Overview
A startup building an autonomous pre-roll packaging system set out to find a computing backbone capable of keeping pace with its fast, precision-driven machinery. It turned to a semi-rugged fanless industrial PC that could deliver reliable performance in a compact form factor small enough to disappear inside the machine’s crowded electrical cabinet. With this platform in place, the team confidently met the system’s demanding needs for connectivity, long-term stability, and industrial durability in a continuously moving environment.
Challenges
- Need for a small form factor PC that supports a 35W embedded CPU
- Demand for long-cycle product support to ensure system longevity
- Need for sufficient memory capacity to support automation workloads
- Requirement for 3× LAN ports and at least 6× USB ports
- Industrial-grade design requirements including shock, vibration, and wide temperature tolerance
Solution
- Premio’s semi-rugged fanless industrial PC (BCO-3000-RPL)
- The system integrated an Intel 13th Gen Raptor Lake Core 35W CPU to deliver sufficient processing power in a compact footprint
- Utilized “-TE” class CPUs to guarantee a minimum of 10 years of life-cycle support from Intel
- Supported high-capacity DDR4 memory to meet performance requirements for the automation workload
- Provided 3× LAN ports and 10× USB ports, exceeding connectivity needs
Benefits
- Custom BIOS/OS image delivered enhanced security and optimized performance for packaging operations
- Strong application engineering and technical support from the vendor ensured smooth deployment and integration
- Local support availability facilitated rapid response and simplified maintenance
Company Overview
The organization is a startup developing autonomous systems that streamline pre-roll packaging for businesses seeking higher efficiency and ROI from their production lines. Its solutions integrate mechanical engineering, automation controls, and embedded computing to deliver a fully turnkey packaging workflow. With a strong focus on reliability, scalability, and throughput optimization, the company is well positioned to expand its technology into broader automated packaging markets.
The Challenges
Compact Form Factor with High CPU Requirement
A compact machine layout required a computing solution capable of supporting a 35W embedded CPU without increasing system bulk. The electrical cabinet housing the PC had strict dimensional limits, ruling out standard industrial enclosures. Only a purpose-built compact platform could deliver the processing headroom needed for real-time automation.
Connectivity for Networking and Peripheral Integration
Automation performance depended on reliable network communication and peripheral support. The control system needed at least three LAN ports and six USB ports to connect sensors, actuators, and onboard subsystems. Without sufficient connectivity, data flow and machine coordination would have been restricted, reducing the reliability of the packaging process.
Industrial Durability for Harsh Conditions
The machine operated in an environment exposed to vibration, motion, and fluctuating temperatures. The PC needed rugged construction with shock and vibration tolerance as well as wide temperature capability to ensure stability. A non-industrial system risked premature failure, downtime, and compromised production output.
Long-Term Product Life Cycle Support
Because the machine serves as a long-term investment for customers, continuity of component availability was essential. Without long-life support, redesigns or replacements would become costly and disruptive. Guaranteeing predictable supply ensured the platform could scale and evolve without interruption.
Memory Capacity for Automation Processing
As the automation workload grew more data-intensive, the system required reliable memory resources to maintain performance. Higher memory capacity supported control logic, sensor processing, and data throughput without bottlenecks. Adequate memory ensured the machine could perform consistently even under expanded operational demands.
The Solution
Premio’s semi-rugged fanless industrial PC (BCO-3000-RPL)
This compact industrial system combined rugged construction, wide temperature performance, and strong compute capability within a fanless design optimized for enclosed control cabinets. Its architecture ensured stable automation performance while minimizing maintenance and risk of contamination inside the machine.
Industrial-Grade Reliability
The platform’s compliance with shock, vibration, and wide-temperature operation ensured resilience in mechanically active environments. This rugged performance safeguarded uptime and reduced the likelihood of component failures. The system maintained stability even under continuous motion inside the packaging equipment.
Powerful Embedded CPU in a Space-Efficient System
Equipped with an Intel 13th Gen Raptor Lake Core i5-13500TE processor, the system delivered the compute resources needed for automation workflows. The compact design avoided cabinet redesign while supporting complex sensor inputs and control cycles. The semi-rugged build ensured dependable operation under continuous load.
Life-Cycle Assurance and Memory Scalability
Use of “-TE” class components ensured at least 10 years of life-cycle support for core CPU technology. High-capacity DDR4 memory support enabled smooth processing of data-heavy automation tasks. Together, they provided long-term reliability and performance scalability for future software enhancements.
High-Capacity Connectivity for Automation Devices
Three LAN ports and ten USB ports exceeded baseline requirements for networking and peripheral integration. This broad connectivity allowed seamless expansion of sensors, actuators, and diagnostic tools as the machine evolved. Reliable I/O ensured consistent communication across all automation subsystems.
The Benefits
Secure and Optimized Operation
The custom BIOS/OS image allowed enhanced security filters and performance tuning tailored to the packaging system, helping ensure stable, optimized automation operations.
Reliable Technical and Local Support
Strong application engineering and technical support, along with local support availability, made deployment and maintenance smooth, reducing integration complexity and enabling quick issue resolution.
Long-Term Reliability and Reduced Maintenance Overhead
With a rugged, fanless design and extended life-cycle support, the PC provided reliable operation over a long period of time, minimizing maintenance and replacement costs.
Conclusion
Deploying the BCO-3000-RPL semi-rugged fanless industrial PC enabled the startup’s automated pre-roll packaging system to meet stringent space, connectivity, and ruggedness demands while ensuring long-term reliability. The tailored hardware and support ecosystem helped transform a complex automation requirement into a stable and efficient solution; delivering strong ROI and positioning the company for scalable growth in the cannabis packaging market.