BCO-1000-ADLN_2L Fanless Mini Computer with 12th Gen Intel® IoTG N97 Processor, 1x DP, 1x HDMI, 2x COM, 2x LAN, 1x 2.5" Drive Bay
BCO-1000-ADLN-B_3L Fanless Mini Computer with Intel® IoTG N97/Intel® Atom® x7835RE Processors, 1x DP, 1x HDMI, 2x COM, 3x LAN, 1x 2.5" Drive Bay

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BCO-1000-ADLN-B_3L Fanless Mini Computer with Intel® IoTG N97/Intel® Atom® x7835RE Processors, 1x DP, 1x HDMI, 2x COM, 3x LAN, 1x 2.5" Drive Bay

SKU Alias: BCO-1000-ADLN-B

  • Support 12th Gen Intel® IoTG Alder Lake-N N97/Intel® Atom® x7835RE
  • DDR5 SODIMM. Max. up to 16GB (Default: 8GB)
  • Dual Independent Display by 1x Display Port, 1x HDMI
  • 3x Intel® I225-V 2.5GbE LAN
  • 1x 2.5” Drive Bay
  • 1x M.2 B-Key (Default: 128GB SSD)
  • 1x Dual SIM Socket
  • 2x COM, 2x USB 3.2 Gen 2, 2x USB 2.0
  • 12 to 36VDC Wide Range Power Input Supporting AT/ATX Mode
  • Wide Operating Temperature 0°C to 50°C
  • TPM 2.0 Supported
  • CE, FCC Class A
See Datasheet

Certifications:

Intel Partner
 
 

Fanless Design

Rich I/O

Wide Temperature

Shock And Vibration
Resistance

TPM 2.0 Security

Intel® NUC Alternative

Intel Alder Lake-N & Atom Processor

  • Intel Alder Lake N97 or Atom x7835RE processors (12W TDP)
  • Up to 4 or 8 Efficiency Cores
  • Max Turbo Freq: 3.6 GHz
  • 6MB Intel Smart Cache

High-speed DDR5 Memory

  • DDR5 4800 MT/s SODIMM
  • Up to 16GB
  • 1.1V Power Voltage Efficiency

Ultra Compact Form Factor

Measuring in at 192 x 140 x 68mm, the BCO-1000-ADLN allows for seamless integration in the most space constrained applications.

Extensive IIoT Connectivity

Rich on-board I/O provides seamless integration with a variety of IoT sensors and devices

BCO-1000-ADLN_2L

BCO-1000-ADLN-B_3L

Industrial Grade Design

  • Fanless, Semi-Rugged Design
  • Wide Operating Temperature: 0°C–50°C
  • MIL-STD-810G Shock & Vibration
  • Wide Power Input: 9-36VDC

Flexible Mounting Options

The BCO-1000-ADLN supports two standardized industrial mounting configurations: Wall Mount and an optional DIN-Rail mount. This provides enhanced flexibility in many applications where space may be extremely limited.

Wall Mount

DIN-Rail Mount

* Barebone Pricing Only; Sales team to review component configuration and price

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Specification

System
Processor • 12th Gen Intel® IoTG Alder Lake-N Processor N97,4 cores, 12W
• Intel Atom® x7835RE Processor, 8 cores, 12W
System Chipset SoC integrated
LAN Chipset 2x Intel® I225-V 2.5GbE LAN
1x Intel® I225-V 2.5GbE LAN (Co-lay I226-LM Support TSN, not verified in NPI)
Audio Codec Realtek ALC897
System Memory DDR5 4800MT/s SODIMM. Max. up to 16 GB (Default: 8GB)
Graphics Intel® UHD Graphics
BIOS AMI UEFI BIOS
Watchdog Software Programmable Supports 1~255 sec. System Reset
TPM TPM 2.0
Display
Display Port 1x DisplayPort 1.4a
Max Resolution 4096 x 2304 @60Hz
HDMI 1x HDMI 1.4b
Max Resolution 3840 x 2160 @30Hz
Multiple Display 2x Independent Displays
Storage
M.2 B-Key 1x M.2 B-Key slot (2242/2280/3042)
• Supports 1x PCIe x1 SATA signal, (Default 128GB SSD)
• Supports B+M Key SSD
SATA 1x Internal 2.5" SATA SSD Bay (7mm or 9mm)
Expansion
M.2 B-Key 1x M.2 B Key (2242/2280/3042, SATA/PCIe x1/USB3.0, support LTE/4G/5G/Storage Module)
M.2 E-Key 1x M.2 E Key (2230, PCIe x1 & USB 2.0, support Wi-Fi 6E & BT-5.1)
Network Modules Optional Through M.2 B-Key:
• Support B+M Key PCIe x1 Module for 4G/LTE
• 1x Dual SIM Socket (SIM1/SIM2 on the M.2 B Key slot)
I/O
Audio Line-in/Line-out/Mic-in
COM 2x DB9
COM1: RS232/422/485
COM2: RS232
GPIO 1x 8 GPIO
LAN 3x RJ45 (2.5GbE)
USB 2x USB 3.2 Gen1
2x USB 2.0 Type-A
Others • 2x Antenna Holes
• 1x Power button
• 1x HD LED
• 1x Power LED
Operating System
Windows Windows 10/11
Linux Linux Kernel
Power
Power Adapter Optional AC/DC 12V/5A, 60W
Power Mode AT, ATX
(Default ATX)
Power Supply Voltage 12~36VDC
Power Connector 3-pin Terminal Block
Environment
Operating Temperature 0°C to 50°C (12W CPU)
Tested according to:
IEC60068-2-1:2007 (Cold test procedure)
IEC60068-2-2:2007 (Dry heat test procedure)
IEC60068-2-3:2007 (Damp heat, steady state, test procedure)
IEC60068-2-14:2009 (Wide temperature range thermal shock)
Storage Temperature -30°C to 85°C
Relative Humidity 10% to 95% (non-condensing)
Certification EMC:
   • CE
   • FCC Class A (47 CFR part 15.109 and part 15.107)
   • ICES-003
   • UKCA
   • UL 62368 Ed. 3
Green Product:
   • RoHS 3.0 (Directive 2015/863/EU)
   • REACH
Vibration IEC60068-2-64:2008
With SSD: 5 Grms (5 - 500 Hz, 0.5 hr/axis)
Designed to comply with MIL-STD-810G Method 514.7 Procedure I
Shock IEC60068-2-27:2008
With SSD: 50G half-sin 11ms
Designed to comply with MIL-STD-810G Method 514.7 Procedure I
Package Drop Test: ISTA 2A
Physical
Dimensions (WxDxH) 192 x 140 x 68mm
Construction Extruded Aluminum with Heavy Duty Metal
Mounting Options Wall Mounting
DIN-Rail Mounting (Optional)

Mechanical Layout

Product Dimension

Unit:mm