JCO-3000-ORN-A_2L Mid-Range AI Edge Computer with NVIDIA Jetson Orin™ NX/NANO, 2x LAN
JCO-3000-ORN-B_4L Mid-Range AI Edge Computer with NVIDIA Jetson Orin™ NX/NANO, 4x LAN

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JCO-3000-ORN-A_2L Mid-Range AI Edge Computer with NVIDIA Jetson Orin™ NX/NANO, 2x LAN

SKU Alias: JCO-3000-ORN-A

  • NVIDIA® Jetson Orin™ NX 8GB/16GB or Nano 8GB/4GB GPU with 32 Tensor Cores
  • 1x HDMI 2K (2560 x 1440) 60Hz
  • 2x GbE LAN
  • 1x External Micro SIM socket
  • 1x M.2 (M Key, 2242/2280, PCIex 4, Support NVMe)
  • 4x USB 3.0, 1x Micro USB (OTG)
  • 4x DI + 4x DO with Isolation
  • 12 to 24VDC Wide Range Power Input Supporting AT Mode
  • Wide Operating Temperature -20°C to 55°C (25W, NX/Nano Module)



NVIDIA Jetson Orin NX and Nano Modules

The NVIDIA Jetson Orin NX and Orin Nano modules are pivotal in enhancing edge AI capabilities, providing substantial AI performance with efficient power consumption.

AI Performance TDP Applications
Orin NX 70 -100 TOPS 10W - 25W A wide range of edge applications
Orin Nano 20 – 40 TOPS 7W - 15W Edge device and IIoT

Built Rugged, Built Ready for Edge AI

  • Wide Operating Temperature (-20°C to 55°C)
  • Shock & Vibration Resistant (MIL-STD-810G Compliant)
  • TPM 2.0

Configurable PoE+ for Machine Vision

The JCO-3000 Series supports up to 4x RJ45 PoE+ ports designed to support flexible network configurations and IoT vision cameras.

JCO-3000-ORN-A_2L: 2x RJ45 GbE

JCO-3000-ORN-B_4L: 4x RJ45 GbE/Optional PoE+

Isolated DIO Signal Transmission

The JCO-3000 Series is designed to support isolated DIO ports with two distinct configurations for a wide range of industrial applications:

  • JCO-3000-ORN-A_2L: 8x DIO (4 in / 4 out) configuration
  • JCO-3000-ORN-B_4L: 16x DIO (8 in / 8 out) configuration

Remote Mangement and Wireless Connectivity

Gain remote management and wireless connectivity on JCO-3000-ORN through Out-of-Band (OOB) module, SIM card, M.2 B Key and E Key.

  • on-board Out-Of-Band (OOB) device management module accessed through 1x RJ45
  • Allows remote device management of Edge AI deployments with 24/7 monitoring and management features
  • 1x SIM slot for 5G & 4G/LTE connectivity
  • M.2 E Key for WiFi and Bluetooth

Balanced I/O Configuration

  • Built-in CAN Bus
  • 4x USB 3.0 & 1x Micro USB
  • 1x HDMI Port
  • Dual Serial Ports

Why Premio? Built Rugged. Built Ready.

  • 30+ years of extensive design expertise for industrial-grade compute, storage, rich I/O, and high-speed connectivity
  • Global turnkey manufacturing and support infrastructure in the USA
  • Regulatory testing and compliance for rugged industrial computers
  • Long Product Life Cycles to ensure reliability
* Barebone Pricing Only; Sales team to review component configuration and price

Interested In

Contact Us


Processor - NVIDIA® Jetson Orin™ NX/Nano GPU with 32 Tensor Cores
• 16 GB: 1024-core NVIDIA Ampere architecture GPU (25W/100 TOPS)
• 8 GB: 1024-core NVIDIA Ampere architecture GPU (20W/70 TOPS)
• 8 GB: 1024-core NVIDIA Ampere architecture GPU (15W/40 TOPS)
• 4 GB: 512-core NVIDIA Ampere architecture GPU (10W/20 TOPS)
LAN Chipset GbE1: RGMII
GbE2: Intel LAN Chip
HDMI 1x HDMI 2K (2560*1440) 60Hz
M.2 1x M.2 (M Key, 2242/2280, PCIe x4, NVMe) (Default 128GB)
SIM Socket 1x External Micro SIM Socket (M.2 B Key attached)
M.2 1x M.2 (B Key, 3042/3052, USB 3.2 Gen1, Support 4G/5G)
1x M.2 (E Key, 2230, PCIe x1, USB 2.0, Support Wi-Fi/Bluetooth)
COM 2x RS-232/485 (Internal, switch by Jumper)
DIO 4 in / 4 out (Isolated)
LAN 2x RJ45
OOB 1x RJ45 (Optional OOB Management Module, Optional, Occupied 1x COM)
USB 4x USB 3.0 ( Shared with USB 3.2 Gen 2 Hub)
1x Micro USB ( OTG)
Others 6x WiFi Antenna Holes
1x Power Switch
1x CMOS Battery Cable
1x 4-Pin FAN Connector
Operating System
Linux Linux Ubuntu 20.04 with JetPack
Power Adapter AC/DC 12V/5A, 60W (Optional)
Power Mode AT
Power Supply Voltage 12~24V
Power Connector 3-pin Terminal Block
Power Protection OVP (Over Voltage Protection);

OCP (Over Current Protection)

Reverse Protection
Operating Temperature -20°C to 55°C (25W, NX Module)
-20°C to 60°C (15W, Nano Module)
Tested according to:
IEC60068-2-1:2007 (Cold test procedure)
IEC60068-2-2:2007 (Dry heat test procedure)
IEC60068-2-3:2007 (Damp heat, steady state, test procedure)
IEC60068-2-14:2009 (Wide temperature range thermal shock)
Storage Temperature -30°C to 85°C
Relative Humidity 10% to 95% (non-condensing)
Certification EMC:
   • CE
   • FCC Class A (47 CFR part 15.109 and part 15.107)
   • ICES-003
   • UKCA
   • UL Safety Pending: UL62368-1, 3rd Ed., (cULus)
   • Test prcedure: CB Scheme
   • Standard: IEC 62368-1:2018
Green Product:
   • RoHS 3.0 (Directive 2015/863/EU)
   • REACH
Vibration IEC60068-2-64:2008
With SSD: 5 Grms (5 - 500 Hz, 0.5 hr/axis)
Designed to comply with MIL-STD-810G Method 514.7 Procedure I
Shock IEC60068-2-27:2008
With SSD: 50G half-sin 11ms
Designed to comply with MIL-STD-810G Method 516.7 Procedure I
Package Drop Test: ISTA 2A
Dimensions (W x H x D) 192 (W) x 140(D) x 58(H) mm
Weights 2.8 ~ 3.6 kg
Construction Extruded Aluminum with Heavy Duty Metal
Mounting Options Wall Mounting/DIN rail (Optional)

Mechanical Layout

Product Dimension