BCO-6000-RPL 産業用コンピュータ、第12/13世代 Intel® IoTG プロセッサー搭載、DP x 2、HDMI x 1、COM x 2、LAN x 3、PCIe x16 (または PCIe x8) 拡張スロット x 1
BCO-6000-RPL 産業用コンピュータ、第12/13世代 Intel® IoTG プロセッサー搭載、DP x 2、HDMI x 1、COM x 2、LAN x 3、PCIe x16 (または PCIe x8) 拡張スロット x 1
• 第12世代/第13世代 Intel® IoTG プロセッサー Core i9/i7/i5/i3、Pentium、Celeron (35Wのみ) に対応
• DDR4 SODIMM スロット x 2。最大。最大64GB(デフォルト:8GB)
• DisplayPort x 2、HDMI x 1、トリプル独立ディスプレイ
• 2.5GbE LAN x 3
• M.2 Mキー x 1(デフォルト:128GB SSD)、M.2 Eキー x 1、M.2 Bキー x 1
• COMポート x 4、USB 3.2 Gen 2 x 6、USB 3.2 Gen 1 x 2、USB 2.0 x 2
• PCIe x16スロット x 1(またはPCIe x8スロット x 2)
• 9~36VDCの広範囲電源入力(AT/ATXモード対応)
• 動作温度範囲:0℃~50℃
• TPM 2.0対応
• CE、FCCクラスA、UL 62368 Ed.3準拠
• DDR4 SODIMM スロット x 2。最大。最大64GB(デフォルト:8GB)
• DisplayPort x 2、HDMI x 1、トリプル独立ディスプレイ
• 2.5GbE LAN x 3
• M.2 Mキー x 1(デフォルト:128GB SSD)、M.2 Eキー x 1、M.2 Bキー x 1
• COMポート x 4、USB 3.2 Gen 2 x 6、USB 3.2 Gen 1 x 2、USB 2.0 x 2
• PCIe x16スロット x 1(またはPCIe x8スロット x 2)
• 9~36VDCの広範囲電源入力(AT/ATXモード対応)
• 動作温度範囲:0℃~50℃
• TPM 2.0対応
• CE、FCCクラスA、UL 62368 Ed.3準拠
モデル:
BCO-6000-RPL認証:
仕様
| System | |
|---|---|
| Processor | Intel® IOTG: • 12th/13th Gen Intel® Core™ Processor i9/i7/i5/i3, Pentium, Celeron (35W only) |
| System Chipset | Intel® Q670E Express Chipset |
| LAN Chipset | Intel® I226LM PCIe 2.5GbE LAN Intel® I226V PCIe 2.5GbE LAN Intel® I226V PCIe 2.5GbE LAN |
| Audio Codec | Realtek ALC897 |
| System Memory | 2x DDR4 3200MT/s SODIMM. Max. up to 64 GB (Default: 8GB & Non- ECC supported) |
| Graphics | • Intel® UHD Graphics • GPU Graphics |
| BIOS | AMI UEFI BIOS |
| Watchdog | Software Programmable Supports 1~255 sec. System Reset |
| AI Accelerator | Supports 1x Hailo-8™ module through M.2 B-Key |
| TPM | TPM 2.0 |
| Display | |
| Display Port | 2x Dual Mode DisplayPort 1.4a Max Resolution 4096 x 2304 @60Hz |
| HDMI | 1x HDMI 1.4b Max Resolution 4096 x 2304 @24Hz |
| Multiple Display | 3x Independent Displays |
| Storage | |
| M.2 M-Key | 1x M.2 M-key Type (2242/2280): • Support 1x PCIe x4 Gen 3 NVMe SSD From PCH (Default 128GB SSD) • Support B+M Key, AI/Storage Module (Pending) |
| Expansion | |
| M.2 B-Key | 1x M.2 B-key ( 3042) • Support 1x Nano SIM Holder • Support 1x PCIe x1, 1x USB 3.2 Gen 2, 1x USB 2.0, 5G/4G/LTE Module |
| M.2 E-Key | 1x M.2 E key ( 2230) • Support 1x PCIe x1, 1x USB 2.0; Support CNVi • Devices Supported: Intel® AX210 Wi-Fi 6E & BT-5.1 (vPro Supported) |
| PCIe | Optional: • 2x PCIe x8 or • 1x PCIe x16 (RTX 2000/4000 support, 70W) |
| Network Modules | Optional Through M.2 B-Key: • 5G/4G/LTE Module |
| I/O | |
| Audio | Line-out/Mic-in |
| COM | 4x DB9 COM1: RS232/422/485 COM2: RS232/422/485 COM3: RS232 COM4: RS232 |
| DIO | 8 in / 8 out (Isolated) |
| LAN | 3x RJ45 (2.5GbE) |
| USB | 6x USB 3.2 Gen2 2x USB 3.2 Gen1 2x USB 2.0 Type-A |
| Others | • 5x Antenna Holes • 1x Power button • 1x HD LED • 1x Power LED • 1x Default Industrial Fan |
| Operating System | |
| Windows | Windows 10/11 |
| Linux | Linux Kernel |
| Power | |
| Power Adapter | Optional AC/DC 24V/9.2A, 220W for CPU and GPU Expansion |
| Power Mode | AT, ATX (Default ATX) |
| Power Supply Voltage | 9~36VDC |
| Power Connector | 4-pin Terminal Block |
| Environment | |
| Operating Temperature | 0°C to 50°C (35W CPU) |
| Storage Temperature | -30°C to 85°C |
| Relative Humidity | 10% to 95% (non-condensing) |
| Certification | UL 62368 Ed. 3, CE, FCC Class A |
| Vibration | With SSD: 5 Grms (5 - 500 Hz, 0.5 hr/axis) |
| Shock | With SSD: 50G half-sin 11ms |
| Physical | |
| Dimensions (WxDxH) | 330 x 240 x 69mm |
| Construction | Extruded Aluminum with Heavy Duty Metal |
| Mounting Options | Wall Mounting |
リソース
| AWS IoT Greengrass |
Premio-Getting-Started-Guide-for-AWS-IoT-Greengrass-BCO-6000-RPL.pdf
|
| Datasheet |
DS_BCO-6000-RPL_Premio.pdf
|
| Modules |
Hailo-8 M.2 Key M ET Datasheet Rev2.2.pdf
Hailo-8 M.2 Key B_M Datasheet Rev1.1.pdf |
| Product Brief |
PB_BCO-3000-6000-RPL.pdf
|
| User's Manual |
UM_BCO-3000-6000-RPL.pdf
|
AIベンチマーク
Intel® Edge Software Device Qualification (ESDQ)
Type
Use Case
Link
Metro AI Suite is an application framework with libraries, tools, and reference implement ations to
build AI solutions in the Video Safety and Security, Transportation, and Government Edge markets.