About Pack Expo International 2024
As the largest packaging and processing show of the year, Pack Expo international brings together 45,000 attendees and 2,6000 exhibitors from over 40 different vertical markets to showcase their solutions and connect with each other.
As leaders in rugged edge computing and rugged edge AI, Premio will be exhibiting at booth N-5581 to showcase our latest edge solutions for all kinds of machine vision applications that leverage real-time data processing, storage, and telemetry for Edge AI. We look forward to seeing you there!
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Industry 4.0 Packaging & Processing Trends Powered by Industrial Computers
- Integrating Smarter IoT Solutions for Improved Packaging Processes
- AGV & AMR for Automated Material Handling
- Ensuring Highest Quality with Machine Vision Inspection
- Wireless Connectivity for M2M Communication with Public/Private 5G Networks
- HMI Integration with IP Rated Industrial Touchscreen Computers
1. Integrating Smarter IoT Solutions for Improved Packaging Processes
Industry 4.0 packaging and processing, also known as Packaging 4.0, is the adoption of digital transformation to significantly streamline processes by integrating AI technologies. By gathering data from all machinery and IoT devices for a homogenous data flow ecosystem, factory control centers gain real-time data transparency and can make actionable decisions to enhance productivity, worksite safety, and efficiency. Industrial computers and edge computing play a vital role in enabling Packaging 4.0 applications by providing real-time edge AI performance, consolidating various IoT devices, and ensuring 24/7 operational reliability.
2. AGV & AMR for Automated Material Handling
AGV and AMRs are pioneering the material handling industry with fully autonomous productivity. These advanced robotics aim to address logistical bottlenecks, improve operation productivity, and increase worksite safety. However, for AGVs to work efficiently, it requires a few key attributes: low-latency processing, IoT connectivity, and in-vehicle durability. Industrial computers, like our RCO and JCO Series, address these demands by processing AI workloads in real-time and ensure mission-critical reliability for 24/7 uptimes.
3. Ensuring Highest Quality with Machine Vision Inspection
AI metrology applications are transforming quality inspection control by detecting anomalies and defects that are imperceptible to the human eye at remarkable speeds. These highly precise models efficiently identify and remove defective products before they reach the packaging stage, ensuring the highest quality standards for consumers and end users. By catching flaws early, AI-powered inspection minimizes the risk of costly recalls and enhances customer satisfaction, ultimately safeguarding brand reputation and improving operational efficiency.
Premio's machine vision computers are specifically engineered to optimize these demanding AI workflows in real time, even under harsh factory conditions. With support for dedicated GPU accelerators, these systems can swiftly process high-resolution data from IoT devices, detect defects with AI, and efficiently remove any faulty items, streamlining quality control and improving throughput in industrial environments.
4. Wireless Connectivity for M2M Communication with Public/Private 5G Networks
Within the packaging and processing space, wireless connectivity for machine-to-machine communication is key to achieve efficient scalability in automation spaces. Communication between devices, sensors, and system without any constraints such as wires or other physical limitations help transform automation processes can be monitored and controlled, providing real-time data acquisition and better decision making.
Premio’s lineup of industrial computers all come with rich wireless connectivity options that include Wi-Fi, Bluetooth, 4G/LTE, and 5G connectivity. These wireless technologies serve as a key catalyst that enables an interconnected and intelligent edge solution to meet the ever-evolving demands of modern packaging and processing operations.
5. HMI Integration with IP Rated Industrial Touchscreen Computers
Human-Machine interface (HMI) integration is increasingly vital in modern packaging and processing operations, enabling efficient interaction between packing operators and automated systems in factory floors. As production lines scale and adopt more complex and data-driven AI/machine vision solutions, advanced HMI Solutions play a crucial role in monitoring workflows, controlling equipment, and maintaining safety.
Premio’s line of panel PCs and HMI solutions are central to advancing HMI integration for smart packaging and processing. With the latest introduction of the HIO and AIO Series, Premio’s comprehensive portfolio helps meet the diverse needs of various applications. These panel PCs are adaptable to various production setups, making them an essential tool for improving operational efficiency and facilitating seamless communication between human operators and automated systems.
Edge Computers Showcasing at Pack Expo 2024
Award Winning JCO-6000 Series
High-Performance NVIDIA Jetson AI Edge Computer
The JCO-6000-ORN Series High-Performance AI Edge Computer is a rugged, fanless computing solution designed for applications such as autonomous forklifts and industrial automation. Powered by NVIDIA Jetson AGX Orin module, it delivers robust AI performance for real-time decision-making in autonomous navigation, obstacle detection, and control systems. With an industrial-grade design and world-class safety certifications, it ensures reliable operation in harsh environments, making it perfect for warehouse automation and manufacturing. The JCO-6000 supports multiple I/O interfaces for seamless integration with sensors, cameras, and equipment, boosting productivity and safety.
Key Features:
- NVIDIA Jetson Orin Modules (Up to 275 TOPS)
- Low-Power Efficiency (Up to 60W TDP)
- Super-Rugged Fanless Design
- Comprehensive IoT Connectivity
- World-Class Certifications (CE, FCC, UL-Listed)
Award Winning
RCO-3000-RPL & RCO-6000-RPL Series
x86 Super-Rugged Small Form Factor & AI Edge Inference Computers
Premio’s flagship line of award-winning x86 Super-Rugged Industrial Computers, the RCO-3000-RPL and RCO-6000-RPL Series, are purpose-built to enable the latest Packaging 4.0 applications. It leverages the latest 13th Gen Intel Core TE processors with performance hybrid architecture to power real-time edge AI workloads such as machine vision inspection. These embedded systems feature super-rugged durability to withstand the rigorous demands of AGV/AMR and factory floor environments, comprehensive IoT connectivity to streamline connect various high-speed and legacy sensors, and modular EDGEBoost technologies to seamlessly meet specific deployment requirements.
Key Features:
- 13th Gen Intel Core TE Processors (35W TDP)
- Super-Rugged Durability
- Comprehensive IoT Connectivity
- Modular EDGEBoost Technologies
- World-Class Certifications (CE, FCC, UL Listed)
VCO-6000-RPL Series Machine Vision Computer
The VCO-6000-RPL Series plays a crucial role in enhancing automation, quality assurance, and operational efficiency. Its dual GPU support and powerful computing capabilities enable real-time processing of high-resolution data from cameras and sensors used in production lines. This allows for the rapid identification of defects, misalignments, or inconsistencies in critical assets at the microscopic level, ensuring quality standards are met.
Key Features:
- 13th Gen Intel Core Processors (35W TDP)
- FHFL (Full-Height, Full-Length) GPU Supported
- Dual-GPU Configurations
- Hot-swappable NVMe Storage Bays
- World-Class Certifications (UL, FCC, CE)
BCO Series x86 Semi-Rugged Industrial Computers
Ubiquitous connectivity and reliability, the BCO series brings industrial grade design to meet the demanding needs at the industrial edge. With support for edge computing, AI, and machine learning, these systems empower packaging and processing operations to adapt to the growing trends of predictive maintenance, data-driven insights, and seamless connectivity across industrial IoT networks.
Key Features:
- Industrial-Grade Reliability
- Real-time Edge AI Performance
- IIoT-Centric Connectivity
- World-Class Certifications (CE, FCC, UL Listed)
Industrial Touch Panel PCs
Premio’s touch panel PCs are rugged and purpose-built for industrial environments, making them ideal for packaging automation on the factory floor. Our extensive lineup includes highly customizable and durable touch panel PCs engineered for the toughest Industry 4.0 and edge computing environments, ensuring reliable performance in all sectors in industrial applications.
Key Features:
- IP Rated Ruggedization
- Low-Power Embedded Processors
- Fanless Design
- PCAP/Resistive Touch Controls
- Flexible & Scalable Design
Industrial SBCs & Motherboards
From OEM /ODM enterprise computing designs to embedded single board computer applications, Premio provides reliability and longevity with standard off-the-shelf industrial grade motherboards for the most challenging embedded deployments. With a comprehensive range of SBCs and Motherboards, from FEMTO-ITX to full-sized ATX, providing the versatility needed to support any edge deployment.
Key Features:
- Standardized Form Factors
- Industrial-Grade Durability
- Wide Operating Temperatures
- Versatile Performance and Sizes