エッジとクラウドのための堅牢なコンピューティングソリューション

NVIDIA Jetson AGX Orinモジュールを活用した堅牢なファンレスAIエッジコンピュータ（最大275 TOPS）

• モジュール式EDGEBoost I/Oサポート（M12/RJ45、USB、10GbE、PoE）
• USB 3.0 Vision Lockingポート×8
• GMSLカメラ8台用ミニファクラコネクタ×2個
• 帯域外リモート管理のサポート（オプション）

NVIDIA Jetson NXおよびNanoを活用した堅牢なファンレスAIエッジコンピュータ（最大100 TOPS）

• 最大4台のPoEカメラをサポート
• 8x/16x DIOを備えた複数のDIOポート
• リモート管理用帯域外モジュール

NVIDIA Jetson Orin Nano/NXモジュール（最大157 TOPS）を搭載

• 超小型フォームファクター
• 異なる入出力構成を持つ3つの拡張可能なモデル
• OOBリモート管理をサポート
• GMSLカメラ4台に対応

汎用産業用コンピューティングワークロード向け半堅牢型産業用GPUコンピュータ

• x86 Intel Core Embedded Seriesプロセッサー（TDP 35W）を搭載
• スリムで薄型、奥行きの短いシャーシ
• GPU統合
• エッジAI対応
• IIoT向けワイヤレス接続

小型フォームファクタで高性能を実現し、汎用産業用コンピューティングワークロードを効率化

• x86 Intel Core Embedded Seriesプロセッサー（TDP 35W）を搭載
• 広範で豊富な入出力
• M.2拡張
• エッジAI対応
• IIoT向けワイヤレス接続

産業用コンピューティングワークロード向けの、半堅牢型NUC代替機

• x86 Intel Alder Lake Nシリーズプロセッサー搭載
• 省スペース用途向けのコンパクトサイズ
• 産業用NUCの代替品
• IIoT向けワイヤレス接続

Semi-rugged NUC alternative for space limited applications

• Powered by Intel Core Ultra Series 1 Processors
• 11 TOPS of AI performance
• Industrial NUC alternative
• Wireless & Cellular Connectivity for IIoT

Semi-rugged NUC alternative for space limited applications

• Powered by x86 Intel Alder Lake N Series Processor
• Mini form factor for space constrained deployments
• Industrial NUC alternative
• Wireless Connectivity for IIoT

Semi-rugged NUC alternative for space limited applications

• Powered by Rockchip RK3568J Processor
• Mini Form Factor for Space Constrained Deployments
• Rich IIoT Connectivity
• Robust Wireless & Cellular Connectivity

Built for high-performance edge AI workloads with Intel® Core™ Ultra Series 2 processing, integrated NPU acceleration, and next-generation PCIe expansion.

• Intel® Core™ Ultra Series 2, Arrow Lake-S, W880 PCH
• Integrated NPU acceleration
• 2x DDR5 5600MT/s, 96GB Max
• FHFL GPU expansion support
• 24–48V DC input with 600W GPU power budget

Built for advanced edge computing workloads with full-height GPU support, PCIe expandability, and flexible storage support.

• Powered by Intel® Core™ 65W processors
• Full-height GPU support
• PCIe Gen 4 & Gen 5 expansion
• High-speed NVMe & SATA storage
• Internal 500W Flex power supply

Built for space-efficient edge AI deployments with Intel® Core™ processors, low-profile GPU support, and rich industrial I/O connectivity.

• Powered by Intel® Core™ 65W processors
• PCIe Gen 4 & Gen 5 Expansion
• Low-profile GPU Support
• Rich Industrial I/O Connectivity
• Internal 250W Flex Power Supply

Built for rugged edge AI deployments with high-performance Intel® Core™ processing, FHFL dual-GPU support, and fanless computing node design.

• Intel® Core™ 35W/65W processors
• FHFL dual-GPU support
• 600W GPU power budget
• Rugged fanless computing node design

Compact, fanless din-rail industrial computer designed for demanding IoT environments.

• X86 Intel Atom Embedded Processor
• Ultra-rugged fanless with DIN-RAIL Mount
• Up to 4x RJ45 LAN with OOB module

IoT接続と鉄道規格への準拠により、インテリジェント交通システムの導入を統合・効率化するために最適化されています。

• 第10世代インテル Core/Xeon プロセッサー
• 最大16台のIoTデバイス
• ホットスワップ対応SSDベイ×2
• EN50155規格へのEMC適合性およびEマーク認証
• 9～48VDCまたは48～110VDCの電源入力範囲

高度なCPU、I/O構成、およびAIアクセラレーション機能を備えた防水エッジコンピュータ。

• x86 Intel Atom/Celeron Embedded Series プロセッサーを搭載
• IP68/IP69Kの完全システム保護
• 堅牢なM12 I/O構成

Instantaneous power backup with rapid charge and discharge

• 3 configurable smart modes for safe shutdown
• Remote GUI and LCM Display module for customizable settings
• 8x or 16x supercapacitor models
• UL-Listed

Panel PC for Washdown Computing in Hygienic Enivironments

• IP 66/69K Rated
• M12 I/O Connectivity
• Optical Bonding for clarity and longevity
• Automatic Pressure Valve
• Enhanced Stainless Steel Durability and 7H Hardness Touchglass

Interactive, Modular, and Robust Solution for Human Machine Interface (HMI) Deployments

• IP 65 Rated
• 12" to 24" Inch Scalable Display Sizes
• Automation-Ready Connectivity
• Efficient Computing Performance

Compact, Durable, and Simple Solution for Human Machine Interface (HMI) Deployments

• IP65 Front & IP54 Back Rated
• 10.1” to 21.5” Display Sizes
• Versatile I/O Connectivity
• Power Efficient Computing Performance

Interactive, Versatile, and Durable Open Frame Solution for Human Machine Interface (HMI) Deployments

• IP65 Front Rated
• 10.1” to 21.5” Display Sizes
• Open Frame Industrial Design
• Customizable Versatile I/O Connectivity

Industrial Alternative to Elo Open-Frame Touchscreens

• IP65 Front Panel with 7H Glass
• 10-Points PCAP
• 89° Wide Viewing Angles
• World-Class Certified

• Zero-bezel true flat surface
• Slim design
• Easy integration and low maintenance
• Projected Capacitive touch
• Anti-glare cover glass

Deploy on-prem LLM and generative AI workloads for real-time inferencing and decision-making capabilities.

• 13th Gen Intel Core Processor
• Dedicated GPU Acceleration
• Operational Redundancy
• Short-Depth, 1U Form Factor

Optimized for scalable multimodal AI with GPU-accelerated compute, low-latency inference, and enterprise-ready edge deployment.

• AMD Ryzen™ & EPYC Processors (B650 Chipset)
• 2x Broadcom 10GbE SFP+
• Support 2x PCIe x16 Gen 5 slots
• 850W Single Power Supply
• Out-of-Band Management

Built for high-performance agentic AI with GPU-dense acceleration and FLFH support for scalable training, inference, and enterprise AI workloads.

• AMD Ryzen™ & EPYC Processors (B650 Chipset)
• 2x Broadcom 10GbE SFP+
• Support Full-Length Full-Height GPUs
• 850W Single Power Supply
• Out-of-Band Management