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JCO-6000-ORN-B_4EBIO Hochleistungsfähiger KI-Edge-Computer mit NVIDIA Jetson AGX Orin™, 4x EDGEBoost I/O-Unterstützung

SKU Alias: JCO-6000-ORN-B

• 8-Kern-/12-Kern-Arm® Cortex®-A78AE v8.2 64-Bit-CPU
• LPDDR5 3200 MHz auf dem SOM. 32 GB/64 GB
• 1x HDMI, 3840 x 2160 @ 60 Hz
• 1x GbE, 1x 10 GbE (Wake-on-LAN und PXE)
• 2x externer SIM-Kartensteckplatz, 1x Micro-SD-Steckplatz
• 1x eMMC 5.1 Speicher, 64 GB
• 1x M.2 (M-Key, 2280, PCIe x4, NVMe-Unterstützung)
• 1x USB 3.2 Gen 2, 1x USB Typ-C, 1x USB 2.0
• 8x DI + 8x DO mit Isolation
• Weitbereichs-Stromversorgung von 9 bis 48 V DC, unterstützt AT/ATX-Modus
• Breiter Betriebstemperaturbereich von -20 °C bis 55 °C (60 W CPU)
• Unterstützt GMSL 2 QUAD Port Mini Fakra, 8x Ports 1280x720 @30FPS (optional)
• Unterstützung für bis zu 4x EDGEBoost I/O

Modell:

JCO-6000-ORN-B_4EBIO

Zertifizierungen:

NVIDIA Jetson

Spezifikationen

System
Processor • 64 GB, 12-core Arm® Cortex®-A78AE v8.2 64-bit CPU (60W/275 TOPS)
• 32 GB, 8-core Arm® Cortex®-A78AE v8.2 64-bit CPU (40W/200 TOPS)
LAN Chipset GbE1: Marvell 88e1512 (right)
10 GbE2: Marvell AQC113(left)
System Memory AGX Orin 32 GB/64 GB LPDDR5 @ 3200 MHz on SOM
TPM TPM 2.0
Display
HDMI 1x HDMI, 3840 x 2160 @ 60Hz
Storage
eMMC 1x eMMC 5.1, 64 GB
M.2 1x M.2 (M-Key, 2280, PCIe x4, Support NVMe) (Default 128GB)
SD 1x Micro SD Socket
SIM Socket 2x Micro SIM Socket (M.2 B-Key attached)
Expansion
M.2 1x M.2 (B-Key, 3042/3052, USB 3.2 Gen 2, Support 4G/5G Module)
1x M.2 (E-Key, 2230, PCIe x1, USB 2.0, Support Wi-Fi/Bluetooth)
Expansion Modules Support EDGEBoost I/O Modules:
• 4x GbE module with Intel® I350 Chipset, RJ45/M12 connector (PoE optional)
• 2x RJ45 10GbE with Intel X710 Chipset
• 4x USB 3.0 Locking Type with 2x screw hole
• 4x USB 3.0 (share PCIe Gen2 x1 bandwidth)
• 1x M.2 M-Key, PCIe x4 Lane, 2242/2260 for NVMe Storage
*The left EBIO Bracket on the front panel don't support PoE Module
I/O
CAN 2x CAN (Optional, internal)
COM 2x RS-232/422/485 (Optional, internal)
DIO 8 in / 8 out (Isolated)
EDGEBoost I/O Bracket 4x EDGEBoost I/O Bracket (3x Front Panel, 1x Back Panel)
GMSL Camera GMSL 2 Camera Support by 2x Quad Port Mini Fakra, supporting 8x 1280x720 @ 30 FPS (Optional)
LAN 2x RJ45
OOB 1x RJ45 (OOB Management Module, Optional, Occupied 1x EBIO Bracket and 1x COM & 1x USB Type-C Console Port)
PoE By Optional PoE Power Module, Support up to three 4x RJ45/M12 LAN Module
USB 1x USB 3.2 Gen 2
1x USB 2.0 (Flash)
1x USB Type-C (Console)
LED LED 1 : System Status (Blue)
LED 2 : Programmable LED (Blue)
LED 3 : Programmable LED (Blue)
LED 4 : Programmable LED (Blue)
LED 5 : Programmable LED (Blue)
LED 6 : Programmable LED (Red)
Others 6x Antenna Holes
1x Power Switch, 1x Reset Switch, 1x Force Recovery Switch
1x AT/ATX Switch, 1x Remote Power On/Off
1x PC/CAR Mode Switch
Operating System
Linux Linux Ubuntu 22.04 with JetPack 6.2
Power
Power Adapter Optional AC/DC 24V/5A, 120W
Optional AC/DC 24V/9.2A, 220W
Optional AC/DC 24V/11.67V, 280W
Power Mode AT, ATX
Power Ignition Sensing Adjustable Power Ignition Management
Power Supply Voltage DC IN 9~48V
DC IN 48~110V (Optional, via 1x EBIO Bracket)
Power Connector 3-pin Terminal Block
Power Protection OVP (Over Voltage Protection)
OCP (Over Current Protection)
Reverse Protection
Environment
Operating Temperature -20°C to 55°C with 0.6 m/s airflow
(MaxN 60W TDP mode, non-throttling)
Storage Temperature -40°C to 85°C
Relative Humidity 10% to 95% (non-condensing)
Certification EMI:
   • CE
   • FCC Class A (47 CFR part 15.109 and part 15.107)
   • ICES-003
   • UKCA
EMC Compliance:
   • Railway EMC: EN 50155: 2017, EN 50121-1: 2017,
      EN 50121-3-2: 2016
   • Industrial EMC: EN 61000-4-2: 2009, EN IEC 61000-4-3:
      2020, EN 61000-4-4: 2012, EN 61000-4-5: 2014 +A1: 2017,
      EN 61000-4-6: 2014
   • E-Mark (E24)
Safety:
   • UL Safety: UL 62368-1, 3rd Ed., (cULus)
   • Test procedure: CB Scheme
   • Standard: IEC 62368-1:2018
Green Product:
   • RoHS 3.0 (Directive 2015/863/EU)
   • REACH
Vibration IEC60068-2-64:2008
With SSD: 5 Grms (5 - 500 Hz, 0.5 hr/axis)
Designed to comply with MIL-STD-810H Method 514.8 Procedure I
Shock IEC60068-2-27:2008
With SSD: 50G half-sin 11ms
Designed to comply with MIL-STD-810H Method 516.8 Procedure I
Package Drop Test: ISTA 2A
Physical
Dimensions 270 (W) x 190 (D) x 95 (H) mm
Weights 6~7 kg
Construction Extruded Aluminum with Heavy Duty Metal
Mounting Options Wall Mounting

Mechanisches Layout

EDGEBoost I/O & Expansion

Abmessungen

Einheit:mm