BCO-3000-RPL Small Form Factor Computer with 12th/13th Gen Intel® IoTG Processor, 2x DP, 1x HDMI, 2x COM, 3x LAN

BCO-3000-RPL Small Form Factor Computer with 12th/13th Gen Intel® IoTG Processor, 2x DP, 1x HDMI, 2x COM, 3x LAN

  • Support 12th/13th Gen Intel® IoTG Processor Core i9/i7/i5/i3, Pentium, Celeron (35W only)
  • 2x DDR4 SODIMM. Max. up to 64GB (Default: 8GB)
  • 2x Display Port, 1x HDMI, Triple Independent Display
  • 3x 2.5GbE LAN
  • 1x M.2 M-Key (Default: 128GB SSD), 1x M.2 E-key, 1x M.2 B-key
  • 4x COM, 6x USB 3.2 Gen 2, 2x USB 3.2 Gen 1, 2x USB 2.0
  • 9 to 36VDC Wide Range Power Input Supporting AT/ATX Mode
  • Wide Operating Temperature 0°C to 50°C (35W CPU)
  • TPM 2.0 Supported
  • CE, FCC Class A, UL 62368 Ed. 3
See Datasheet

Model:

BCO-3000-RPL

BCO-3000-RPL

Certifications:

Intel Partner
AWS Greengrass IoT
 
 

Fanless Design

IoT-Centric Connectivity

Wide Operating Temperature

Shock And Vibration
Resistance

TPM 2.0 Security

Powerful, Multi-core Processing

Although small, the BCO-3000-RPL pushes edge performance boundaries with support for a socket-type processor. It leverages a hybrid-core architecture with performance and efficiency cores to streamline resource-intensive workloads at the edge.

  • Up to 24 Cores: 8 P-Cores, 16 E-Cores
  • Up to 32 Threads
  • Increased L2 & L3 Cache
  • 35W TE (Power-Optimized Embedded) Processors

Small Form Factor for Balanced Power and Performance

The BCO-3000-RPL measures in at 192mm x 240mm x 69mm (WxDxH), allowing to maintain the smallest form factor for space constrained applications.

Rich IIoT-Centric Connectivity

The BCO-3000-RPL is outfitted with rich connectivity to consolidate and support various types of IoT devices. From legacy COM ports to high-speed USB 3.2, it is specifically tailored to provide IoT-centric connectivity for industrial deployment applications.

Edge AI Ready

Enable real-time AI inferencing capabilities with TPU supported in the BCO-3000-RPL. The Hailo-8 M.2 AI Accelerator delivers lite AI performance to execute on-premises inferencing while maintaining an ultra-compact form factor and minimal power consumption.

Industrial Grade Design

The BCO-3000-RPL is purpose-built to withstand harsh industrial environments and conditions for operational reliability.

  • Fanless, Semi-Rugged Design
  • Wide Operating Temperature: 0°C to 50°C
  • Shock & Vibration Resistant (MIL-STD-810G Compliant)
  • Wide Power Input: 9 to 36VDC

Flexible Mounting Capabilities

The BCO-3000-RPL supports two standardized industrial mounting configurations: Wall Mount and an optional DIN-Rail mount. This provides enhanced flexibility in many applications where space may be extremely limited.

Wall Mount

DIN-Rail Mount

* Barebone Pricing Only; Sales team to review component configuration and price
*Starting At: $862.00

Specification

System
Processor Intel® IOTG:
• 12th/13th Gen Intel® Core™ Processor i9/i7/i5/i3, Pentium, Celeron (35W only)
System Chipset Intel® Q670E Express Chipset
LAN Chipset Intel® I226LM PCIe 2.5GbE LAN
Intel® I226V PCIe 2.5GbE LAN
Intel® I226V PCIe 2.5GbE LAN
Audio Codec Realtek ALC897
System Memory 2x DDR4 3200MT/s SODIMM. Max. up to 64 GB (Default: 8GB)
Graphics Intel® UHD Graphics
BIOS AMI UEFI BIOS
Watchdog Software Programmable Supports 1~255 sec. System Reset
AI Accelerator Supports 1x Hailo-8™ module through M.2 B-Key
TPM TPM 2.0
Display
Display Port 2x Dual Mode DisplayPort 1.4a
Max Resolution 4096 x 2304 @60Hz
HDMI 1x HDMI 1.4b
Max Resolution 4096 x 2304 @24Hz
Multiple Display 3x Independent Displays
Storage
M.2 M-Key 1x M.2 M-key Type (2242/2280):
• Support 1x PCIe x4 Gen 3 NVMe SSD From PCH (Default 128GB SSD)
• Support B+M Key, AI/Storage Module (Pending)
Expansion
M.2 B-Key 1x M.2 B-key ( 3042)
• Support 1x Nano SIM Holder
• Support 1x PCIe x1, 1x USB 3.2 Gen 2, 1x USB 2.0, 5G/4G/LTE Module
M.2 E-Key 1x M.2 E-key (2230)
• Support 1x PCIe x1, 1x USB 2.0; Support CNVi
• Devices Supported: Intel® AX210 Wi-Fi 6E & BT-5.1 (vPro Supported)
Network Modules Optional Through M.2 B-Key:
• 5G/4G/LTE Module
I/O
Audio Line-out/Mic-in
COM 4x DB9
COM1: RS232/422/485
COM2: RS232/422/485
COM3: RS485
COM4: RS485
DIO 8 in / 8 out (Isolated)
LAN 3x RJ45 (2.5GbE)
USB 6x USB 3.2 Gen2
2x USB 3.2 Gen1
2x USB 2.0 Type-A
Others • 5x Antenna Holes
• 1x Power button
• 1x HD LED
• 1x Power LED
Operating System
Windows Windows 10/11
Linux Linux Kernel
Power
Power Adapter Optional AC/DC 24V/5A, 120W
Power Mode AT, ATX
(Default ATX)
Power Supply Voltage 9~36VDC
Power Connector 4-pin Terminal Block
Environment
Operating Temperature 0°C to 50°C (35W CPU)
Storage Temperature -30°C to 85°C
Relative Humidity 10% to 95% (non-condensing)
Certification UL 62368 Ed. 3, CE, FCC Class A
Vibration With SSD: 5 Grms (5 - 500 Hz, 0.5 hr/axis)
Shock With SSD: 50G half-sin 11ms
Physical
Dimensions (WxDxH) 192 x 240 x 69mm
Construction Extruded Aluminum with Heavy Duty Metal
Mounting Options Wall Mounting
DIN-Rail Mounting (Optional)

Mechanical Layout

Product Dimension

Unit:mm

AI Benchmarks

Intel® Edge Software Device Qualification (ESDQ)

Type
Use Case
Link
Metro AI Suite is an application framework with libraries, tools, and reference implement ations to build AI solutions in the Video Safety and Security, Transportation, and Government Edge markets.
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