Robuste Computing-Lösungen für Edge und Cloud

Robuste, lüfterlose KI-Edge-Computer mit NVIDIA Jetson AGX Orin-Modul (bis zu 275 TOPS)

• Modulare EDGEBoost-I/O-Unterstützung (M12/RJ45, USB, 10GbE, PoE)
• 8x USB 3.0 Vision-Anschlüsse mit Verriegelung
• 2x Mini-Fakra-Anschlüsse für 8x GMSL-Kameras
• Unterstützung für Out-of-Band-Fernverwaltung (optional)

Robuste, lüfterlose KI-Edge-Computer mit NVIDIA Jetson NX & Nano (bis zu 100 TOPS)

• Unterstützt bis zu 4 PoE-Kameras
• Mehrere DIO-Ports mit 8x/16x DIO
• Out-of-Band-Modul für die Fernverwaltung

Ausgestattet mit NVIDIA Jetson Orin Nano/NX-Modulen (bis zu 157 TOPS)

• Ultrakompakte Bauform
• 3 skalierbare Modelle mit unterschiedlichen I/O-Konfigurationen
• Unterstützung der OOB-Fernverwaltung
• Unterstützt 4 GMSL-Kameras

Halbrobuster Industrie-GPU-Computer für allgemeine industrielle Rechenaufgaben

• Ausgestattet mit x86 Intel Core Embedded Series Prozessoren (35W TDP)
• Schlankes, flaches und kurzes Gehäuse
• GPU-Integration
• Edge-KI-fähig
• Drahtlose Konnektivität für IIoT

Hohe Leistung in einem kleinen Formfaktor zur Optimierung allgemeiner industrieller Rechenlasten.

• Ausgestattet mit x86 Intel Core Embedded Series Prozessoren (35W TDP)
• Umfangreiche, vielseitige Ein-/Ausgänge
• M.2-Erweiterung
• Edge-KI-fähig
• Drahtlose Konnektivität für IIoT

Halb-robuste NUC-Alternative für industrielle Rechenlasten

• Angetrieben von einem x86 Intel Alder Lake N-Prozessor
• Kompakte Größe für Anwendungen mit begrenztem Platzangebot
• Alternative zur industriellen NUC
• Drahtlose Konnektivität für IIoT

Semi-rugged NUC alternative for space limited applications

• Powered by Intel Core Ultra Series 1 Processors
• 11 TOPS of AI performance
• Industrial NUC alternative
• Wireless & Cellular Connectivity for IIoT

Semi-rugged NUC alternative for space limited applications

• Powered by x86 Intel Alder Lake N Series Processor
• Mini form factor for space constrained deployments
• Industrial NUC alternative
• Wireless Connectivity for IIoT

Semi-rugged NUC alternative for space limited applications

• Powered by Rockchip RK3568J Processor
• Mini Form Factor for Space Constrained Deployments
• Rich IIoT Connectivity
• Robust Wireless & Cellular Connectivity

Built for high-performance edge AI workloads with Intel® Core™ Ultra Series 2 processing, integrated NPU acceleration, and next-generation PCIe expansion.

• Intel® Core™ Ultra Series 2, Arrow Lake-S, W880 PCH
• Integrated NPU acceleration
• 2x DDR5 5600MT/s, 96GB Max
• FHFL GPU expansion support
• 24–48V DC input with 600W GPU power budget

Built for advanced edge computing workloads with full-height GPU support, PCIe expandability, and flexible storage support.

• Powered by Intel® Core™ 65W processors
• Full-height GPU support
• PCIe Gen 4 & Gen 5 expansion
• High-speed NVMe & SATA storage
• Internal 500W Flex power supply

Built for space-efficient edge AI deployments with Intel® Core™ processors, low-profile GPU support, and rich industrial I/O connectivity.

• Powered by Intel® Core™ 65W processors
• PCIe Gen 4 & Gen 5 Expansion
• Low-profile GPU Support
• Rich Industrial I/O Connectivity
• Internal 250W Flex Power Supply

Built for rugged edge AI deployments with high-performance Intel® Core™ processing, FHFL dual-GPU support, and fanless computing node design.

• Intel® Core™ 35W/65W processors
• FHFL dual-GPU support
• 600W GPU power budget
• Rugged fanless computing node design

Compact, fanless din-rail industrial computer designed for demanding IoT environments.

• X86 Intel Atom Embedded Processor
• Ultra-rugged fanless with DIN-RAIL Mount
• Up to 4x RJ45 LAN with OOB module

Optimiert zur Konsolidierung und Vereinfachung des Einsatzes intelligenter Transportsysteme mit IoT-Konnektivität und Bahnkonformität.

• Intel Core/XEON Prozessor der 10. Generation
• bis zu 16 IoT-Geräte
• 2x Hot-Swap-fähige SSD-Einschübe
• EMV-Konformität mit EN50155 & E-Prüfzeichen
• Eingangsspannungsbereich: 9–48 V DC oder 48–110 V DC

Wasserdichte Edge-Computer mit fortschrittlicher CPU, I/O-Konfigurationen und KI-Beschleunigung.

• Angetrieben von x86 Intel Atom/Celeron Embedded Series Prozessoren
• Vollständiger Systemschutz nach IP68/IP69K
• Robuste M12 I/O-Konfigurationen

Instantaneous power backup with rapid charge and discharge

• 3 configurable smart modes for safe shutdown
• Remote GUI and LCM Display module for customizable settings
• 8x or 16x supercapacitor models
• UL-Listed

Panel PC for Washdown Computing in Hygienic Enivironments

• IP 66/69K Rated
• M12 I/O Connectivity
• Optical Bonding for clarity and longevity
• Automatic Pressure Valve
• Enhanced Stainless Steel Durability and 7H Hardness Touchglass

Interactive, Modular, and Robust Solution for Human Machine Interface (HMI) Deployments

• IP 65 Rated
• 12" to 24" Inch Scalable Display Sizes
• Automation-Ready Connectivity
• Efficient Computing Performance

Compact, Durable, and Simple Solution for Human Machine Interface (HMI) Deployments

• IP65 Front & IP54 Back Rated
• 10.1” to 21.5” Display Sizes
• Versatile I/O Connectivity
• Power Efficient Computing Performance

Interactive, Versatile, and Durable Open Frame Solution for Human Machine Interface (HMI) Deployments

• IP65 Front Rated
• 10.1” to 21.5” Display Sizes
• Open Frame Industrial Design
• Customizable Versatile I/O Connectivity

Industrial Alternative to Elo Open-Frame Touchscreens

• IP65 Front Panel with 7H Glass
• 10-Points PCAP
• 89° Wide Viewing Angles
• World-Class Certified

• Zero-bezel true flat surface
• Slim design
• Easy integration and low maintenance
• Projected Capacitive touch
• Anti-glare cover glass

Deploy on-prem LLM and generative AI workloads for real-time inferencing and decision-making capabilities.

• 13th Gen Intel Core Processor
• Dedicated GPU Acceleration
• Operational Redundancy
• Short-Depth, 1U Form Factor

Optimized for scalable multimodal AI with GPU-accelerated compute, low-latency inference, and enterprise-ready edge deployment.

• AMD Ryzen™ & EPYC Processors (B650 Chipset)
• 2x Broadcom 10GbE SFP+
• Support 2x PCIe x16 Gen 5 slots
• 850W Single Power Supply
• Out-of-Band Management

Built for high-performance agentic AI with GPU-dense acceleration and FLFH support for scalable training, inference, and enterprise AI workloads.

• AMD Ryzen™ & EPYC Processors (B650 Chipset)
• 2x Broadcom 10GbE SFP+
• Support Full-Length Full-Height GPUs
• 850W Single Power Supply
• Out-of-Band Management