°C to 85°C
Relative Humidity 10% to 95% (non-condensing)
Certification EMC:
   • CE
   • FCC Class A (47 CFR part 15.109 and part 15.107)
   • ICES-003
   • UKCA
   • UL 62368 Ed. 3
Green Product:
   • RoHS 3.0 (Directive 2015/863/EU)
   • REACH
Vibration IEC60068-2-64:2008
With SSD: 5 Grms (5 - 500 Hz, 0.5 hr/axis)
Designed to comply with MIL-STD-810G Method 514.7 Procedure I
Shock IEC60068-2-27:2008
With SSD: 50G half-sin 11ms
Designed to comply with MIL-STD-810G Method 514.7 Procedure I
Package Drop Test: ISTA 2A
Physical
Dimensions (WxDxH) 192 x 240 x 69mm
Construction Extruded Aluminum with Heavy Duty Metal
Mounting Options Wall Mounting
DIN-Rail Mounting (Optional)

Mechanical Layout

Product Dimension

Unit:mm