BCO-6000-RPL Industrial Computer with 12th/13th Gen Intel® IoTG Processor, 2x DP, 1x HDMI, 2x COM, 3x LAN, 1x PCIe x16 (or 2x PCIe x8) Expansion

Coming Soon

BCO-6000-RPL Industrial Computer with 12th/13th Gen Intel® IoTG Processor, 2x DP, 1x HDMI, 2x COM, 3x LAN, 1x PCIe x16 (or 2x PCIe x8) Expansion

  • Support 12th/13th Gen Intel® IoTG Processor Core i9/i7/i5/i3, Pentium, Celeron (35W only)
  • DDR4 SODIMM. Max. up to 64GB (Default: 8GB)
  • 2x Display Port, 1x HDMI, Triple Independent Display
  • 3x 2.5GbE LAN
  • 1x M.2 M-Key (Default: 128GB SSD), 1x M.2 E-key, 1x M.2 B-key
  • 4x COM, 6x USB 3.2 Gen 2, 2 USB 3.2 Gen 1, x2 USB 2.0
  • 1x PCIe x16 Slot (or 2x PCIe x8 Slot)
  • 19 to 36VDC Wide Range Power Input Supporting AT/ATX Mode
  • Wide Operating Temperature 0°C to 50°C
  • TPM 2.0 Supported
  • CE, FCC Class A




Intel Partner

PCIe Expansion for GPU Support

IoT-Centric Connectivity

Wide Operating Temperature

Shock And Vibration

TPM 2.0 Security

Powerful, Multi-core Processing

  • Up to 24 Cores: 8 P-Cores, 16 E-Cores
  • Up to 32 Threads
  • Increased L2 & L3 Cache
  • 35W TE (Power-Optimized Embedded) Processors

Rich IIoT-Centric Connectivity

With various IoT devices requiring different connection types, the BCO-6000-RPL is tailored to provide industrial IoT-specific I/O on-board. From high-speed LAN to automation-focused DIO ports, this inference computer offers seamless I/O compatibility and consolidation.

GPU Integration for Edge Processing

  • 1x PCIe x16 Gen 4 or 2x PCIe x8 Gen 4
  • Supports GPU Expansion (NVIDIA RTX A2000)

Slim Design for Maximum Performance

The BCO-6000-RPL features a low profile, slim design that makes it optimal to fit within many industrial deployments.

Industrial Grade Design

Following a slim industrial grade design, the BCO-6000-RPL is engineered with operational reliability in harsh industrial environments and conditions.

  • Slim, Semi-Rugged Design
  • Wide Operating Temperature: 0°C to 50°C
  • Shock & Vibration Resistant (MIL-STD-810G Compliant)
  • Wide Power Input: 19 to 36VDC
* Barebone Pricing Only; Sales team to review component configuration and price

Interested In

Contact Us


Processor Intel® IOTG:
• 12th/13th Gen Intel® Core™ Processor i9/i7/i5/i3, Pentium, Celeron (35W only)
System Chipset Intel® Q670E Express Chipset
LAN Chipset Intel® I225LM PCIe 2.5GbE LAN
Intel® I225V PCIe 2.5GbE LAN
Intel® I225LV PCIe 2.5GbE LAN
Audio Codec Realtek ALC897
System Memory DDR4 3200MT/s SODIMM. Max. up to 64 GB (Default: 8GB & Non- ECC supported)
Graphics • Intel® UHD Graphics
• GPU Graphics
Watchdog Software Programmable Supports 1~255 sec. System Reset
AI Accelerator Supports 1x Hailo-8™ module through M.2 B-Key
Display Port 2x Dual Mode DisplayPort 1.4a
Max Resolution 4096 x 2304 @60Hz
HDMI 1x HDMI 1.4b
Max Resolution 4096 x 2304 @24Hz
Multiple Display 3x Independent Displays
M.2 M-Key 1x M.2 M-key Type (2242/2280):
• Support 1x PCIe x4 Gen 3 NVMe SSD From PCH (Default 128GB SSD)
• Support B+M Key, AI/Storage Module (Pending)
M.2 B-Key 1x M.2 B-key ( 3042)
• Support 1x Nano SIM Holder
• Support 1x PCIe x1, 1x USB 3.2 Gen 2, 1x USB 2.0, 5G/4G/LTE Module
M.2 E-Key 1x M.2 E key ( 2230)
• Support 1x PCIe x1, 1x USB 2.0; Support CNVi
• Devices Supported: Intel® AX210 Wi-Fi 6E & BT-5.1 (vPro Supported)
PCIe Optional:
• 2x PCIe x8 or
• 1x PCIe x16 (Support A2000 GPU)
Network Modules Optional Through M.2 B-Key:
• 5G/4G/LTE Module
Audio Line-out/Mic-in
COM 4x DB9
COM1: RS232/422/485
COM2: RS232/422/485
COM3: RS485
COM4: RS485
DIO 8 in / 8 out (Isolated)
LAN 3x RJ45 (2.5GbE)
USB 8x USB 3.2 Gen 2 Type-A
2x USB 2.0 Type-A
Others • 5x Antenna Holes
• 1x Power button
• 1x HD LED
• 1x Power LED
• 1x Default Industrial Fan
Operating System
Windows Windows 10/11
Linux Linux Kernel
Power Adapter Optional AC/DC 24V/9.2A, 220W for CPU and GPU Expansion
Power Mode AT, ATX
(Default ATX)
Power Supply Voltage 19~36VDC Default
24~36VDC for add GPU Card
Power Connector 4-pin Terminal Block
Operating Temperature 0°C to 50°C (35W CPU)
Tested according to:
IEC60068-2-1:2007 (Cold test procedure)
IEC60068-2-2:2007 (Dry heat test procedure)
IEC60068-2-3:2007 (Damp heat, steady state, test procedure)
IEC60068-2-14:2009 (Wide temperature range thermal shock)
Storage Temperature -30°C to 85°C
Relative Humidity 10% to 95% (non-condensing)
Certification EMC:
   • CE
   • FCC Class A (47 CFR part 15.109 and part 15.107)
   • ICES-003
   • UKCA
Green Product:
   • RoHS 3.0 (Directive 2015/863/EU)
   • REACH
Vibration IEC60068-2-64:2008
With SSD: 5 Grms (5 - 500 Hz, 0.5 hr/axis)
Designed to comply with MIL-STD-810G Method 514.7 Procedure I
Shock IEC60068-2-27:2008
With SSD: 50G half-sin 11ms
Designed to comply with MIL-STD-810G Method 514.7 Procedure I
Package Drop Test: ISTA 2A
Dimensions (WxDxH) 330 x 240 x 69mm
Construction Extruded Aluminum with Heavy Duty Metal
Mounting Options Wall Mounting

Mechanical Layout

Product Dimension