RCO-3000-RPL Small Form Factor Computer with LGA 1700 for 12/13th Gen Intel CPU & Q670E PCH, 2x LAN

RCO-3000-RPL Small Form Factor Computer with LGA 1700 for 12/13th Gen Intel CPU & Q670E PCH, 2x LAN

  • Support 12/13 Gen Intel® RPL S Processor (LGA 1700, 35W TDP)
  • Intel® Q670E Express Chipset
  • 4x Independent Displays
  • 2x Intel® 2.5GbE supporting Wake-on-LAN and PXE, 3x External SIM socket
  • 2x 2.5" SATA SSD Bay (1x Internal) with RAID 0, 1, 5 support
  • 1x M.2 E Key, 2230 (PCIe x1, USB 2.0)
  • 1x M.2 B Key, 2242/3042/3052 (PCIe x2,or PCIe x1 & USB 3.2 Gen1; Support AI Module/NVMe Storage/4G/5G)
  • 1x M.2 B Key, 2242/3042/3052 (PCIe x2 or SATA; Support AI Module/NVMe/SATA Storage/4G/5G)
  • 3x RS-232/422/485, 6x USB 3.2 Gen 2 (10 Gbps)
  • 8x DI + 8x DO with isolation
  • 9 to 48VDC Wide Range Power Input Supporting AT/ATX Mode
  • Wide Operating Temperature (-25°C to 70°C)
  • TPM 2.0 Supported
See Datasheet

Model:

RCO-3000-RPL

RCO-3000-RPL

Certifications:

Intel Partner
AWS Greengrass IoT

Real-time Performance

Rich IoT Connectivity

Modular EDGEBoost I/O

Small Form Factor

Super-Rugged Durability

 
 

Edge Workload Ready

Intel® 13th Gen Hybrid P & E Cores

  • Intel® Core™ i3/i5/i7/i9 Core TE Processors (35W TDP)
  • Up to 24 Cores (8 P-Cores, 16 E-Cores)
  • Up to 32 Threads
  • Additional L2 & L3 Cache

DDR5 Speed for Volatile Workloads

• 1x DDR5 4800/5600MHz SODIMM

Modular EDGEBoost I/O: Flexible IoT Connectivity

4x Port GbE/PoE RJ45 Connectors

4x Port GbE/PoE M12 Connectors

2x Port 10GbE RJ45 Connector

4x Port USB 3.2 Gen 1

5G, Edge AI, and NVMe Storage

Out-Of-Band Device Management

Beyond the Network: Out-Of-Band Management

Gain easy and reliable 24/7 remote management for your edge deployments even when the OS is unresponsive. Utilizing the Allxon Portal (a secure cloud-based management platform from Allxon), IT teams are able to tap into:

  • Dedicated RJ45 port for secure, hardware-level access,
  • Control hardware at the BIOS level for power cycling and troubleshooting
  • Recover systems remotely even when the OS or main network is down
  • Manage devices centrally across distributed edge mesh network deployments
 

Hot-swappable High-Capacity SATA

  • 1x Internal 2.5” SATA SSD Bay
  • 1x Hot-swappable 2.5” SATA SSD Bay

M.2 Performance Acceleration

• 2x M.2 B-Key for: NVMe/SATA storage, Edge AI TPU, 5G
• 1x M.2 E-Key for: WiFi 6E

NVMe SSD

High-speed data aggregation

Industrial 5G

Reliable low-latency wireless communications

Hailo-8 AI accelerator

Power lite to mid-level AI workloads

Automation & Mobile IoT Ready

  • 16-bit Isolated DIO (8in, 8out)
  • CAN Bus (2-channel)
  • Power Ignition Management

  • WiFi 6E
  • Bluetooth 5.3
  • 5G/4G/LTE

Built Super-Rugged. Built Ready

  • Wide Operating Temperatures (-25℃ to 70℃)
  • Shock & Vibration Resistance (MIL-STD-810G)
  • Wide Power Input (9~48VDC)
  • Power Protection (OCP, OVP, RPP)

World-Class Safety Certifications

  • UL Listed
  • FCC
  • CE
  • EN50155 & EN50121-3-2 EMC Conformity
 
* Barebone Pricing Only; Sales team to review component configuration and price
*Starting At: $1,148.00

Specification

System
Processor Support 12/13th Gen Intel® ADL & RPL Processor (LGA 1700, 35W TDP)
- Intel® Core™ i9-13900TE/i9-12900TE, up to 24 Cores, 36MB Cache, up to 5 GHz, 35W
- Intel® Core™ i7-13700TE/i7-12700TE, up to 16 Cores, 30MB cache, up to 4.8 GHz, 35W
- Intel® Core™ i5-13500TE/i5-12500TE, up to 14 Core, 24MB Cache, up to 4.5 GHz, 35W
- Intel® Core™ i3-13100TE/i3-12100TE, up to 4 Cores, 12MB Cache, up to 4.1 GHz, 35W
System Chipset Intel® Q670E Express Chipset
LAN Chipset 2.5 GbE1: Intel I226 (Support Wake-on-LAN and PXE, Support TSN)

2.5 GbE2: Intel I226 (Support Wake-on-LAN and PXE, Support TSN)
Audio Codec Realtek ALC888S
System Memory 1x DDR5 4800/5600MHz SODIMM. Max. up to 32GB
Graphics Integrated Intel® UHD Graphics 770/730
BIOS AMI 256Mbit SPI BIOS
Watchdog Software Programmable Supports 1~255 sec. System Reset
AI Accelerator Supports up to 4x Hailo-8™ modules
TPM TPM 2.0
Display
Display Port 4x DisplayPort 1.4a, support resolution 4096 x 2304,
Up to 7680 x 4320 (1x DP Port Co-layout HDMI Connector)
HDMI Yes, Shared by 1x DP port
Multiple Display 4x Independent Displays
Storage
SSD/HDD 1x 9mm 2.5" SATA SSD Bay (Internal)

1x 7mm 2.5" SATA SSD Bay (Hot-swappable)

Support RAID 0, 1, 5
Expansion
M.2 B-Key 1x M.2 B key Type: 2242/3042/3052
• Support PCIe x2/PCIe x1 & USB 3.2 Gen1
• Support NVMe Storage/Hailo AI Module/4G/5G

1x M.2 B key Type: 2242/3042/3052
• Support PCIe x2/SATA signal
• Support NVMe/SATA Storage/Hailo AI Module/4G/5G
M.2 E-Key 1x M.2 E key slot (2230)
• Support PCIe x1 & USB 2.0; Support CNVi
• Support Wifi Module
SIM Socket 1x External Mini SIM socket
1x External Dual Nano SIM socket
Expansion Modules EDGEBoost I/O Bracket:
• 4-port 1GbE module with Intel® I350 Chipset, RJ-45 or M12 connector (PoE optional)
• 2-Port 10GbE RJ45 with Intel X710 Chipset
• 4-Port USB with Renesas uPD720201K8 host controller (share PCIe Gen2 x1 bandwidth)
• 1x RJ45 port for OOB Management Module
• 1x M.2 M-Key (PCIe x4 Lane, 2242/2260) for NVMe/AI Module
• 2x M.2 B-Key 2242/3042/3052:
- 2x M.2 (PCIe x2 Lane) for NVMe/AI Module or
- 1x M.2 (PCIe x2 Lane) for NVMe/AI Module and 1x M.2 (PCIe x1 Lane + USB 3.2 Gen 1) for 4G/5G Module, 1x External SIM socket (M.2 attached)
I/O
Audio 1x Line-out
CAN 2x CAN 2.0 A/B 2-pin Internal header
COM 3x RS-232/422/485; 2x RS-232/422/485 Internal header
DIO 8 in / 8 out (Isolated)
LAN 2x 2.5GbE RJ45
USB 6x USB 3.2 Gen 2 (10Gbps)
Others 5x WiFi Antenna Holes

1x Power Switch, 1x AT/ATX Switch, 1x Remote Power On/Off

1x PC/Car Mode Switch, 1x Delay Time Switch

1x Clear CMOS Switch

1x Mic In Header (Internal)
Operating System
Windows Windows 10/11
Linux Linux kernel 5.x
Power
Power Adapter Optional AC/DC 24V/9.2A, 220W

Optional AC/DC 24V/11.67A, 280W
Power Mode AT, ATX
Power Ignition Sensing Power Ignition Management
Power Supply Voltage 9~48VDC
Power Connector 3-pin Terminal Block
Power Protection OVP (Over Voltage Protection)

OCP (Over Current Protection)

Reverse Protection
Environment
Operating Temperature UL 61010-2: -25°C to 50°C (35W CPU)
CE/FCC/IC: -25°C to 70°C (35W CPU)
Storage Temperature -30°C to 85°C
Relative Humidity 10% to 95% (non-condensing)
Certification UL 61010-1, 3rd Ed
UL 61010-2-201, Edition 2
CE, FCC Class A
EMC Conformity with EN50155 & EN50121-3-2
Vibration With HDD: 1 Grms (5 - 500 Hz, 0.5 hr/axis)
With SSD: 5 Grms (5 - 500 Hz, 0.5 hr/axis)
Shock With SSD: 50G half-sin 11ms
Physical
Dimensions 192 (W) x 227 (D) x 60.3 (H) mm
Weights 4.8kg - 5 kg
Construction Extruded Aluminum with Heavy Duty Metal
Mounting Options Wall Mounting kit with Vibration Isolation
DIN Rail Mounting (optional)

Mechanical Layout

Product Dimension

Unit:mm

AI Benchmarks

Intel® Edge Software Device Qualification (ESDQ)

Type
Use Case
Link
Metro AI Suite is an application framework with libraries, tools, and reference implement ations to build AI solutions in the Video Safety and Security, Transportation, and Government Edge markets.
Go To Compare