邊緣和雲端的堅固計算解決方案

採用NVIDIA Jetson AGX Orin模組的堅固耐用型無風扇AI邊緣電腦（最高可達275 TOPS）

• 模組化 EDGEBoost I/O 支援（M12/RJ45、USB、10GbE、PoE）
• 8 個 USB 3.0 Vision 鎖定連接埠
• 2 個 Mini-Fakra 連接器，用於 8 個 GMSL 攝影機
• 支援帶外遠端管理（可選）

採用NVIDIA Jetson NX和Nano的堅固耐用型無風扇AI邊緣電腦（最高可達100 TOPS）

• 最多支援 4 個 PoE 相機
• 多個DIO端口，帶8x/16x DIO
• 用於遠端管理的帶外模組

採用 NVIDIA Jetson Orin Nano/NX 模組（最高可達 157 TOPS）

• 超緊湊型外形
• 3 種具有不同 I/O 配置的可擴展模型
• 支援帶外遠端管理
• 支援4個GMSL鏡頭

適用於通用工業計算工作負載的半加固型工業GPU計算機

• 採用 x86 IntelCore嵌入式系列處理器（35W TDP）
• 纖薄、低矮、短深度機箱
• GPU集成
• 邊緣人工智慧就緒
• 工業物聯網無線連接

在小尺寸內實現高效能，以簡化通用工業運算工作負載

• 採用 x86 IntelCore嵌入式系列處理器（35W TDP）
• 豐富的I/O介面
• M.2 擴展
• 邊緣人工智慧就緒
• 工業物聯網無線連接

適用於工業運算工作負載的半加固型NUC替代方案

• 搭載 x86 Intel Alder Lake N 系列處理器
• 尺寸緊湊，適用於空間受限的應用
• 工業NUC替代方案
• 工業物聯網無線連接

Semi-rugged NUC alternative for space limited applications

• Powered by Intel Core Ultra Series 1 Processors
• 11 TOPS of AI performance
• Industrial NUC alternative
• Wireless & Cellular Connectivity for IIoT

Semi-rugged NUC alternative for space limited applications

• Powered by x86 Intel Alder Lake N Series Processor
• Mini form factor for space constrained deployments
• Industrial NUC alternative
• Wireless Connectivity for IIoT

Semi-rugged NUC alternative for space limited applications

• Powered by Rockchip RK3568J Processor
• Mini Form Factor for Space Constrained Deployments
• Rich IIoT Connectivity
• Robust Wireless & Cellular Connectivity

Built for high-performance edge AI workloads with Intel® Core™ Ultra Series 2 processing, integrated NPU acceleration, and next-generation PCIe expansion.

• Intel® Core™ Ultra Series 2, Arrow Lake-S, W880 PCH
• Integrated NPU acceleration
• 2x DDR5 5600MT/s, 96GB Max
• FHFL GPU expansion support
• 24–48V DC input with 600W GPU power budget

Built for advanced edge computing workloads with full-height GPU support, PCIe expandability, and flexible storage support.

• Powered by Intel® Core™ 65W processors
• Full-height GPU support
• PCIe Gen 4 & Gen 5 expansion
• High-speed NVMe & SATA storage
• Internal 500W Flex power supply

Built for space-efficient edge AI deployments with Intel® Core™ processors, low-profile GPU support, and rich industrial I/O connectivity.

• Powered by Intel® Core™ 65W processors
• PCIe Gen 4 & Gen 5 Expansion
• Low-profile GPU Support
• Rich Industrial I/O Connectivity
• Internal 250W Flex Power Supply

Built for rugged edge AI deployments with high-performance Intel® Core™ processing, FHFL dual-GPU support, and fanless computing node design.

• Intel® Core™ 35W/65W processors
• FHFL dual-GPU support
• 600W GPU power budget
• Rugged fanless computing node design

Compact, fanless din-rail industrial computer designed for demanding IoT environments.

• X86 Intel Atom Embedded Processor
• Ultra-rugged fanless with DIN-RAIL Mount
• Up to 4x RJ45 LAN with OOB module

優化設計，整合並簡化智慧交通部署，實現物聯網連接和鐵路合規性。

• 第十代IntelCore/Xeon處理器
• 最多可連接 16 個物聯網設備
• 2 個可熱插拔 SSD 硬碟位
• 符合 EN50155 標準的 EMC 認證和 E-Mark 認證
• 9-48VDC 或 48-110VDC 電源輸入範圍

具備先進 CPU、I/O 配置和 AI 加速功能的防水邊緣電腦。

• 採用 x86 IntelAtom/Celeron嵌入式系列處理器
• IP68/IP69K 全系統防護
• 加固型 M12 I/O 配置

Instantaneous power backup with rapid charge and discharge

• 3 configurable smart modes for safe shutdown
• Remote GUI and LCM Display module for customizable settings
• 8x or 16x supercapacitor models
• UL-Listed

Panel PC for Washdown Computing in Hygienic Enivironments

• IP 66/69K Rated
• M12 I/O Connectivity
• Optical Bonding for clarity and longevity
• Automatic Pressure Valve
• Enhanced Stainless Steel Durability and 7H Hardness Touchglass

Interactive, Modular, and Robust Solution for Human Machine Interface (HMI) Deployments

• IP 65 Rated
• 12" to 24" Inch Scalable Display Sizes
• Automation-Ready Connectivity
• Efficient Computing Performance

Compact, Durable, and Simple Solution for Human Machine Interface (HMI) Deployments

• IP65 Front & IP54 Back Rated
• 10.1” to 21.5” Display Sizes
• Versatile I/O Connectivity
• Power Efficient Computing Performance

Interactive, Versatile, and Durable Open Frame Solution for Human Machine Interface (HMI) Deployments

• IP65 Front Rated
• 10.1” to 21.5” Display Sizes
• Open Frame Industrial Design
• Customizable Versatile I/O Connectivity

Industrial Alternative to Elo Open-Frame Touchscreens

• IP65 Front Panel with 7H Glass
• 10-Points PCAP
• 89° Wide Viewing Angles
• World-Class Certified

• Zero-bezel true flat surface
• Slim design
• Easy integration and low maintenance
• Projected Capacitive touch
• Anti-glare cover glass

Deploy on-prem LLM and generative AI workloads for real-time inferencing and decision-making capabilities.

• 13th Gen Intel Core Processor
• Dedicated GPU Acceleration
• Operational Redundancy
• Short-Depth, 1U Form Factor

Optimized for scalable multimodal AI with GPU-accelerated compute, low-latency inference, and enterprise-ready edge deployment.

• AMD Ryzen™ & EPYC Processors (B650 Chipset)
• 2x Broadcom 10GbE SFP+
• Support 2x PCIe x16 Gen 5 slots
• 850W Single Power Supply
• Out-of-Band Management

Built for high-performance agentic AI with GPU-dense acceleration and FLFH support for scalable training, inference, and enterprise AI workloads.

• AMD Ryzen™ & EPYC Processors (B650 Chipset)
• 2x Broadcom 10GbE SFP+
• Support Full-Length Full-Height GPUs
• 850W Single Power Supply
• Out-of-Band Management