RCO-3000-RPL Small Form Factor Computer with LGA 1700 for 12/13th Gen Intel CPU & Q670 PCH, 2x LAN

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RCO-3000-RPL Small Form Factor Computer with LGA 1700 for 12/13th Gen Intel CPU & Q670 PCH, 2x LAN

  • Support 12/13 Gen Intel® RPL S Processor (LGA 1700, 35W TDP)
  • Intel® Q670 Express Chipset
  • 4x Independent Displays
  • 2x Intel® 2.5GbE supporting Wake-on-LAN and PXE, 3x External SIM socket
  • 2x 2.5" SATA SSD Bay (1x Internal) with RAID 0, 1, 5 support
  • 1x M.2 E Key, 2230 (PCIe x1, USB 2.0)
  • 1x M.2 B Key, 2242/3042/3052 (PCIe x2,or PCIe x1 & USB 3.2 Gen1; Support AI Module/NVMe Storage/4G/5G)
  • 1x M.2 B Key, 2242/3042/3052 (PCIe x2 or SATA; Support AI Module/NVMe/SATA Storage/4G/5G)
  • 3x RS-232/422/485, 6x USB 3.2 Gen 2 (10 Gbps)
  • 8x DI + 8x DO with isolation
  • 9 to 48VDC Wide Range Power Input Supporting AT/ATX Mode
  • Wide Operating Temperature (-25°C to 70°C)
  • TPM 2.0 Supported
See Datasheet

Model:

RCO-3000-RPL

RCO-3000-RPL

Certifications:

Intel Partner
AWS Greengrass IoT

Real-time Performance

Rich IoT Connectivity

Modular EDGEBoost I/O

Small Form Factor

Super-Rugged Durability

Edge Workload Ready

Intel® 13th Gen Hybrid P & E Cores

  • Intel® Core™ i3/i5/i7/i9 Core TE Processors (35W TDP)
  • Up to 24 Cores (8 P-Cores, 16 E-Cores)
  • Up to 32 Threads
  • Additional L2 & L3 Cache

DDR5 Speed for Volatile Workloads

• 1x DDR5 4800/5600MHz SODIMM

Modular EDGEBoost I/O: Flexible IoT Connectivity

4x Port GbE/PoE RJ45 Connectors

4x Port GbE/PoE M12 Connectors

2x Port 10GbE RJ45 Connector

4x Port USB 3.2 Gen 1

5G, Edge AI, and NVMe Storage

Out-Of-Band Device Management

Hot-swappable High-Capacity SATA

  • 1x Internal 2.5” SATA SSD Bay
  • 1x Hot-swappable 2.5” SATA SSD Bay

M.2 Performance Acceleration

• 2x M.2 B-Key for: NVMe/SATA storage, Edge AI TPU, 5G
• 1x M.2 E-Key for: WiFi 6E

NVMe SSD

High-speed data aggregation

Industrial 5G

Reliable low-latency wireless communications

Hailo-8 AI accelerator

Power lite to mid-level AI workloads

Automation & Mobile IoT Ready

  • 16-bit Isolated DIO (8in, 8out)
  • CAN Bus (2-channel)
  • Power Ignition Management

  • WiFi 6E
  • Bluetooth 5.3
  • 5G/4G/LTE

Built Super-Rugged. Built Ready

  • Wide Operating Temperatures (-25℃ to 70℃)
  • Shock & Vibration Resistance (MIL-STD-810G)
  • Wide Power Input (9~48VDC)
  • Power Protection (OCP, OVP, RPP)

World-Class Safety Certifications

  • UL Listed
  • FCC
  • CE
  • EN50155 & EN50121-3-2 EMC Conformity
 
* Barebone Pricing Only; Sales team to review component configuration and price

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RCO-3000-RPL?

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Specification

System
Processor Support 12/13th Gen Intel® ADL & RPL Processor (LGA 1700, 35W TDP)
- Intel® Core™ i9-13900TE/i9-12900TE, up to 24 Cores, 36MB Cache, up to 5 GHz, 35W
- Intel® Core™ i7-13700TE/i7-12700TE, up to 16 Cores, 30MB cache, up to 4.8 GHz, 35W
- Intel® Core™ i5-13500TE/i5-12500TE, up to 14 Core, 24MB Cache, up to 4.5 GHz, 35W
- Intel® Core™ i3-13100TE/i3-12100TE, up to 4 Cores, 12MB Cache, up to 4.1 GHz, 35W
System Chipset Intel® Q670 Express Chipset
LAN Chipset 2.5 GbE1: Intel I226 (Support Wake-on-LAN and PXE, Support TSN)

2.5 GbE2: Intel I226 (Support Wake-on-LAN and PXE, Support TSN)
Audio Codec Realtek ALC888S
System Memory 1x DDR5 4800/5600MHz SODIMM. Max. up to 32GB
Graphics Integrated Intel® UHD Graphics 770/730
BIOS AMI 256Mbit SPI BIOS
Watchdog Software Programmable Supports 1~255 sec. System Reset
AI Accelerator Supports up to 4x Hailo-8™ modules
TPM TPM 2.0
Display
Display Port 4x DisplayPort, support resolution 4096 x 2304,
Up to 7680 x 4320 (1x DP Port Co-layout HDMI Connector)
HDMI Yes, Shared by 1x DP port
Multiple Display 4x Independent Displays
Storage
SSD/HDD 1x 9mm 2.5" SATA SSD Bay (Internal)

1x 7mm 2.5" SATA SSD Bay (Hot-swappable)

Support RAID 0, 1, 5
Expansion
M.2 B-Key 1x M.2 B key Type: 2242/3042/3052
• Support PCIe x2/PCIe x1 & USB 3.2 Gen1
• Support NVMe Storage/Hailo AI Module/4G/5G

1x M.2 B key Type: 2242/3042/3052
• Support PCIe x2/SATA signal
• Support NVMe/SATA Storage/Hailo AI Module/4G/5G
M.2 E-Key 1x M.2 E key slot (2230)
• Support PCIe x1 & USB 2.0; Support CNVi
• Support Wifi Module
SIM Socket 1x External Mini SIM socket
1x External Dual Nano SIM socket
Expansion Modules EDGEBoost I/O Bracket:
• 4-port 1GbE module with Intel® I350 Chipset, RJ-45 or M12 connector (PoE optional)
• 2-Port 10GbE RJ45 with Intel X710 Chipset
• 4-Port USB with Renesas uPD720201K8 host controller (share PCIe Gen2 x1 bandwidth)
• 1x RJ45 port for OOB Management Module
• 1x M.2 M-Key (PCIe x4 Lane, 2242/2260) for NVMe/AI Module
• 2x M.2 B-Key 2242/3042/3052:
- 2x M.2 (PCIe x2 Lane) for NVMe/AI Module or
- 1x M.2 (PCIe x2 Lane) for NVMe/AI Module and 1x M.2 (PCIe x1 Lane + USB 3.2 Gen 1) for 4G/5G Module, 1x External SIM socket (M.2 attached)
I/O
Audio 1x Line-out
CAN 2x CAN 2.0 A/B 2-pin Internal header
COM 3x RS-232/422/485 (Optional Isolation)
DIO 8 in / 8 out (Isolated)
LAN 2x 2.5GbE RJ45
USB 6x USB 3.2 Gen 2 (10Gbps)
Others 5x WiFi Antenna Holes

1x Power Switch, 1x AT/ATX Switch, 1x Remote Power On/Off

1x PC/Car Mode Switch, 1x Delay Time Switch

1x Clear CMOS Switch

1x Mic In Header (Internal)
Operating System
Windows Windows 10
Linux Linux kernel 5.x
Power
Power Adapter Optional AC/DC 24V/9.2A, 220W

Optional AC/DC 24V/11.67A, 280W
Power Mode AT, ATX
Power Ignition Sensing Power Ignition Management
Power Supply Voltage 9~48VDC
Power Connector 3-pin Terminal Block
Power Protection OVP (Over Voltage Protection)

OCP (Over Current Protection)

Reverse Protection
Environment
Operating Temperature -25°C to 70°C (35W CPU)
Storage Temperature -30°C to 85°C
Relative Humidity 10% to 95% (non-condensing)
Certification UL 62368 Ed. 3, CE, FCC Class A,

EMC Conformity with EN50155 & EN50121-3-2
Vibration With HDD: 1 Grms (5 - 500 Hz, 0.5 hr/axis)
With SSD: 5 Grms (5 - 500 Hz, 0.5 hr/axis)
Shock With SSD: 50G half-sin 11ms
Physical
Dimensions 192 (W) x 227 (D) x 60.3 (H) mm
Weights 2.8kg - 3.6 kg
Construction Extruded Aluminum with Heavy Duty Metal
Mounting Options Wall Mounting kit with Vibration Isolation
DIN Rail Mounting (optional)

Mechanical Layout

Product Dimension

Unit:mm

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